Attachment 3 Exhibit 6.2 TI6340.56B UUTs tested .pdf

CONTROLLED

DOCUMENT

FINAL

REPAIR MANUAL

DEPOT MAINTENANCE

ARSR-4 SYSTEM

Tl 6340.56

UUTs TESTED ON

POWER AMPLIFIER MODULE

TEST SET

CONTRACT DTFA01·88-C-00037

CONTRACTOR

NORTHROP GRUMMAN CORPORATION

BALTIMORE, MARYLAND 21203

MADEFOR

U.S. DEPARTMENT OF TRANSPORTATION

FEDERAL AVIATION ADMINISTRATION

(31 JULY 1998)

Attachment 3 Exhibit 6.2

TI 6340.56

=" INTRODUCTION

This repair manual consists of four separately-bound manuals containing depot-level repair data for units tested on the power amplifier module (PAM) test set. This manual contains general repair data, specific repair data for each unit tested, and Appendix A, List of Acronyms and Abbreviations, in an 8 1/2-inch by 11-inch format. Appendix B, Assembly Drawings, is a separately-bound manual in an 11-inch by 17-inch flat-pak format. Appendix C, Parts Lists, and Appendix D, Wire Data, are separately-bound manuals in an 8 1/2-inch by 11-inch format.

(31 July 1998) i/ii

SAFETY SUMMARY

,SAFETY NOT,iCE

The attention of operating and maintenance personnel is directed to Federal Aviation Administration (FA_) Inswaction 6000.15, Maintenance of Airway Facilities, for instructions on the subject of safety precautions to be observed, and to FAA Order 3900.0, Accident Prevention Handbook for Airway Facility Personnel. Personnel must observe the safety regulations at all times.

KEEP AWAY FROM LIVE CIRCUITS

Hazardous voltages are present within units under test. Use extreme caution when removing or installing phigdn components or making adjustments. Under certain conditions, dangerous potentials may exist in circuits with power controls in the off position due to charges retained by capacitors. To avoid casualties, always remove power, and then discharge the capacitors with a grounding rod before touching any parts.

WARNINGS AND CAUTIONS

Observe all warnings and cautions within this manual for maximum personnel and equipment safety.

PRECAUTIONARY NOTICE,

SEMICONDUCTOR DEVICES/INTEGRATED CIRCUITS

This equipment contains semiconductor devices that may be damaged by static discharge.

Strictly adhere to the electrostatic discharge (ESD) precautionary measures within this manual before attempting to perform any procedure.

(31 July 1998) iii/iv

"" "" TABLE OF CONTENTS

Paragraph Title Page

Chapter 1 - General Information

1.i Introduction ............................................................................................ 1- 1

1.2 Depot Repairable Assemblies/Subassemblies ........................................ 1-1

1.3 Depot Repair Facility Requirements ...................................................... 1-2

1.4 Tools and Test Equipment ..................................................................... 1-2

1.5 Consumable Material ............................................................................. 1-3

1.6 Related Publications ............................................................................... 1-6

1,7 Standard Shop Practices ......................................................................... 1-7

1.7.1 Unpacking ........................................................................................... 1 7

1.7.1.1 Special Handling Precautions ......................................................... 1-7

1.7.1.2 Unpacking Procedure ...................................................................... 1-7 1,7,2 Packing ............................................................................................... 1-8 1.7,2.1 Special Handling Precautions ......................................................... 1-9

1.7.2.2 Packing Procedure ........................................................................... 1-9

1.7.3 Examination ........................................................................................ 1-9

1.7.3.1 Hardware and Electrical Components ............................................. 1-10

1.7.3.2 Cables, Wires, and Connectors ....................................................... 1-10

1.7.3.3 Placards and Markings .................................................................... 1-10 1.7,4 Cleaning ..............................................................................................I-i0

1.7.4.1 Cleaning Moderately Contaminated Items ...................................... 1-10

1.7.4.2 Cleaning Highly Contaminated Items ............................................. 1-11

1.7.5 Disassembly and Reassembly ............................................................. 1-12 1.7.5,1 Electrostatic Discharge (ESD) Precautions ..................................... 1-13 1,7,5.2 Component Location ....................................................................... 1-13 1,7.5.3 Wire Removal ................................................................................. 1-13

