SATPC0041552 Tab 06 RDSS..pdf

This is a Recommendation and Determination to Solicit from One Source or Brand Name document from NASA's Shared Services Center for a sole source procurement.

NASA Glenn Research Center seeks to procure a Multichip Module Package for SiC Pressure Sensors exclusively from Sienna Technologies, Inc. The procurement targets the fabrication of a specialized Multi-Chip Module (MCM) package incorporating Government-furnished SiC sensors onto a custom aluminum nitride circuit board with a coefficient of thermal expansion exceeding 4 ppm/°C. The effort requires precision installation and gold attachment of Au-plated nickel pins into blind holes, fabrication of a hermetically brazed AlN receptacle to a Kovar tube capable of withstanding temperatures up to 700°C, and delivery of fully assembled components in accordance with Government drawings and export-controlled technical data. The estimated performance or lead-time for delivery is December 31, 2026.

The justification for sole source procurement emphasizes that Sienna Technologies previously fabricated the exact MCM configuration and possesses the specialized manufacturing processes, tooling, and technical expertise required for compatibility with NASA's existing sensor design and testing program. The document notes that awarding to an alternative vendor would necessitate extensive additional engineering evaluations, prototype fabrication, testing, and validation activities that would significantly delay the project schedule, increase program costs, and introduce technical and performance risks. The use of Sienna Technologies minimizes these risks and supports timely hardware delivery.