NB680000-21-01417 SOW.pdf

Statement of Work BMF Photoresist Coating and Developing System

1. Background Information:

a. NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett Gebbie Building) to support the most sensitive research done at NIST. This building is a Class 100 microelectronics fabrication facility called the Boulder Micro-fabrication Facility (BMF). The BMF is expanding its lithography capabilities and requires a system to automatically coat and develop high-quality photoresist films on substrates in a process consistent with the standard semiconductor industry techniques.

2. Scope of Work:

a. Objectives:

i. The goal of this contract is to supply, install, and train new users on a photoresist coating and developing system that meets the needs of the BMF community.

b. General:

i. The Contractor shall:

1. Provide evidence of experience in supplying, installing, and training new users on at least three photoresist coating and developing systems with similar requirements to those in the statement of work. This criterion shall be met by supplying the Government with contact information of at least three references that the Government may contact and ask if the system performs according to required tool specifications.

2. Provide all new items. Prototypes, one-off systems, demonstration models, used or refurbished instruments will not be considered for award.

3. Provide personnel that pass required government background checks to be issued badges for work on site.

4. Provide a quotation proposal which details all planned materials, consumables, travel, labor, rigging, equipment, and expenses.

5. Supply the installation manual, utility requirements, and a diagram showing the tool footprint, measurements, and wall penetrations, along with a quotation.

6. Provide a drawing showing how the system shall fit into the required space, as shown in Attachment 1.

ii. Specifications for the Work:

1. NIST Security shall badge all staff from the selected vendor. No one may enter the site without a badge.

2. All work shall be scheduled with the Technical Point of Contact (TPOC) prior to arrival to do the work.

c. Specific Requirements:

i. At a time to be coordinated after the award of the contract, the Contractor shall:

1. Supply, install, and train new users on a photoresist coating and developing system that meets the technical specifications in Section 2.c.ii.

ii. The photoresist coating and developing system shall:

1. Be constructed with materials that are compatible for use in an ISO Class 5 cleanroom.

2. Be designed for normal operation at an altitude of 5,500 feet above sea level.

3. Be constructed such that any surface that comes in contact with a chemical shall be constructed of material resistant to that chemical.

4. Be able to deposit and develop photoresist films using techniques according to industry standards used in the semiconductor industry.

5. The system shall be able to operate in an automated, computer-controlled manner:

a. Specifically, the system shall be able to automatically:

i. Remove a substrate from a SEMI-standard cassette.

ii. Place the substrate onto a module including but not limited to a spinner, developer, hot plate, cold plate, or priming system.

iii. Perform a preprogrammed recipe on the substrate at a module.

iv. Move the substrate to another module where another recipe is automatically performed or place the substrate in a SEMI-standard cassette where it can be unloaded from the tool.

b. The system must operate according to one recipe that can control all of the modules simultaneously.

c. All of the modules shall be able to operate independently and simultaneously, and the system shall be able to perform operations on multiple substrates simultaneously.

i. For example, the system must run a develop process on a substrate while baking a second substrate and coating a third substrate simultaneously.

d. The system shall store and edit recipes to control the system using only software integrated into the system; no other software or hardware is required.

e. The system shall meet all requirements while not being connected to the internet or a network. It shall be able to function as a stand-alone unit.

6. Include all computer systems, power supplies, and all ancillary equipment required for the system to operate.

7. Include appropriate interlocks to ensure that the tool is safely operated.

8. Be controlled by software that can control all aspects of the tool. This software must also provide users a Graphical User Interface (GUI) that shows users the state of the tool, allows users to change the state of the tool, allows users to create and store recipes, and allows users to run recipes to automatically run a process on the tool.

