Answers_to_Questions.pdf
PDF 104 KB Posted
- Attached to
- Wafer Probing System Federal contract opportunity
- Solicitation number
- NB687090-16-02510
View the file
Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| Latest_Responses_to_Questions.docx | DOCX document | |
| 2nd_Responses_to_Questions.docx | DOCX document | |
| Specifications.docx | DOCX document |
On GovTribe
Work with this file on GovTribe
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
Answers to Questions:
This requirement is non-standard to our products and will require an amount of customization in order to provide a solution Item 5.
The wafer prober system shall be capable of applying a variable magnetic field with a bipolar magnitude greater than +/- 0.2 T in the plane of the wafer
Please clarify the following:
1. Does vendor need to provide the equipment needed to generate the variable magnetic field? Or will NIST provide?
-Yes, vendor provided (not NIST provided).
2. If vendor is to provide this equipment, is there a preferred supplier or series of products that NIST can identify to satisfy this requirement?
-There is no preferred vendor here, but an example vendor is GMW.
3. Is there a technical person at NIST that can answer specific questions related to this requirement, so that Cascade can better understand this specification and be able to provide a solution?
No- since this is at the Contracting Level no one is allowed to contact the technical person. Any questions have to come to Angela Hitt at angela.hitt@nist.gov.
4. As stated previously, application of a magnetic field is a unique specification and does require a thorough understanding in order to properly adapted a wafer prober to conform to this need.
Additionally, it will be difficult for vendor to provide a complete response by 6 pm mountain time on July 27, due to this specification, can this be extended.
Yes- the responses are now extended until August 3 by 6 pm mountain time.
Questions regarding Item # 5 in your Technical Specifications. Can your scientist provide some details regarding the specification to “apply a variable magnetic field with a bipolar magnitude greater than +/-
0.2 Tesla in the plane of the wafer?” We would like to make sure that our quotation, when provided, adheres to this specification with the applicable equipment, without missing one of the salient points in his/her requirement (for instance ...... Does it require a non-magnetic platen? How would they like the magnets to be attached to provide the field? Etc, etc.) Any description of the desired setup would be extremely helpful.
-We do not require a non-magnetic platen, but there should be no large (> 0.1 Oe) magnetic fields at the probing site.
-The field is as measured at the site of probing.
-We do not have any requirements about attachment etc. provided that probing can be performed with the applied field.
mailto:angela.hitt@nist.gov
1. Does the user need to apply the magnetic field in a single in-plane direction, or does he needs a rotating magnetic field capability?
-Single direction
2. “The end-user must be able to switch the wafer prober between wafer sizes.”- this is probably lost in translation. Can end user clarify what is meant?
-The prober should be about to handle 3” and 6” (150mm) wafers. If there are changes to the prober required to change wafer size, then those must be able to be done by the user (NIST).
File details come from the government source that posted it. Updated .