Combined Synopsis and Solicitation PWS 25-5E3 PCB Fab and Assembly BPA v2.pdf
PDF 3 MB Posted
- Solicitation number
- HQ072725QRT04
- Issued by
-
Defense Microelectronics Activity
About this file
This document is a Request for Proposal (RFP) from the Defense Microelectronics Activity (DMEA) for Printed Circuit Board (PCB) Fabrication and Assembly Blanket Purchase Agreements (BPA). The solicitation is a 100% small business set-aside issued under FAR Part 13 Simplified Acquisition Procedures, seeking to establish a pool of multiple BPA agreements with qualifying offerors. Selected vendors will receive opportunities throughout the BPA ordering period to submit quotes for PCBs, which will be defined by individual Statements of Work and corresponding technical data packages.
Proposals are due by 2:00 pm Pacific on Monday, 18 August 2025, and must be submitted via email to the Contract Specialist, Ryan Tung. The solicitation includes three key attachments: 1) PWS 25-5E3 Scope of PCB Requirements dated 12 May 2025, 2) Draft BPA Agreement for PCB Fabrication and Assembly, and 3) Proposal Instructions and Evaluation Criteria. DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, with vendors potentially providing work that may include notes, designs, bill of materials, and potentially Government Furnished Material (components).
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FROM:
DEFENSE MICROELECTRONICS ACTIVITY
4234 54TH STREET
MCCLELLAN, CALIFORNIA 95652-2100d
DMEA/MEC -Contracting Defense Microelectronics Activity Attn: Ryan Tung 4234 54th Street McClellan, CA 95652
15 Aug 2025
SUBJECT: Request for Proposal, PWS 25-5E3, Printed Circuit Board (PCB) Fabrication and Assembly Blanket Purchase Agreements (BPA)
1. This is a combined synopsis/solicitation for commercial items (IA W FAR 12.603) for proposals to establish a pool of BP As with offerors for a scope ofrequirements as described PWS 25- 5E3, dated 12 May 2025. Selected offerors will be given opportunities throughout the ordering period of the BP A to submit quotes for PCBs as defined by individual Statements of Work and corresponding technical data packages (e.g. notes, designs, bill of materials, and potentially Government Furnished Material (GFM) (components), etc.). DMEA intends to competitively issue multiple BPA agreements to all qualifying offerors, in accordance with FAR 13.106-l(a)(2)(iv).
2. This acquisition is a 100% small business set-aside, and is issued in accordance with FAR Part 13 Simplified
Acquisition Procedures.
3. Please see the Proposal Instructions and Evaluation Criteria attachment for pricing instructions.
4. All terms, conditions, solicitation provisions, and contract clauses listed in this Combined Synopsis/Solicitation Form are applicable to this solicitation and will be incorporated into any resulting contract. Solicitation provisions and contract clauses are those in effect through Federal Acquisition Circular 2024-04, effective 11 June 2025. FAR and DFARS provisions and clauses are applicable as outlined below. The full text ofa provision or clause may be accessed electronically at https://www.acquisition.gov/.
5. Proposals are due to the Contract Specialist, Ryan Tung, via e-mail to ryan.c.tung.civ@mail.mil, no later than 2:00pm (Pacific), Monday 18 August 2025.
6. The DMEA Contract Specialist is the only point of contact for this acquisition. Please address any questions, concerns, clarification, comment, or other additional information, or to submit your technical and (if designed) past performance proposal and or work-able copies of any of the attachments, contact the Contract Specialist, Ryan Tung at ryan.c.tung.civ@mail.mil.
CC: steven.b.nelson25.civ@mail.mil christopher.s.1aney3.civ@mail.mil ivan.z.alcantar.civ@mail.mil
Attachments:
TUNG.RYAN.CHIH
SHUN.1257178397
Olgltalfyslgnedby
TU�.RYAN.CHIHSHUN.1257178397
ON: c-US, o-U.$. Government, ou•DoD, oo•PKl,oo•OSO, cn�TUNG.RYAN.CHIHSHUN.1257178397
Date:202 5.08. 1 53:52:18-07'00'
Ryan Tung Contract Specialist
1. PWS 25-5E3, Scope of PCB requirements, dated 12 May 2025 (6 pages)
2. Draft BPA Agreement - PCB Fab and Assembly (4 pages)
3. Proposal Instructions and Evaluation Criteria, PWS 25-5E3 (5 pages)
File details come from the government source that posted it. Updated .