1.7.5A Component Mounting ..................................................................... 1-13

1.7.5.5 Threaded Hardware and Component Mounting .............................. 1-13

1.7.5.6 SMA Connector Torqueing ............................................................. 1-13 1,8 Repair Notes ........................................................................................... 1- 13

1.8.1 General RF Tuning Procedure ............................................................ 1-14 1.8.1,1 Tuning Diagram .............................................................................. 1-16

1.8.1.2 Tuning Procedure ............................................................................ 1-19 1.8.1,3 General Foil InstaIlation .................................................................. 1-19

1.8.1.3.1 Indium Foil Preparation and Installation ..................................... 1-23

1.8.1.3.2 Indium Foil Removal ................................................................... 1-24

1.8.1.3.3 Tuning Foil Preparation and Installation ..................................... 1-924 1,8,2 Application of Low Outgassing Dielectric Epoxy Adhesive

(PDS53320LG) ............................................................................... 1-25

1.8.3 Application of Silver Filled Epoxy Adhesive (M53311EQ) .............. 1-26

(31July1998) v

TI6340.56

TABLE OF CONTENTS--(Continued)

Paragraph Title Page

1.8.4 Application of Dielectric Thermally-Conductive Epoxy Adhesive (M53320TW) .................................................................................. 1-27

1.8.5 Application of White RTV Silicone Rubber Adhesive (M45793HB) or Clear RTV Silicone Rubber Adhesive (M45793FL) .................. 1-28

1.8.6 Application of Thread-Locking Adhesive (M53320UA or

M53320UC) .................................................................................... 1-28

1.9 Typical Test Procedure ........................................................................... 1-29 1,9,1 Computer Typographic Conventions .................................................. 1-29

1.9.2 Test Executive Program Initialization ................................................ 1-30 1.9,3 Test Executive Program Exit .............................................................. 1-36

1.10 Troubleshooting ..................................................................................... 1-36

Chapter 2 -PreampIifier Assembly PN 3D56069G01 Repair

2.1 Scope ...................................................................................................... 2-1

2.2 Tools and Test Equipment ..................................................................... 2-2

2.3 Consumable Material ............................................................................. 2-2

2,4 Disassembly ........................................................................................... 2-3 2,5 Examination and Cleaning ..................................................................... 2-3

2.6 Repair and Replacement ......................................................................... 2-3

2.7 Reassembly ............................................................................................. 2-3

2.8 Test Description ..................................................................................... 2-4

2.8.1 Performance Tests

2.8.1.1 Test 0 - RF Track Check (Preqid Only)

2,8,1,2 Test 1 - Regulator Check (Pre-lid Only) 2,8,1,3 Test 2 - Class A Tuning (Pre-lid Only) ........................................... 2-5 2.8.1,3.1 Amplifier Power Output .............................................................. 2-5

2.8.1.3.2 A3R59 Adjustment ...................................................................... 2-5 2,8.1.3,3 Spurious Emissions ..................................................................... 2-5 2.8,1.3.4 Oscillations and Pulse Integrity ................................................... 2-5

2.8.1.3.5 Exiting Class A Tuning ............................................................... 2-5

2.8.1.4 Test 3 - Class C Tuning (Pre-lid Only) ........................................... 2-5

2.8.1.4.1 Amplifier Power Output .............................................................. 2-6

2.8.1.4.2 Collector Voltage Adjustment ..................................................... 2-6

2.8.1.4.3 Spurious Emissions ..................................................................... 2-6 2.8.1A.4 Oscillations and Pulse Integrity ................................................... 2-6 2.8.1.4,5 Exiting Class C Tuning ............................................................... 2-6 2,8,1,5 Test 4 - Input Filter Return Loss Test ............................................. 2-6 2,8,1,5,1 Return Loss At 1215 MHz .......................................................... 2-6 vi (31July1998)

" " TABLEOFCONTENTS--(Continued)

