Redacted_RFP_HQ072723R0015.pdf

This solicitation requests proposals for a KLA/SPTS SiC trench etch tool. The Defense Microelectronics Activity is seeking proposals to acquire a silicon carbide trench etch tool for use in developing next-generation microelectronics. Proposals are due by July 27, 2023 in response to solicitation number HQ072723R0015. Award is expected to be made by October 2023. The tool must be capable of deep silicon carbide trench etching with high selectivity and anisotropy for trench depths of 5-10 microns. Interested parties should have experience supplying semiconductor etch and deposition equipment to government and commercial microelectronics fabrication facilities.