BOND Bid Pack T13_BCS Head-End Room_15105F Drawings_p5-7.pdf

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Attached to
BOND BID PACKAGE T13_DISTRICT HEAD-END ROOM RENOVATION
Solicitation number
RFP-BPS-180000001665-2
Issued by
Blissfield Village, Michigan

About this file

This file contains electrical system design drawings for the BOND High School Head-End Room project, specifically showing composite electrical plans and specifications. The drawings detail the electrical layout and infrastructure for what appears to be a school facility's telecommunications/data center room, including power distribution, lighting, and low voltage systems.

The technical drawings show detailed electrical floor plans and circuiting diagrams at a scale of 1"=20'-0". They include comprehensive electrical specifications, circuit assignments, and equipment locations throughout the space. The drawings contain power distribution details, circuit identification, and electrical load information through multiple sheets labeled EC1. While pricing and timeline details are not shown in these construction documents, they appear to be part of a larger bid package (T13) for contractors to reference when preparing proposals for the electrical scope of work in this Head-End Room project.

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File details come from the government source that posted it. Updated .