9. Meet the following physical requirements:

a. The system shall fit into a 110 inch long by 84 inches deep by 8-foot tall footprint within the cleanroom as shown in the grey box labeled “Tool, User, and Maintenance Egress” in Attachment 1.

i. The tool shall have three sides exposed in the cleanroom and the backside up against the cleanroom wall into a chase.

ii. A hole can be cut in the wall to allow access to the backside if necessary.

iii. The tool must fit in this footprint along with any required egress for tool operation, user and maintenance egress. This explicitly includes the space of a user to stand to operate the tool.

iv. Additional egress is allowed to one side of the tool, approximately 48 inches wide by 84 inches deep, as shown in the orange box labeled “Maintenance Only Egress” in Attachment 1. This area is in front of a door, and no part of the tool may permanently block the door, but the door can be temporarily blocked, such as during maintenance procedures.

b. The rear of the system shall be mounted against a wall, and facilities shall be accessible from the rear of the system. Any ancillary equipment for the tool to operate that a user does not need to interact with regularly, such as a media cabinet, may be stored in a 72 inch wide by 24 inches deep by 8-foot tall area in the chase behind the system, as shown as the gray box labeled “Ancillary Equipment” in Attachment 1.

c. During transport to the final location, the system components shall pass through a freight elevator with doors that are 7 feet 11 inches tall and 8 feet wide. The platform has an entrance door to back length of 9 feet and a width of 13 feet, a cab height of 7 feet 11 inches, and has a weight limit of 10,000 pounds.

d. During transport to the final location, the system components shall pass through a corridor with a minimum width of 5 feet.

e. The system shall weigh less than 5,000 pounds.

10. Be able to perform tasks, including but not limited, to spinning, developing, baking, cooling, and priming on the following substrates:

a. 3 inch and 150 mm wafers defined by semi-spec lateral dimension.

b. Substrates made of Silicon, Gallium-Arsenide, Glass, Fused Silica, Quartz, and Sapphire.

c. Substrates with thickness in the range from 0.2 mm to 1 mm.

11. Be able to have the substrate format changed by a trained operator in less than

2 minutes without complicated or heavy/bulky tools.

12. Contain a robot sub-system capable of transferring wafers between the input/output, vapor prime, coat, temperature plate, and development modules.

13. Contain a substrate input and output module that shall:

a. Be able to mount and load and unload from two SEMI spec cassettes ranging in size from 3” SEMI spec wafers to 150 mm SEMI spec wafers.

b. Be able to detect the presence of a wafer carrier.

c. Include a wafer mapping system that shall be able to:

i. Detect and map the position of wafers within the carrier.

ii. Detect missing wafers.

iii. Detect cross-slotted wafers.

14. Be able to transfer wafers to the process modules with 0.5 mm or better alignment accuracy. This alignment accuracy may be achieved components from multiple modules.

15. Be able to accommodate at least four process modules.

16. Include a first process module that shall be a coat module. This module must be able to spin coat 3 inch and 150 mm wafers with SEMI spec lateral dimensions with photoresist consistent with semiconductor industry standards.

The coat module shall:

a. Be a closed rotating cover and bottom type consistent with semiconductor industry standards.

b. Be capable of spin speeds of in the range of at least 0 – 3000 RPM controllable to 1 RPM steps.

c. Be capable of spin accelerations in the range of at least 0 – 10,000

RPM/sec in at least 10 RPM/sec steps.

d. Be capable of having recipes with an unlimited number of steps, with each step having a processing time of at least 1 – 500 seconds controllable to 0.1-second increments.

e. Include a programmable exhaust valve that allows for exhaust control.

f. Include chuck(s) compatible with 3 inch and 150 mm wafers with SEMI-spec lateral dimensions.

i. Wafer compatibility may be achieved either with a single chuck or two chucks.

ii. If two chucks are used, chuck changeover shall take a trained operator less than two minutes.

iii. The chuck(s) shall be of the edge contact vacuum type.

g. Be plumbed such that it can independently dispense at least four separate resist media, including but not limited to:

i. Dow SPR 600-1.

