PWS 25-5E3 - Scope of PCB requirements_Redacted.pdf

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Attached to
Multiple Award PCB Fab and Assembly BPAs 2026-2030 Federal contract opportunity
Solicitation number
HQ072725QRT04
Issued by
Defense Microelectronics Activity

About this file

This Performance Work Statement (PWS) outlines requirements for Printed Circuit Board (PCB) Fabrication and Assembly services for the Defense Microelectronics Activity (DMEA). The document specifies detailed technical requirements for producing Printed Circuit Board Assemblies (PCBAs) across three key objectives: (1) developing initial design PCBAs, (2) creating prototype PCBAs for design validation, and (3) manufacturing high-quality PCBAs for Department of Defense operational environments.

Key technical requirements include fabricating PCBs to IPC-A-600 Class 3 standards, using authorized electronic component distributors, providing technical reports on electrical tests and inspections, and using Tin-Lead solder in assembly processes. Contractors must have in-house capabilities for PCB Fabrication, Assembly, or both, and can sub-contract with DMEA's prior approval. The PWS mandates specific reporting requirements, including technical reports on electrical tests, impedance tests, and fabrication/assembly inspections, all to be submitted 10 days prior to the end of the performance period with Distribution Statement B authorization.

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Text version

3.1.1 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs in accordance with fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication specifications.

3.1.1.1 The contractor shall fabricate PCBs in accordance with specified IPC-A-600 classification; if IPC Classification is not specified in the provided TDP, the contractor shall fabricate PCBs to IPC Class 3 requirements.

3.1.1.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, impedance matching test results, and/or results of Quality Control inspections.

3.1.1.3 Unless otherwise specified in the TDP, the contractor has control over panelization strategies, fiducial markings, and excess materials needed to account for production fall out.

3.1.1.4 If the contractor does not have internal PCB Fabrication capabilities, it is acceptable to sub-contract PCB Fabrication to another vendor. Any sub-contractors utilized shall be approved by DMEA in advance of the initiation of PCB fabrication activities. PCB procurement is payable upon contractor evidence of PO placement, evidence of receipt by contractor, and evidence of acceptable PCB performance (circuit continuity).

3.1.1.5 The contractor shall return all excess PCB materials to DMEA after completion of production activities.

3.1.2 COMPONENT PROCUREMENT REQUIREMENT: The contractor shall procure sufficient materials and components, as identified on the BOM, to enable the assembly of requested quantities of PCBAs/CCAs. Any components that will be consigned to the contractor by DMEA will be identified on the BOM.

3.1.2.1 The contractor shall review suitability of Government furnished materials (GFM) and components and request any additional information, materials, and/or components within 5 days of receipt of the GFM

3.1.2.2 The contractor shall only use authorized distributors or Original Equipment Manufacturers (OEMs) to source electronic components. Any alternative sources, like third party distributers or brokers, shall be approved by DMEA prior to components being procured.

3.1.2.3 The contractor shall rapidly execute component orders, to ensure supply chain disruptions can be immediately accounted for and lead times can be minimized. The contractor shall provide evidence of orders being placed and received. For component and material orders that are excessively costly, partial payments and/or early payments can be negotiated prior to award of the order, upon contractor request. Component procurement is payable upon contractor evidence of PO placement and evidence of receipt by contractor; project inventory shall be transferred to Govt if not used.

3.1.2.4 The contractor shall identify suitable alternates to components that are not immediately available, or that have prohibitively long lead times. Any alternate components shall be approved by DMEA subject matter experts (SMEs: the PE or COR as identified on the SOW) prior to procurement of the components.

3.1.2.4.1 Note: DMEA may request some additional spares of critical components be procured, to support rework due to post-production test and validation activities; these spares will be identified in the TDP and BOM, when applicable.

3.1.2.5 Unless quantities of components are deliberately specified or limited in the TDP or BOM, the contractor has control over quantities of sufficient spares needed to accommodate losses possible in their PCB Assembly processes.

Any alternate components shall be approved by DMEA SMEs prior to procurement of the components.

3.1.2.6 The contractor shall return all excess materials and components to DMEA after completion of production activities, unless an agreement exists to maintain to inventory in contractor inventory in anticipation of follow-on orders.

3.1.3 PCB ASSEMBLY REQUIREMENT: The contractor shall assemble requested quantities of PCBAs (also referred to as Circuit Card Assemblies (CCAs)) in accordance with layout specifications and assembly requirement documents for solder selection, component placement, bill of materials, stencil design, and any other pertinent assembly specifications.

3.1.3.1 The contractor shall assemble PCBAs in accordance with specified J-STD-001 and IPC-A-610 classification;

if IPC Classification is not specified in the provided TDP, the contract shall assemble PCBAs to IPC Class 2 requirements.

3.1.3.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, and/or results of Quality Control inspections performed in accordance with specified IPC-A-610 inspections.

3.1.3.3 Unless otherwise specified in the TDP, the contractor shall use Tin-Lead (Sn-Pb) solder in all applicable assembly process.

3.1.3.3.1 Note: Some components may be fabricated with Lead-free solder. Unless specified in the TDP, these components shall not be reballed. Hybrid soldering processes are acceptable in the attachment of these components.

3.1.3.4 If the contractor does not have PCB Assembly capabilities, it is acceptable to sub-contract PCB Assembly to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of fabrication/production activities.

3.1.3.5 The contractor shall return all excess materials utilized in PCB Assembly process to DMEA after completion of production activities, including setup units and units that are not functional after assembly. Setup and failed units shall be clearly marked and segregated from the production units.

4.0 DATA ITEMS: The following CDRLs will likely apply to resultant orders and shall be submitted as described below. Provided for context. Indicate on the cover of all delivered data the BPA number, BPA order number, SOW number, SOW title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A001

2. Title Technical Report - PCB Electrical Tests

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable.

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement:

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

1. Sequence Number A002

2. Title Technical Report – Impedance Test

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

1. Sequence Number A003

2. Title Technical Report – Fabrication and Assembly Inspections

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

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