WP4A_TlBr_IP_Pix_updated_8Mar2023_230308_1113.pdf

Spectra

1 White Paper_4A: Intellectual Property (IP) for Pixelated TlBr Array

CDM

8Feb23 Update of Version 211206

(See White Paper_4B for Intellectual Property (IP) for the CFG Version)

Note: This White Paper was written by RMD with the assistance of H3D.

Thallium Bromide Radionuclide Isotope Identification Device Project CWMD Contract No. 70RWMD22C00000023 White Paper on Intellectual Property (IP) and Licensing Considerations

1.1 Overview of Pixelated Array Development

The pixelated RIID prototype and the high-end CDM (Core Detector Module) within the RIID each consist of a few components. The CDM provides the spectra. The RIID prototype will require additional software above and beyond the CDM for analyzing the gamma-ray spectra to identify the isotope. The following simplified block diagram summarizes the major components of the CDM:

Figure 1. Basic components of the Pixelated Full-Up version of the Core Detector Module (CDM), where ASIC is an application-specific integrated circuit, ADC is an analog-to-digital converter, FPGA is a field-programmable gate array, and SBC is a single-board computer.

The TlBr array module (see the unit on the left-hand-most side in Fig. 1) consists of a pixelated TlBr sensor packaged for acceptance testing. This packaging includes printed circuit boards for making electrical connections and a housing for handling the module. This white paper summarizes the IP claims and potential licensing negotiations required for the components listed in Figure 1.

1.2 TlBr Array Module

The growth of TlBr in general has been widely published in the literature. However, RMD (Radiation Monitoring Devices, Inc.) claims intellectual property for various aspects concerning RMD’s method of growth of the TlBr crystal (including purification and doping), which are treated as trade secrets, as well as issues such as electrically contacting the TlBr material.

The following list shows IP claims of RMD and Lawrence Livermore National Laboratories that are protected with patents:

Awarded: L. Voss, A. Conway, R. Graff, A. Nelson, R. Nikolic, S. Payne, E. Swanberg, “Selective surface treatment of thallium bromide (TlBr)-based detectors to improve longevity and/or restore operational capacity thereof”, Patent No. 10,020,235, July 10, 2018. The patent protects the treatment of the surface of TlBr to improve longevity.

Awarded: K.S. Shah, A. Gueorguiev, L. Cirignano, H. Kim, and A. Karger, “Radiation Detectors”, Patent Number No. 9,490,374, Nov 8, 2016. The patent protects the use of ionic semiconductor materials, such as TlBr, with electrical contacts using numerous materials as radiation detectors.

Awarded: A. Conway, P. Beck, R. Graff, A. Nelson, R. Nikolic, S. Payne, L. Voss, and H. Kim, “Mixed ionic-electronic-conductor based radiation detectors and methods of fabrication,” Patent No.

9,000,384, B2 April 7, 2015. The patent protects the method for fabricating TlBr-based detectors to mitigate polarization to improve longevity.

Pending: K.S. Shah, L. Cirignano, H. Kim, A. Churilov, A. Gueorguiev, A. Karger, “Doped Semiconductor-Based Radiation Detectors,” Application Number 14/637,434, Filed 03/04/2015.

This patent protects the use of co-dopants to improve the room-temperature operation and stability of TlBr detectors.

RMD provides access to its material IP either by selling the material to third-party vendors, as is done with the CLYC scintillation material, or engaging in a licensing agreement for its growth, as it does for CeBr3. LLNL will negotiate the licensing of its patents in good faith.

1.3 ASIC

Regarding the first version of the ASIC to be used for the CDM (Core Detector Module) in this RIID development, IDEAS in Oslo Norway owns the intellectual property for the digital ASIC (VAD-UM2.2). The use of this ASIC would involve a negotiation with IDEAS, which would need to provide support and documentation.

UM has designed a digital ASIC, denoted as the H3DD-UMv4, to reduce the cost and power draw, and to increase capabilities; it was completed in 2022. H3D will discuss licensing the H3DD-UMv4 ASIC from UM for use in future TlBr RIID development.

1.4 Readout Electronics:

H3D claims the intellectual property concerning the data acquisition interface with the IDEAS VAD-UM2.2 ASIC. Also, regarding the IDEAS ASIC, H3D claims the intellectual property associated with the readout electronics, or data acquisition system, firmware, and software as trade secrets.

H3D anticipates using Commercial Off-The-Shelf (COTS) electronics components for the readout electronics and claims the IP for the data acquisition (DAQ) system to be developed for the H3DD-UMv4

ASIC.

The “Rights for Use, Operation, and Fabrication” section below covers the details about the availability and use of the ASIC, the data acquisition interface, firmware, and software.

1.5 Computer: SBC

H3D selected a COTS SOM for the embedded SBC. H3D claims intellectual property related to the design of the carrier board to work with the SOM as trade secrets.

H3D claims the IP for the data acquisition software, signal-processing, calibration, and analysis software.

The application programming interface (API) will be like existing H3D products, and H3D will negotiate customizations. H3D provides standard test software for the API.

The “Rights for Use, Operation, and Fabrication” section, below covers the details about the availability and use of the ASIC, the data acquisition interface, firmware, and software.

1.6 Rights for Use, Operation, and Fabrication

The following sections explain the rights for use, operation, and fabrication of the TlBr Array CDM units under different procurement approaches.

Third-Party Vendor Operating Rights – Third-party vendors will have full operating rights for the CDMs, whether procured directly from the vendors or given to them as GFE from the Government. Third-party vendors will be able to operate the modules and integrate them into other systems, as desired, for typical commercial purposes. Third-party vendors will not automatically have the rights to the design of the components of the CDMs and will be restricted from reverse-engineering the systems unless separate commercial agreements are negotiated. This scenario is consistent with typical commercial supply terms, where the third-party vendor is essentially procuring a component or assembly from a supplier. However, the team is open to supplying components of the CDMs (rather than the Full-Up CDM), so that third-party vendors have greater flexibility concerning the design of their TlBr devices. For example, a third-party vendor may wish to procure only the TlBr array from RMD and integrate this array with its electronics.

Third-Party Vendor Fabrication Rights – Fabrication rights for the complete CDM will not be immediately available, as the CDM contains designs and technologies with commercial value that are covered by previous data rights assertions. Fabrication rights could potentially be negotiated through a separate commercial agreement for part or all of the CDM. It is not expected that this will inhibit the development of TlBr-based devices, as the flexibility provided under “Third Party Vendor Operating Rights” will allow third-party vendors to procure and incorporate elements of the CDM design through typical commercial supply arrangements. In the future, integrators should anticipate a licensing agreement with H3D, where there will be no further licensing burden on the customer from the other team member organizations that have supplied IP-protected technology to H3D.