DRAFT_SOW_for_PCB_Design_Services.pdf

STATEMENT OF WORK (SOW)

WORKSHEET

REV 8/28/15

JML #: 90258634 90258635, 90258636, 90258637, 90258638

Ship/Activity: Ocean Engineering Department

Title: PCB Design

Place of Performance: At vendor facility.

1. BACKGROUND

Puget Sound Naval Shipyard (PSNS) has developed circuit schematics, including material lists and circuit electrical/operational descriptions, for five (5) separate printed circuit boards (PCBs). PSNS requires the simulation of the provided circuits to verify expected operation, and the fabrication/manufacture and test of prototype PCBs based on the provided circuit schematics. The final PCBs will be first article production items.

The purpose of this contract is for a contractor to provide design efforts and prototype manufacturing based on government provided circuit schematics and not-to-exceed dimensions, in accordance with

(IAW) this SOW, Appendices and Work Requirements (3.1.1) thru (3.1.7) to recreate provided circuits into contractor determined software, 2) simulation of provided circuits in contractor determined software,

3) create 3D models of developed PCBs, and 4) fabrication and testing of prototype PCBs.

2. APPENDICES

2.1. A - DWG 8577152 - Package PCB Circuit Schematics, Electrical Characteristics, and Operational

Details

2.2. B – DWG 8577105 – Package Circuit Boards

2.3. C – PCB outlines and mounting details

3. WORK REQUIREMENTS

3.1 The contractor will be required to adhere to the following instructions and standards:

3.1.1 IPC-2221: Generic Standards on Printed Board Design

3.1.2 IPC-D-352A: Electronic Design Data Description for Printed Boards in Digital Form

3.1.3 IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

3.1.4 IPC-SM-840: Qualification and Performance Specification of Permanent Solder Mask and

Flexible Cover Materials

3.1.5 J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

3.1.6 J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed

Solid Solders for Electronics

3.1.7 MIL-I-24768/27-S-7: Insulation, Plastic, Laminated, Thermosetting, Glass-Cloth, Epoxy-

Resin (GEE-F)

3.2. The contractor will perform the following:

3.2.1. The contractor will generate PCB circuits from government provided circuit schematics in contactor designated software. The government may provide Gerber files in lieu of this requirement.

3.2.2. The contractor will simulate PCB circuits to ensure proper/expected operation

3.2.3. The contractor will generate 3-D models of each PCB for use in government drawings

3.2.4. The contractor will fabricate and test prototype production PCBs

3.3 PCB GENERAL REQUIREMENTS

3.3.1. PCB circuits: shall be per the provided schematics in Appendices A and B. Appendix A provides individual circuit schematics. Appendix B provides PCB circuit schematics with

Appendix A circuits shown as block diagrams.

3.3.2. PCB layers: at a minimum two layers with the top layer containing traces and components and the bottom layer for grounds. Contractor allowed to use more than two layers with

PSNS concurrence.

3.3.3. PCB components: per Appendix A and B.

3.3.4. PCB component locations: per contractor discretion for best fit and layout. Recommended circuit locations provided in Appendix C.

3.3.5. PCB prototype fabrication: per listed instructions and standards 3.1.1 thru 3.1.7 and

Appendices A thru C.

3.3.6 Circuit traces: sized according to voltage/current characteristics listed in Appendices A &

B.

3.3.7. PCB dimensions (not-to-exceed) and recommended layout per Appendix C.

3.3.8. Qualification testing shall include the following:

3.3.8.1. Unpopulated PCBs shall be electrically tested for continuity and insulation resistance in compliance with instructions and standards 3.1.3 for class 3. Voltage applied shall be 200V or greater, not to exceed 350V.

3.3.8.2. Visual inspection of solder joints.

3.3.8.3. Functional testing of each PCB after population to verify expected operation.

4. SPECIFIED CONTRACTOR TASKS TO BE PERFORMED AS ORDERED BY THE

GOVERNMENT (DELIVERABLE ITEMS)

Task 4-1 Develop the following documentation for the production of Transformer J-Box Electronics, TY2 Battery J-Box Electronics, and GTK Battery J-Box Electronics PCBs using contractor

PCB software and meeting the requirements of paragraph 4:

a. Board layout, layers, trace routing and component placement drawing(s) for each PCB.

b. PCB trace design calculations.

c. Gerber files for each PCB.

d. 3-D model of each PCB in a file format compatible with Solid Edge.

e. Vendor assign unique part number.

