KLA/SPTS SiC Trench etch tool

The Defense Microelectronics Activity seeks proposals for a silicon carbide trench etch tool with advanced etching capability for use in developing next-generation silicon carbide microelectronics. Proposals are due by September 4, 2023 in response to solicitation number HQ072723R0015. The tool must be capable of deep silicon carbide trench etching with high selectivity and anisotropy for trench depths of 5-10 microns. Proposers should have experience supplying semiconductor etch and deposition equipment to government and commercial microelectronics fabrication facilities. Award is expected to be made by October 2023 and will be a fixed-price contract issued to a single vendor.

There is no set-aside designated for this requirement. The NAICS code is 333298 and PSC code is J063. Performance will be at the Defense Microelectronics Activity facility in McClellan Park, California. The trench etch tool will support the development of silicon carbide technologies with applications across defense systems. Responses are sought from equipment suppliers with demonstrated experience meeting the technical requirements for next-generation silicon carbide device fabrication.