ii. Dow SPR 220-3.

iii. Dow SPR 220-7.

iv. AZ 12XT-20PL-10.

v. AZ 12XT-20PL-15.

vi. Microchem LOR 5A.

vii. Microchem LOR 10A.

viii. Microchem LOR 5C.

ix. Microchem LOR 10C.

h. Include a motorized dispense arm with programable movement.

i. Include a resist nozzle that includes all valves and tubing for four separate resist media.

j. Include a mechanism for rinsing and cleaning the nozzle tip and preventing resisting drying.

k. Include an edge bead removal nozzle for solvent-based edge beam removal.

i. The edge bead removal nozzle shall have a mechanism to prevent drips.

ii. The radial location of the edge beam removal nozzle shall be programable in a minimum of 0.2 mm steps.

l. Include four photoresist media pumps that shall:

i. Be able to handle the photoresist types described in Section 2.c.ii.16.g.

ii. Be compatible with the following bottle sizes: 500 mL, 1 L, and 1

Gallon.

iii. Include control and suck back valves.

iv. Include a mechanism for de-bubbling the resist.

v. Include a mechanism of measurement of the volume and/or mass of resist dispensed.

m. Include an edge bead removal media storage and delivery unit that shall:

i. Include a solvent storage and delivery unit for edge bead removal solvent.

ii. Include a tank for storage of at least 8 liters of edge bead removal solvent.

iii. Include a low-level sensor.

iv. Preference is given to a system that uses a pressureless pump system.

v. Preference is given to a system that can control solvent flow using a sensor.

n. Waste from this module shall be collected in an appropriate storage container with at least 5 L that can be easily emptied or removed for proper chemical disposal. This container shall also have a level sensor that notifies users when it is full.

17. Include a second process module that shall be a develop module. This module must develop a photoresist on 3 inch and 150 mm wafers with SEMI spec lateral dimensions in a manner consistent with semiconductor industry standards. The develop module shall:

a. Be an open rotating cover and bottom type consistent with semiconductor industry standards.

b. Be capable of spin speeds of in the range of at least 0 – 3000 RPM controllable to 1 RPM steps.

c. Be capable of spin accelerations in the range of at least 0 – 10,000

RPM/sec in at least 10 RPM/sec steps.

d. Be capable of having recipes with an unlimited number of steps, with each step having a processing time of at least 1 – 500 seconds controllable to 0.1-second increments.

e. Include a programable exhaust valve that allows for exhaust control.

f. Include chuck(s) compatible with 3 inch and 150 mm wafers with SEMI-spec lateral dimensions.

i. Wafer compatibility may be achieved either with a single chuck or two chucks.

ii. If two chucks are used, chuck changeover shall take a trained operator less than two minutes.

iii. The chuck(s) shall be of the low-contact centrifugal force type.

iv. The chuck(s) shall have a backside rinse that cleans developer media off of the backside of the wafer.

g. Be able to dispense at least two separate aqueous develop media independently. The module shall be able to dispense media including but not limited to:

i. Microchem MF-26A

1. Tetramethylammonium Hydroxide (TMAH) based

ii. RBP DX-40

1. Potassium Carbonate based

h. Have two separate storage and delivery units for the required aqueous develop media. Each delivery unit shall:

i. Have a tank for storage of at least 8 liters of develop media.

ii. Have a low-level sensor.

iii. Preference is given to systems that utilize a pressureless pump system.

iv. Preference is given to systems that can control developer media flow using a sensor.

v. Have puddle type develop nozzles that can perform a puddle type developing process consistent with the standard techniques used in the semiconductor industry.

i. Have a Deionized (DI) water delivery unit. This unit shall:

i. Be able to control DI-water flow using a sensor.

ii. Have a spray-type nozzle that can rinse the developer off of the wafer in a consistent manner with the standard techniques used in the semiconductor industry.

j. Have a motorized dispense arm with programable movement.