Paragraph Title Page

2.8.1.5.2 Remm Loss At 1250 MHz .......................................................... 2-6

2.8.1.5.3 Return Loss At 1300 MItz .......................................................... 2-7

2.8.1.5.4 Return Loss At 1350 MHz .......................................................... 2-7

2.8.1.5.5 Return Loss At 1400 MHz .......................................................... 2-7

2.8.1.6 Test 5 - PRF Limiting Test ............................................................. 2-7

2.8.1.7 Test 6 - RF Disable Test ................................................................. 2-7

2.8.1.8 Test 7 - Pulse Droop Test ................................................................ 2-7

2.8.1.8.1 Pulse Droop At 1215 MHz .......................................................... 2-7 2.8,1.8.2 Pulse Droop At 1300 MHz .......................................................... 2-7

2.8.1.8.3 Pulse Droop At 1400 MHz .......................................................... 2-8

2.8.1.9 Test 8 - Narrow Sweep Band Spurious Emissions Test .................. 2-8 2.8A,9.1 Input Power Level of-4.8 dBm At 1215 MHz ............................ 2-8

2.8.1.9.2 Input Power Level of -4.8 dBm At 1250 MHz ............................ 2-8

2.8.1.9.3 Input Power Level of-4.8 dBm At 1300 MHz ............................ 2-8

2.8.1.9.4 Input Power Level of -4.8 dBm At 1350 MHz ............................ 2-8

2.8.1.9.5 Input Power Level of -4.8 dBm At 1400 MHz ............................ 2-8

2.8.1.9.6 Input Power Level of -1.7 dBm At 1215 MHz ............................ 2-8 2.8.1.9,7 Input Power Level of -1.7 dBm At 1250 MHz ............................ 2-9

2.8.1.9.8 Input Power Level of-1.7 dBm At 1300 MHz ............................ 2-9

2.8.1.9.9 Input Power Level of -1.7 dBm At 1350 MHz ............................ 2_9

2.8.1.9.10 Input Power Level of-l.7 dBmAt 1400 MHz ............................ 2-10

2.8.1.9.11 Input Power Level of +1.4 dBm At 1215 MHz ........................... 2-10 2.8.1.9,12 Input Power Level of +1.4 dBm At 1250 MHz ........................... 2-10

2.8.1.9.13 Input Power Level of +1.4 dBm At 1300 MHz ........................... 2-10

2.8.1.9.14 Input Power Level of +1.4 dBm At 1350 MHz ........................... 2-10

2.8.1.9.15 Input Power Level of +1.4 dBm At 1400 MHz ........................... 2-10 2.8.1,10 Test 9 - Wide Sweep Band Spurious Emissions Test ..................... 2-10 2,8.1.10.1 Input Frequency of 1215 MHz .................................................... 2-10

2.8.1.10.2 Input Frequency of 1250 MHz .................................................... 2-10

2.8.1.10.3 Input Frequency of 1300 MHz .................................................... 2-10

2.8.1.10.4 Input Frequency of 1350 MHz .................................................... 2-11

2.8.1.10.5 Input Frequency of 1400 MHz .................................................... 2-11

2.8.1.11 Test 10 - Monitor Port Test ............................................................. 2-11 2,8.tA1,1 Monitor Port Test At 1215 MHz ................................................. 2-12 2,8.1.11.2 Monitor Port Test At 1250 MHz ................................................. 2-12

2.8.1.11.3 Monitor Port Test At 1300 MHz ................................................. 2-12

2.8.1.11.4 Monitor Port Test At 1350 MHz ................................................. 2-12

2.8.1.11.5 Monitor Port Test At 1400 MHz ................................................. 2-12

2.8.1.12 Test ll - Output Power Test ........................................................... 2-12 ", 2.8.1.12.1 Input Power Level of-4.8 dBm At 1215 MHz ............................ 2-12

(31July1998) vii

TABLEOFCONTENTS--(Continued) <

Paragraph Title Page

2.8.1.12.2 Input Power Level of -4.8 dBm At 1250 MHz ............................ 2-12 2.8.1.12,3 Input Power Level of -4.8 dBm At 1300 MHz ............................ 2-12

