A.3 Assembly Top Drawing.pdf
PDF 605 KB Posted
- Attached to
- 467862 DUNE PCB Assembly Service
- Solicitation number
- 467862
- Issued by
-
Department of Energy Office of Science
About this file
This document is a detailed circuit board assembly top-level design for a Dune Monolithic FEMB (Front-End Motherboard) MINISAS, created by Brookhaven National Laboratory. The technical drawing shows a complex electronic circuit layout with multiple large square integrated circuit components, numerous smaller electronic components, and connection points marked with labels like MT12, MT13, FID3, and P4. The document is marked with an ESH & Q Risk Level of A3 - Minor and is controlled under U.S. Department of Commerce Export Administration Regulations 15 CFR Parts 730-774. The design appears to be for a specialized scientific or research computing hardware component, potentially for use in high-precision scientific instrumentation or data processing systems.
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Other files
| File | Type | Posted |
|---|---|---|
| RFQ Qualifiers 467862 Assembly.pdf | ||
| SOW FEMB-VD.PCBAssembly.20250804.pdf | ||
| A.3 Assembly Bottom Drawing.pdf |
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