Deliverable 4-1.1 Submit documentation to PSNS for approval for each PCB type prior to initial manufacture for PSNS concurrence/approval. (DI-SESS-81000 Engineering

Drawings)

4-1.1.1 Board layout, layers, trace routing and component placement drawing for each PCB.

4-1.1.2 PCB trace design calculations.

4-1.1.3 Gerber files for each PCB.

4-1.1.4 3-D model of each PCB.

4-1.1.5 Vendor assigned part number.

Task 4-2 Simulate provided circuit designs with maximum loads shown in Appendices A & B.

Deliverable 4-2.1 Submit circuit simulation results for each prototype PCB (Transformer J-Box

Electronics PCB, TY2 Battery J-Box Electronics PCB, GTK Battery J-Box

Electronics PCB1, and GTK Battery J-Box Electronics PCB2). (DI-SESS-81938

Performance Analysis Report)

Task 4-3 Develop factory acceptance test (FAT) procedure(s) for each PCB to perform Visual inspection, Continuity, Insulation Resistance, and Functional testing that includes the following:

a. Test facility name, upgrade/test supervisor name, address, phone number and date PCBs were tested.

b. Service Contract Number.

c. Visual inspection procedure and results for each PCB.

d. Continuity and Insulation Resistance procedure and results for each PCB.

e. Functional Test procedure and results for each PCB.

f. Results (PASS/FAIL) for each test with a positive statement describing satisfactory results obtained during testing and comments regarding failures.

g. Overall FAT results for all PCBs with a positive statement describing satisfactory results obtained during testing and comments regarding failures.

Deliverable 4-3.1. Submit test procedure(s) to PSNS for approval. Submit updated finalized documentation to PSNS for approval within 5 working days. (DI-NDTI-80566A

Test Plan)

Task 4-4 Manufacture QTY (2) each of bare prototype PCB and test.

a. Perform Continuity and Insulation Resistance testing of bare Prototype PCBs.

Deliverable 4-4.1. Submit prototype bare board test report(s) to PSNS for approval. (DI-SESS-81002F

Developmental Design Drawings/Models and Associated Lists (Prototype))

Task 4-5 Populate prototype production PCBs with components and test.

a. Perform visual inspection of each populated prototype PCB IAW Appendix A and B.

b. Perform functional test of completed prototype PCBs IAW Appendix A and B and approved Factory Acceptance Test.

Deliverable 4-5.1. Submit prototype test report to PSNS for approval. (DI-SESS-81002F

Developmental Design Drawings/Models and Associated Lists (Prototype))

Deliverable 4-5.2. Submit completed prototype PCBs to PSNS for prototype PCB shakedown. (DI-

SESS-81002F Developmental Design Drawings/Models and Associated Lists

(Prototype))

Deliverable 4-5.3. Submit final production PCB to PSNS for approval (DI-NDTI-80809B First Article

Test Report)

Task 4-6 Provide a monthly Contractor's Progress, Status and Management Report, that will include test procedure, fabrication, test schedule, material and testing issues, etc.

Deliverable 4-6.1 Submit monthly Contractor's Progress, Status and Management Report. (DI-

MGMT-80368A Status Report)

Task 4-7 Update and finalize Task 5-1 thru Task 5-3 based on feedback from PSNS following prototype PCB shakedown.

Deliverable 4-7.1 Submit updated and finalized documentation. (DI-NDTI-80566A Test Plan)

5. GOVERNMENT-FURNISHED ITEMS – PROPERTY, MATERIAL, EQUIPMENT,

SERVICES

5.1. The government provides only prototype circuit designs in any of the following formats if required:

*.dft, *.iges, *.dwg, *.dxf, *.pdf.

6. SECURITY REQUIREMENTS

6.1. All references and deliverable items associated with this task are UNCLASSIFIED. There are no other known requirements for access to restricted information connected with the performance of this task.

7. ENVIROMENTAL AND SAFETY

7.1. The contractor shall be responsible for all environmental and safety concerns for the design, manufacturing and testing of the final product.

8. ADDITIONAL CONSIDERATIONS

8.1. All technical clarifications/deviations will be coordinated through the Government Representative. –

COR