2.8.1.12.4 Input Power Level of-4.8 dBm At 1350 MHz ............................ 2-12

2.8.1.12.5 Input Power Level of -4.8 dBm At 1400 MHz ............................ 2-12 2,8,1.12,6 Input Power Level of-1.7 dBm At 1215 MHz ............................ 2-13 2.8,1.12,7 Input Power Level of -1,7 dBm At 1250 MHz ............................ 2-13 2,8,1,12.8 Input Power Level of-l,7 dBm At 1300 MHz ............................ 2-13 2.8,1,12,9 Input Power Level of-l,7 dBm At 1350 MHz ............................ 2-13 2.8.1.12,10 Input Power Level of-l.7 dBm At 1400 MHz ............................ 2-13

2.8.1.12.11 Input Power Level of +1.4 dBm At 1215 MHz ........................... 2-13 2,8,1,12.12 Input Power Level of +1.4 dBm At 1250 MHz ........................... 2-13 2.8.1.12,13 Input Power Level of +1.4 dBm At 1300 MHz ........................... 2-13 2.8.1.12,14 Input Power Level of +1.4 dBm At 1350 MHz ........................... 2-13 2.8,1.12.15 Input Power Level of+l.4 dBm At 1400 MHz ........................... 2-14 2,8.1.13 Test 12 - Insertion Phase Test ......................................................... 2-14 2,8.2 Diagnostic Tests ......................................... :....................................... 2-14 2,9 Test Procedure ........................................................................................ 2-14

2.10 Troubleshooting ..................................................................................... 2-18 ,- 2,11 Assembly Drawings and Parts Lists ....................................................... 2-18

2.12 Wire Data ............................................................................................... 2-19

Chapter 3 - Lookdown Driver Assembly PN 3D56075G01 Repair

3.1 Scope ...................................................................................................... 3-1

3.2 Tools and Test Equipment ..................................................................... 3-2

3.3 Consumable Material ............................................................................. 3-2 3,4 Disassembly ........................................................................................... 3-3

3.5 Examination and Cleaning ..................................................................... 3-3

3.6 Repair and Replacement ......................................................................... 3-4

3.7 Reassembly ............................................................................................. 3-4

3.8 Test Description ..................................................................................... 3-4 3.8,1 Performance Tests .............................................................................. 3-4 3.8,1.1 Test 0 _ Power Supply Test ............................................................. 3-5 3.8,1,2 Test 1 - Pulse Integrity Test ............................................................ 3-5 3.8.1,3 Test 2 - BITE/Diode Detection Test ............................................... 3-6 3.8.1.3,1 BITE/Diode Detection Module 1 ................................................ 3-6 3.8,1.3.2 BITE/Diode Detection Module 2 ................................................ 3-6 3.8,1.3.3 BITE/Diode Detection Module 3 ................................................ 3-6 3,8,1.3.4 BITE/Diode Detection Module 4 ................................................ 3-6 3,8,1,3,5 BITE/Diode Detection UART ..................................................... 3-6 < viii (31 July 1998)

Paragraph Title Page

3.8A.3,6 BITE/Diode Detection 7,5 VREF ................................................ 3-6

3.8.1.3,7 BITE/Diode Detection Module 1 With No tLF Input .................. 3-7

3.8.1.3.8 BITE/Diode Detection Module 2 With No RF Input .................. 3-7

3.8.1.3.9 BITE/Diode Detection Module 3 With No RF Input .................. 3-7

3.8.1.3.10 BITE/Diode Detection Module 4 With No RF Input .................. 3-7 3,8.1.3.11 BITE/Diode Detection UART With No RF Input ....................... 3-7

