Specifications.docx

SPECIFICATIONS

SEMI-AUTOMATIC WAFER PROBING SYSTEM

BACKGROUND:

The National Institute of Standards and Technology (NIST) currently fabricates several different nano-scale magnetic devices. These devices are tested for resistivity as a function of applied magnetic field upon completion of the fabrication process. Currently this is done on a die-by-die basis that is time inefficient. A wafer probing system will enable the verification of wafer process yield in an automated fashion. Semi-automated wafer probing will enable better feedback on the fabrication processes as well as the ability to efficiently identify devices of interested.

PURPOSE:

The Spin Electronics group (687.09) within the Quantum Electromagnetics Division needs to purchase a wafer probing system for in-line and end-of-line process control monitoring of a variety of different devices.

DELIVERABLES

A semiautomatic wafer probing system that is compatible with 75mm and 150mm wafers. They system can require manual loading of a single wafer, but must include automatic alignment of the wafer. The system should be able to move over the entire range of the wafer and apply a DC magnetic field.

TECHNICAL SPECIFICATIONS

1. The wafer prober shall be compatible with both 3 inch and 150mm wafer sizes.

2. The wafer prober shall be fully motorized with 4 axes of controllable motion (x, y, z, and theta). The wafer prober shall have auto-align capabilities with image recognition, in order to maximize wafer throughput.

3. The wafer prober shall be mounted on a vibration isolation table.

4. The x-y stage shall be capable of moving the wafer at 50 mm/s with an accuracy of +/- 3 micrometers. The repeatability of the movements shall be within 1 micrometer.

5. The wafer prober system shall be capable of applying a variable magnetic field with a bipolar magnitude greater than +/- 0.2 T in the plane of the wafer.

6. The wafer prober shall be capable of using either a standard 4.5 inch probe card, or micromanipulators.

a. 4 micromanipulator and the probe card mount shall be supplied with the system. No probe card shall be required with the system.

b. The micromanipulators shall have a minimum 0.5 inches of travel in X, Y, and Z axes. The motion shall be controlled by a 80 TPI adjustment screw or a higher resolution driver.

7. The wafer prober shall include a stereo zoom microscope. The zoom range shall be at least 0.75 – 5 x, the magnification range shall be at least 20 – 100 x. The stereoscope shall have a large working distance of greater than 100 mm.

a. LED based illumination shall be provided.

b. A CCTV camera shall be included with a monitor.

8. A system control computer and monitor shall be included. All software necessary to operate the wafer prober, enable automatic wafer aligning and perform basic wafer mapping including die movement and within die movement commands shall be included.

a. The system shall be externally controllable.

9. The system shall be a production model, not a prototype or one-of-a-kind system.

10. The end-user must be able to switch the wafer prober between wafer sizes.

11. The end-user must be able to switch between micromanipulators and the probe card.

12. The system shall be provided with a one year warranty on all parts and labor from the date of on-site acceptance.

TECHNICAL CONSIDERATIONS

N/A

GOVERNMENT FURNISHED PROPERTY OR EQUIPMENT

N/A

DELIVERABLE SCHEDULE:

14 weeks ARO

TYPE OF CONTRACT:

Firm fixed price.