18. Include a third process module that shall be a temperature plate module. This module must be able to heat and cool 3 inch and 150 mm wafers with SEMI spec lateral dimensions in a manner that is consistent with semiconductor industry standards. The temperature plate module shall:

a. Include four hotplate units that can be controlled independently. Each unit shall:

i. Have an active area that is 180 mm by 180 mm or greater, making it suitable for a 150 mm wafer with SEMI spec lateral dimensions.

ii. Be capable of controlling its temperature from at least ambient temperatures to 250 C with at least 0.3 C resolution.

iii. Have temperature uniformity of better than plus/minus 1C at 100 C across the active area. Be capable of substrate contact, vacuum contact, and proximity mode consistent with the standard techniques used in the semiconductor industry.

1. The proximity bake capability shall include programable lift pins with 0.15 mm or smaller steps.

iv. Have a programable nitrogen flow.

b. Include 1 cool-plate unit that shall:

i. Have an active area that is 180 mm by 180 mm or greater, making it suitable for a 150 mm wafer with SEMI spec lateral dimensions.

ii. Be capable of controlling its temperature from at least ambient temperatures to 15 C with at least 0.3 C resolution.

iii. Have temperature uniformity of better than plus/minus 1 C at 15 C across the active area.

Be capable of substrate contact, vacuum contact, and proximity mode consistent with the standard techniques used in the semiconductor industry.

1. The proximity bake capability shall include programable lift pins with 0.15 mm or smaller steps.

19. Include a fourth process module that shall be an empty space that is available for a future process module. This space shall be able to accommodate an additional coat, develop, or temperature plate module with specifications similar to the modules described in Sections 2.c.ii.16, 2.c.ii.17, and 2.c.ii.18.

a. An additional process module shall be able to be installed into the system at a future date while the tool is deployed in the field in the BMF. It is not acceptable if this future upgrade requires the tool to be sent back to the factory or the Contractor for an upgrade.

b. This fourth process module shall have the ability to have a system that can apply photoresist using the spray coat method consistent with the standard techniques used in the semiconductor industry. This module shall be able to be installed while the tool is in place in the BMF.

20. Include a system to provide a hexamethyldisilazane (HMDS) vacuum vapor prime capability consistent with the standard techniques used in the semiconductor industry. This capability does not need to be a separate process module; it can exist in one of the existing process modules, such as the temperature plate module. The vacuum vapor prime system shall:

a. Be capable of controlling temperature between at least 25 to 190 C with at least 0.3 C resolution.

b. Have a temperature uniformity of better than plus/minus 3%.

c. Include a storage container for the HMDS media.

d. Have programmable control of the temperature, HMDS, nitrogen, vacuum, and exhaust used during the process.

e. Be able to complete a typical vapor prime process on a substrate in under

5 minutes.

21. Include a media storage sub-system. The system may be contained within the main system or be a separate media cabinet. This system shall include containers required for all media for the system as well as an appropriate container for any chemical waste and be exhausted as appropriate. The containers shall be able to be changed easily and with the use of minimal tools.

iii. Before shipping the system, the Contractor shall provide the Government a factory acceptance report demonstrating that the photoresist coating and developing system performs according to tool specifications listed in this statement of work. The Government reserves the right to be present during the factory acceptance test. The Contractor shall provide the Government with a schedule of the factory acceptance test at least four weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory.

The system must be able to meet all specifications in Section 2.c.ii. The tool must meet these conditions before it is shipped. The Contractor shall be responsible for providing all consumables required for the demonstration.

iv. The Contractor shall deliver the photoresist coating and developing system to its final location in the BMF (Building 81, room 1B100). This is to include all required rigging from the delivery truck to final system placement in the BMF.