3.8.1.3.12 Bl_E/Diode Detection 7.5 VPdEF With No RF Input ................. 3-8

3.8.1.4 Test 3 - Return Loss Test ................................................................ 3-8

3.8.1.4.1 J14 Return Loss At 1215 MHz .................................................... 3-8

3.8.1.4.2 J14 Return Loss At 1400 MHz .................................................... 3-8

3.8.1.5 Test 4 - RF Power Output of J 11 [36V] Test .................................. 3-8

3.8.1.5.1 RF Power Output of Jll [36V] At 1215 MHz ............................ 3-8

3.8.1.5.2 RFPower Output of Jll [36V] At 1250 MHz ............................ 3-8

3.8.1.5.3 RF Power Output of J11 [36V] At 1300 MHz ............................ 3-8

3.8.1.5.4 RF Power Output of Jll [36V] At 1350MHz ............................ 3-8

3.8.1.5.5 RFPower Output of Jlt [36V] At 1400 MHz ............................ 3-9 3.8,1-6 Test 5 RF Power Output of J 11 [38V] Test .................................... 3-9 3,8.1.6.1 RF Power Output of Jll [38V] At 1215 MHz ............................ 3-9 3,8.1.6.2 RF Power Output of J11 [38V] At 1250 MHz ............................ 3r9

3.8.1.6.3 P,.FPower Output of Jll [38V] At 1300MHz ............................ 3-9 3,8.1,6,4 P,F Power Output of 311 [38V] At 1350 MHz ............................ 3-9 3.&1,6,5 R_FPower Output of Jll [38V] At 1400 MHz ............................ 3-9 3,8.1.7 Test 6 - RF Power Output of J11 [40V] Test .................................. 3-9

3.8.1.7.1 RF Power Output of Jll [40V] At 1215 MHz ............................ 3-9

3.8.1.7.2 RF Power Output of Jll [40V] At 1250 MHz ............................ 3-9

3.8.1.7.3 RF Power Output ofJll [40V] At 1300 MHz ............................ 3-9

3.8.1.7.4 RF Power Output of J 11 [40V] At 1350 MHz ............................ 3-9

3.8.1.7.5 RF Power Output of Jll [40V] At 1400 MHz ............................ 3-10

3.8.1.8 Test 7 - Pulse Droop Test ................................................................ 3-10

3.8.1.8.1 Pulse Droop At 1215 MHz .......................................................... 3-10

3.8.1.8.2 Pulse Droop At 1300 MHz .......................................................... 3-10 3,8.1.8,3 Pulse Droop At 1400 MHz .......................................................... 3-10

3.8.1.9 Test 8 - Spurious Emissions Test .................................................... 3-10

3.8.1.10 Test 9 - Monitor Port Measurements .............................................. 3-10

3,8.1.10.1 Power Output of P1 At 1215 MHz .............................................. 3-10

3.8.1.10.2 Power Output of P1 At 1300Mttz .............................................. 3-10 3,8.1.10.3 Power Output of P1 At 1400 MHz .............................................. 3-10 3,8.1.11 Test 10 - RF Power Output of J10 [36V] Test ................................ 3-10

3.8.1.11.1 RF Power Output of J10 [36V] At 1215 MHz ............................ 3-11

3.8.1.11.2 RF Power Output of J10 [36V] At 1250 MHz ............................ 3-11

(31July1998) ix

Para_aph Title Page

3.8.1.11.3 RF Power Output of I10 [36V] At 1300 MHz ............................ 3-11

3.8.1.11.4 tLF Power Output of J10 [36V] At 1350 MHz ............................ 3-11

