Multiple Award PCB Fab and Assembly BPAs 2026-2030
Closed Solicitation Posted
- Solicitation number
- HQ072725QRT04
- Agency
- Defense Microelectronics Activity Department of Defense
- Responses due
- Set-aside
- Total Small Business
Opportunity facts
- NAICS code
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Place of performance
- United States
- Points of contact
-
- Ryan C Tung ryan.c.tung.civ@mail.mil (916) 940-4934
Notice details come from SAM.gov. Updated .
About this opportunity
The Defense Microelectronics Activity (DMEA) is seeking to establish multiple Blanket Purchase Agreements (BPAs) with qualified vendors for Printed Circuit Board (PCB) Fabrication and Assembly services to support Department of Defense programs addressing obsolescence issues and satellite communications solutions. The procurement covers three primary objectives: rapidly producing developmental PCB Assemblies (PCBAs) for initial design use, quickly producing prototype PCBAs for design validation, and manufacturing high-quality PCBAs for operational DOD environments. Offerors must demonstrate in-house capabilities in PCB fabrication, assembly processes, quality control to IPC-A-600 Class 3 standards, component procurement from authorized distributors, and optional ITAR and Trusted Requirements capabilities. Evaluation will be conducted in two phases, assessing technical capability, past performance relevance and confidence levels, and pricing approach on an acceptable/unacceptable basis. The Phase I proposal deadline is 12:00 PM Pacific on Monday, December 15, 2025, to be submitted via email to Contract Specialist Ryan Tung at ryan.c.tung.civ@mail.mil; proposals are limited to 14 pages total and must include technical, past performance, and pricing volumes.
This solicitation is designated as a 100% Total Small Business set-aside under NAICS code 334418 (Printed Circuit Assembly Manufacturing). DMEA intends to award up to six BPA agreements to qualified vendors, with each BPA holder receiving a maximum ordering ceiling of $7.5 million divided by the number of qualified awardees, with individual orders typically not exceeding $1,250,000 and a minimum order threshold of $10,000. The government anticipates fulfilling partial orders for approximately 60 GrimWing units and 60 DireWing units using these BPAs, with the ordering period extending through August 31, 2030. Selected contractors must initiate services within 15 calendar days of receiving valid orders and submit quotes within 5 days of DMEA requests, with quotes remaining valid for 14 calendar days. Performance will take place in the United States, with contractors required to maintain specified quality yield standards and submit technical reports on electrical tests, impedance testing, and fabrication/assembly inspections at least 10 days prior to each performance period's conclusion.
Notice text
4 versions
Update #4 · Latest ·
Re-solicitation of HQ072725QRT04
DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.
DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs.
Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal
instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 12:00pm (Pacific), Monday, 15 December 2025.
Update #3 ·
Re-attached PWS document that did not load previously. Extended due date to Monday 18 Aug 2025.
DMEA's mission includes developing electronics solutions that solve DOD
obsolescence issues and/or provides state of the art SatCom solutions to
DOD Programs. As such, there is a need to (1) rapidly produce
developmental Printed Circuit Board Assemblies (PCBAs) for initial design
and development use, (2) quickly produce prototype PCBAs for design
validation, and (3) manufacture high quality PCBAs for use in DOD
operational environments.
DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors,
in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of
qualified BPA holders in order to rapidly obtain electronics products from
industry and commercial PCB Fabrication and/or Assembly companies;
specifically those produced by PCB Fabrication and PCB Assembly
processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)
No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.
Interested and capable PCB fabrication and/or PCB assembly vendors are
highly encouraged to provide a proposal as instructed herein. Please see
attached combined solicitation/synopsis, PWS for BPA scope, proposal
instructions and evaluation criteria, and DRAFT BPA Agreement language.
Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.
Update #2 ·
Re-attached PWS document that did not load previously.
DMEA's mission includes developing electronics solutions that solve DOD
obsolescence issues and/or provides state of the art SatCom solutions to
DOD Programs. As such, there is a need to (1) rapidly produce
developmental Printed Circuit Board Assemblies (PCBAs) for initial design
and development use, (2) quickly produce prototype PCBAs for design
validation, and (3) manufacture high quality PCBAs for use in DOD
operational environments.
DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors,
in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of
qualified BPA holders in order to rapidly obtain electronics products from
industry and commercial PCB Fabrication and/or Assembly companies;
specifically those produced by PCB Fabrication and PCB Assembly
processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)
No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.
Interested and capable PCB fabrication and/or PCB assembly vendors are
highly encouraged to provide a proposal as instructed herein. Please see
attached combined solicitation/synopsis, PWS for BPA scope, proposal
instructions and evaluation criteria, and DRAFT BPA Agreement language.
Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.
Update #1 ·
DMEA's mission includes developing electronics solutions that solve DOD
obsolescence issues and/or provides state of the art SatCom solutions to
DOD Programs. As such, there is a need to (1) rapidly produce
developmental Printed Circuit Board Assemblies (PCBAs) for initial design
and development use, (2) quickly produce prototype PCBAs for design
validation, and (3) manufacture high quality PCBAs for use in DOD
operational environments.
DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors,
in accordance with FAR 13.106-1(a)(2)(iv). The purpose of this solicitation to is to competitively establish a pool of
qualified BPA holders in order to rapidly obtain electronics products from
industry and commercial PCB Fabrication and/or Assembly companies;
specifically those produced by PCB Fabrication and PCB Assembly
processes. Maximum ordering ceiling for each BPA holder is ($7.5million / divided by # of qualified offeror.)
No individual PCB orders will be awarded at this time, this Combined Synopsis/Solicitation is to competitively establish BPA agreeements with qualified vendors.
Interested and capable PCB fabrication and/or PCB assembly vendors are
highly encouraged to provide a proposal as instructed herein. Please see
attached combined solicitation/synopsis, PWS for BPA scope, proposal
instructions and evaluation criteria, and DRAFT BPA Agreement language.
Proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Friday, 15 August 2025.
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