NASA's Shared Services Center issued a purchase order to Sienna Technologies, Inc. for $60,000 on November 18, 2026 for multichip module packages for silicon carbide pressure sensors, with completion due the same date.
Work is performed in Mukilteo, Washington. The effort requires fabrication of a specialized multi-chip module incorporating government-furnished silicon carbide sensors onto a custom aluminum nitride circuit board, with precision installation and gold attachment of Au-plated nickel pins into blind holes and fabrication of a hermetically brazed aluminum nitride receptacle bonded to a Kovar tube capable of withstanding temperatures up to 700 degrees Celsius. Deliverables comprise the populated aluminum nitride circuit board and the hermetically sealed aluminum nitride receptacle assembly. The procurement was conducted under sole-source authority (FAR 13.106-1(b)(1)(i)) on the basis of Sienna's prior fabrication of the identical configuration and exclusive possession of specialized manufacturing processes and tooling required for compatibility with NASA's existing sensor design. Technical data is export-controlled under the Arms Export Control Act and the Export Control Reform Act of 2018.