RFQ Qualifiers 467862 Assembly.pdf
PDF 25 KB Posted
- Attached to
- 467862 DUNE PCB Assembly Service
- Solicitation number
- 467862
- Issued by
-
Department of Energy Office of Science
About this file
This document is a PCB Assembly Qualifier for the DUNE FD-VD FEMB IO-1865-1K project, dated 2025/07/29. The document outlines strict requirements for manufacturers seeking to produce printed circuit board (PCB) assemblies for a cryogenic detector application at 77 Kelvin. Key qualifications include: 20+ years of experience in complex PCB assemblies, demonstrated capability of working with approximately 50 component types using surface mount and through-hole technologies, roughly 1,500 total components, and compliance with IPC-A-610 class II standards.
Potential offerors must provide comprehensive reference documentation proving their experience, including details on previous cryogenic electronics assemblies. The requirements mandate submitting references for at least 3 successfully fabricated jobs with comparable complexity, including specifics such as board size, component breakdown, mounting technologies, and evidence of boards functioning at cryogenic temperatures below 120K. The document emphasizes that failure to provide the requested information will result in a non-responsive offer, and only manufacturers with extensive experience in cryogenic electronics will be considered to maintain the DUNE project's tight schedule.
View the file
Other files
| File | Type | Posted |
|---|---|---|
| A.3 Assembly Bottom Drawing.pdf | ||
| SOW FEMB-VD.PCBAssembly.20250804.pdf | ||
| A.3 Assembly Top Drawing.pdf |
On GovTribe
Work with this file
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
2025/07/29
DUNE FD-VD FEMB IO-1865-1K PCB Assembly Qualifiers
FEMB-VD IO-1865-1K assembly has to work at cryogenic temperature (77 K) in DUNE FD-VD detector, no alternation of bill of materials is allowed for the construction of these assemblies.
Only manufacturers which have experience of building cryogenic electronics assemblies with similar complexity should be considered. Otherwise, extended delay to qualify the manufacturer is expected, which is not compatible with DUNE project schedule.
Extensive evaluation tests have been carried out at BNL to qualify FEMB assemblies produced by the manufacturer at cryogenic temperature (77 K). Manufacturer submitting the bid must demonstrate that it has experience of building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components).
1. Offeror shall have a minimum of 20 years working experience in the areas of complex PCB assemblies.
The offeror shall provide reference documentation demonstrating 20 years or more of work experience in the areas of complex board assemblies.
2. Does the offeror have previous experience building cryogenic electronics assemblies with similar complexity (~50 different types of components with mix of surface mount and through hole technologies, ~1,500 components, certificate of compliance per IPC-A-610 class II, stringent handling procedure for ESD sensitive components) with reference to the assembly drawing package?
If YES, the offeror shall provide references for at least 3 successfully fabricated jobs with comparable complexity with key parameters listed below.
a. Board size
b. Number of different types of components
c. Number of components in surface mount technology
d. Number of components in through hole technology
e. Number of components mounted on board
f. Certificate of compliance per IPC-A-610 class II
g. Handling procedure for ESD sensitive components
h. Evidence of boards being used at cryogenic temperature (< 120 K)
The references shall include the name of the organization, contacts, phone numbers, and e-mail addresses.
Failure to provide the above information will render your offer non-responsive.
File details come from the government source that posted it. Updated .