SATPC0041552 Tab 04 4 SOW..pdf
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- Attached to
- Multichip Module Package for SiC Pressure Sensors Federal contract opportunity
- Solicitation number
- 80NSSC26936730Q
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Summary: Proposed Modification of Statement of Work for Multi-Chip Packaging of Silicon Carbide Pressure/Temperature Sensors and Amplifier
This is a Statement of Work (SOW) modification for multi-chip module (MCM) packaging of silicon carbide integrated pressure and temperature sensors. The vendor is required to attach Silicon Carbide sensors to an aluminum nitride (AlN) circuit board and deliver both the populated circuit board and a hermetically sealed AlN receptacle. The circuit board must be fabricated from AlN material with a coefficient of thermal expansion not exceeding 4 ppm/°C to match the SiC sensors. Gold-plated nickel pins must be inserted into blind holes and securely attached to the circuit board. The AlN receptacle must be hermetically brazed to a Kovar tube and capable of withstanding temperatures up to 700°C.
Deliverables include the AlN circuit board populated with sensors and pins, and the hermetically brazed AlN receptacle assembly. Both items must be delivered to NASA Glenn Research Center, 21000 Brookpark Road, Mail Stop 77-2, Cleveland, OH 44149 on or before December 31, 2026. The document is marked as export-controlled and contains technical data restricted under the Arms Export Control Act and the Export Control Reform Act of 2018, with distribution authorized only to U.S. Government agencies and their contractors.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0041552 Tab 06 RDSS..pdf | ||
| SATPC0041552 Tab 07 Capability Statement.pdf |
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Text version
Proposed Modification of Statement of Work for Multi-Chip Packaging of Silicon Carbide
Pressure/Temperature Sensors and Amplifier
• Silicon Carbide (SiC) integrated pressure/temperature sensors will be provided to the vendor for attachment to the aluminum nitride (AlN) circuit board (see Fig. 1) in a Multi-Chip Module
(MCM) configuration.
• The circuit board shall be made of AlN with the coefficient of thermal expansion of not more than 4 ppm/C, closely matching to SiC.
• On the circuit board, Au-plated Nickel pins shall be inserted into the blind holes and securely Au attached.
• The AlN receptacle (Fig, 2) shall be hermetically brazed to Kovar tube and withstand temperature up to 700 C.
• The AlN circuit board (Fig. 1) with sensor and pins shall be delivered to customer.
• The hermetically brazed AlN receptacle shall be delivered to customer.
• Delivery to be on or before 12/31/26 to NASA Glenn Research Center, 21000 Brook park Road, Mail Stop 77-2, Cleveland OH 44149.
Fig. 2: Circuit Board. Fig. 1: Receptacle and body
Statement C: Distribution authorized to U.S. Government agencies and their contractors; Export Controlled; MAY 6, 2024. Other requests for this document shall be referred to NATIONAL AERONAUTICS AND SPACE ADMINISTRATION/TRANSFORMSTIONAL AERONAUTICS CONCEPTS PROGRAM/TRANSFORMATIONAL TOOLS AND
TECHNOLOGIES PROJECT
WARNING – This document contains technical data whose export is restricted by the Arms Export Control Act (Section 2751 of Title 22, U.S.C.) or the Export Control Reform Act of 2018 (Chapter 58 Sections 4801-4852 of Title 50, U.S.C). Violations of these export laws are subject to severe criminal penalties. Disseminate in accordance with provisions of DoD Directive 5230.25 and DoD Instruction 2040.02.
DESTRUCTION NOTICE - For classified documents, follow the procedures in DoD 5200.22-M, National Industrial Security Program Manual, Chapter 5, Section 7. For unclassified, limited documents, destroy by any method that will prevent disclosure of contents or reconstruction of the document.
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