The installation and rigging shall be performed in a compatible method with the cleanliness requirements of an ISO class 5 cleanroom and NIST structural requirements. Items entering the cleanroom shall be cleaned to standards outlined in ISO 14644. The Government reserves the right to have the system delivered to its final location in the BMF and then be able to connect the required utilities to the the system for a period between system delivery and site acceptance test. This time period shall be at least 4 weeks and will not exceed 12 weeks, and the actual time period will be agreed upon between the Government and the Contractor. If facilitization occurs faster than the agreed upon time period, then the Contractor may start the site acceptance test on a date that is mutually agreeable between the Government and the Contractor.

v. During system installation, the Contractor shall provide a working set of standard recipes and tool schematics.

vi. After system installation, the Contractor shall demonstrate the system's performance according to system specifications using a standard site acceptance test. This test shall include demonstrating that the tools can meet the requirements listed in Section 2.c.ii. The Government will provide the consumables required for this test. The system must meet the stated performance requirements before it is accepted.

vii. After the system passes the site acceptance test, the Contractor shall provide on-site applications training.

viii. The Contractor shall provide at least one week of tool setup and training time for the system.

ix. The Contractor shall supply the installation manual, utility requirements, and a diagram showing the tool footprint, measurements, and wall penetrations for the system, along with the quotation.

x. After awarding the contract, the Contractor shall supply a schedule for when the required work will be performed. Within 4 weeks of receipt of order (ARO), the Contractor shall submit a schedule for Contracting Officer approval. At a minimum, the schedule shall address: (1) Period of factory acceptance test (2) Delivery date to NIST with all manuals and instructions, (3) Installation period,

(4) Acceptance Testing Period, (5) Training Period. The Contractor shall provide status updates to the Government on a mutually agreed upon time schedule or upon request. The Government will provide the opportunity for a site visit within 4 weeks ARO.

1. The Contractor shall provide the Government with a schedule of the factory acceptance test at least 4 weeks before the test to ensure that the Government has enough time to arrange for travel to the factory. Before the system is shipped, the Contractor shall provide the Government a factory acceptance report demonstrating that the system performs according to system specifications.

2. The Contractor shall ship the system within 20 weeks of award of contract.

After the tools are placed in their final location in the BMF, the Government will take a minimum of 4 weeks and a maximum of 12 weeks to install and connect facilities to the system. Within two weeks after the Government installs the system, the Contractor shall have commissioned the system to pass the site acceptance test, and users are trained on the operation of the tools.

3. Within one week of the completion of the work, the Contractor shall provide the TPOC a report of the work done, the results of the acceptance test, and any issues identified. After the Government receives the report, the tools shall be accepted.

xi. The Contractor shall supply all parts, hardware, equipment, and labor required to perform the tasks listed.

xii. The Contractor shall supply a one-year warranty on all parts and labor including installation. The warranty period begins the day of acceptance.

xiii. The Contractor shall schedule all visits to the BMF with the TPOC at least 2 weeks before arriving at the site.

xiv. Within one week of the completion of the work, the Contractor shall provide the TPOC a report of the work done, the results of the acceptance test, and any issues identified.

3. Period of Performance:

a. Contract Line Item Number 0001: Photoresist Coating and Developing System.

Completion date: 35 weeks ARO.

4. Place of Performance:

a. All work shall be performed at 325 Broadway, Boulder, Colorado, Building 81, room

1B100.

b. The Government will provide access to Building 81 to the Contractor for the entire period of performance of this contract.

c. The day-to-day supervision and direct control over the work performed by the on-site

Contractor personnel shall be the sole responsibility of the Contractor.

5. Government Furnished Property:

a. The Government will provide the opportunity for the Contractor to perform a site visit to ensure:

i. The system must be delivered to its final position in the BMF from the Building

81 dock. This should include ensuring that the system can travel through all required hallways, doorways, and elevators.

ii. The tools must fit in the required space in the BMF as required by Section 2.c.ii.9.

b. After the site visit, the Contractor’s responsibility is to ensure that the system can meet the required specifications in Section 2.c.ii.

c. The Government will facilitize the system during a time period of at least 4 weeks but not to exceed 12 weeks after the tool is delivered to the BMF. In addition, the Contractor may provide a facilization checklist for the Government to fill out and sign.

d. The Government will provide the appropriate consumables for the site acceptance tests.

