Multichip Module Package for SiC Pressure Sensors

NASA's Shared Services Center seeks a Multichip Module Package for SiC Pressure Sensors under sole source authority, with capabilities and qualifications due June 30 at 7:00 a.m. Central Time. The procurement is designated sole source to Sienna Technologies, Inc., foreclosing competitive bidding.

Place of performance is Cleveland, OH 44135 (NASA Glenn Research Center, 21000 Brookpark Road, Mail Stop 77-2). The effort requires fabrication of a specialized multi-chip module incorporating Government-furnished silicon carbide sensors onto a custom aluminum nitride circuit board with coefficient of thermal expansion not exceeding 4 ppm/C. Work includes precision installation and gold attachment of Au-plated nickel pins into blind holes and fabrication of a hermetically brazed AlN receptacle bonded to a Kovar tube capable of withstanding temperatures up to 700°C. Deliverables comprise the populated AlN circuit board and the hermetically sealed AlN receptacle assembly, both delivered on or before December 31, 2026. Technical data is export-controlled under the Arms Export Control Act and the Export Control Reform Act of 2018. The NAICS code is 334419, Other Electronic Component Manufacturing; PSC is 6695, Combination and Miscellaneous Instruments. NASA justifies sole source award on Sienna Technologies' prior fabrication of the identical MCM configuration and exclusive possession of specialized manufacturing processes, tooling, and technical expertise required for compatibility with NASA's existing sensor design and testing program. The Government states that awarding to an alternative vendor would necessitate extensive engineering evaluations, prototype fabrication, testing, and validation activities that would materially delay the project and increase costs. The procurement will be conducted under FAR Part 12 commercial items procedures.