6. Deliverables

Specification Number Reference

Description Due Date Format (if applicable)

Approving Authority

2.b.i.1 Provide evidence of experience in supplying, installing, and training new users on photoresist coating and developing systems with similar requirements to those in the statement of work. Evidence of this criterion shall be demonstrated with an appropriate reference.

With Quotation Electronic (PDF, .doc, .docx, etc.)

COR/CO

2.b.viii Provide tool setup and training time for the system

One week after the system is delivered

N/A COR/CO

2.c.ix Provide the Government with the installation manual, utility requirements, and a diagram showing the system footprint, measurements, and wall penetrations along with quotation. In addition, the Contractor may provide a facilitization checklist for the Government to fill out and sign.

With Quotation Electronic (PDF, .doc, .docx, etc.)

COR/CO

2.c.x The Contractor shall supply a schedule for when the required work will be performed.

4 weeks ARO Electronic (e-mail, PDF, .doc, .docx, etc.)

CO

5.a The Government will provide the opportunity for the Contractor to perform a site visit.

4 weeks ARO N/A COR/CO

2.c.iii The Contractor shall provide the Government with a schedule of the factory acceptance test at least 4 weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory.

4 weeks before the factory acceptance test

Electronic (e-mail, PDF, .doc, .docx, etc.)

COR/CO

2.c.iii The Contractor shall provide the Government a factory acceptance report demonstrating that the photoresist coating and developing system performs according to tool specifications.

Before the system is shipped

Electronic (e-mail, PDF, .doc, .docx, etc.)

COR/CO

2.c.iv The photoresist coating and developing system is delivered to its final place in the

BMF

20 weeks ARO N/A COR/CO

2.c.v The Contractor shall provide a working set of standard recipes.

During site acceptance

Recipes provided in the tool database

COR/CO

2.c.vi The Contractor shall demonstrate the photoresist coating and developing system performs according to system specifications using a standard site acceptance test.

34 weeks ARO N/A COR/CO

2.c.xiv The Contractor shall supply the TPOC with a copy of a report summarizing, work done, the results of the acceptance test, and any issues identified within one week after their site visit.

35 weeks ARO Electronic (e-mail, PDF, .doc, .docx, etc.)

COR/CO

2.c.xiii The Contractor shall schedule all visits to the BMF with the TPOC at least 2 weeks before arriving at the site.

N/A Electronic (e-mail, PDF, .doc, .docx, etc.)

COR/CO

a. Performance requirements:

i. Task: Supply, install, and train new users on a photoresist coating and developing system that meets the specifications defined in Section 2.

ii. Performance Indicators: After the photoresist coating and developing system is installed and tested, and it meets the system requirements described in Section 2.

iii. Performance Standards: The technical requirements defined in Section 2, the Contractor provides one week of tool installation and training, and the delivery of the report described in Section 6 within one week of completion.

iv. Acceptable Quality Level: Set up and testing of the photoresist coating and developing system is performed according to industry standards. After the photoresist coating and developing system are installed, it meets the tool requirements described in Section 2.

7. Attachments:

a. BMF Cluster Coat_Blueprint.pdf

8. Travel:

a. The Contractor shall be responsible for all travel expenses to include consideration and coordination during COVID conditions.

9. Contractor Supplied Materials

a. The The Contractor shall supply all parts, hardware, equipment, and labor required to perform the tasks listed as related to installation and training, including consideration and coordination during COVID conditions.

10. Contractor’s Minimum Qualifications

a. The Contractor shall:

i. Provide personnel that pass required government background checks to be issued badges for work on site.