3.8.1.11.5 RF Power Output of J 10 [36V] At 1400 MHz ............................ 3-11

3.8.1.12 Test 11 - RF Power Output of J10 [38V] Test ................................ 3-11

3.8.1.12.1 RF Power Output of J10 [38V] At 1215 MHz ............................ 3-11

3.8.1.12.2 RF Power Output of J10 [38V] At 1250 MHz ............................ 3-i 1

3.8.1.12.3 RF Power Output of J10 [38V] At 1300 MHz ............................ 3-11

3.8.1.12.4 RF Power Output of J10 [38V] At 1350 MHz ............................ 3-11

3.8.1.12.5 RF Power Output of J10 [38V] At 1400 MHz ............................ 3-11

3.8. I. 13 Test 12 - RF Power Output of J10 [40V] Test ................................ 3-11

3.8.1.13.1 RF Power Output of J10 [40V] At 1215 MHz ............................ 3-12

3.8.1.13.2 RF Power Output of J10 [40V] At 1250 MHz ............................ 3-12

3.8.1.13.3 RF Power Output of J10 [40V] At 1300 MHz ............................ 3-12

3.8.1.13.4 RF Power Out:put of J10 [40V] At 1350 MHz ............................ 3-12

3.8.1.13.5 RF Power Output of J10 [40V] At 1400 MHz ............................ 3-12

3.8.2 Diagoostic Tests ................................................................................. 3-12

3.9 Test Procedure .......................................................... ,............................. 3-12

3.10 Troubleshooting ..................................................................................... 3-15

3.11 Assembly Drawings and Parts Lists ....................................................... 3-15

3.12 Wire Data ............................................................................................... 3-16

Chapter 4 _ Power Module CCA PN 3D56076GO1, G02 Repair

4.1 Scope ...................................................................................................... 4-1

4.2 Tools and Test Equipment ..................................................................... 4-1

4.3 Consumable Material ............................................................................. 4-1

4.4 Disassembly ........................................................................................... 4-2

4.5 Examination and Cleaning ..................................................................... 4-2

4.6 Repair and Replacement ......................................................................... 4-2

4.7 Reassembly ............................................................................................. 4-3

4.8 Test Description ..................................................................................... 4-3

4.8.1 Performance Tests .............................................................................. 4-3

4.8.1.1 Test 0 - Return Loss Test ................................................................ 4-3

4.8.1.1.1 Q1 Remm Loss At 1215 MHz ..................................................... 4-3

4.8.1.1.2 Q1 Return Loss At 1250 MHz ..................................................... 4-3

4.8.1.1.3 Q1 Retmrn Loss At 1300 MHz ..................................................... 4-3

4.8.1.1.4 Q1 Return Loss At 1350 MHz ..................................................... 4-3

4.8.1.1.5 Q1 Remm Loss At 1400 MHz ..................................................... 4-3

4.8.1.2 Test 1 - BITE/Cap Test

4.8.1.2.1 BITE/Cap Input Voltage .............................................................. 4-4

.J x (31 July 1998)

TABLEOFCONTENTS--(Continued)

Paragraph Title Page

4.8.1.2.2 BITE/Cap Output Volgate ........................................................... 4-4

4.8.1.2.3 BITE/Cap Droop ......................................................................... 4-4

4.8.1.3 Test 2 - Output Power Test ............................................................. 4-4

4.8.1.3.1 Output Power At 1215 MHz ....................................................... 4-4

4_8_1.3.2 Output Power At 1250 MHz ....................................................... 4-4

4.8.1.3.3 Output Power At 1300 MHz ....................................................... 4-4

4.8.1.3.4 Output Power At 1350 MHz ....................................................... 4-4

4.8.1.3.5 Output Power At 1400 MHz ....................................................... 4-4

4.8.1.3.6 Pulse Integrity .............................................................................. 4-5

4.8.1.4 Test 3 - Output Flatness Test .......................................................... 4-5

4.8.1,4,1 Output Flatness At I215 MHz ..................................................... 4-5

4.8.1.4.2 Output Flatness At 1300 Mtlz ..................................................... 4-6

4.8.1.4.3 Output Flatness At 1400 MHz ..................................................... 4-6

4.8.1,5 Test 4 Average Current Draw Test ................................................. 4-6

4,8.1-5.1 Average Current Draw At 1215 MHz ......................................... 4-6

4.8.1.5.2 Average Current Draw At 1300 MHz ......................................... 4-6

4.8.1.5.3 Average Current Draw At 1400 MHz ......................................... 4 6

4.8.1.6 Test 5 - Insertion Phase Measurement ............................................ 4-6

4,8,1,7 Test 6 - Spurious Emissions Test .................................................... 4-6

4,8,I.7.1 Wide Band Spurious Emissions Test .......................................... 4-6

4.8.1.7.2 Narrow Band Spurious Emissions Test ....................................... 4-6

4,8.2 Diagnostic Tests ................................................................................. 4-7

4.8.2.1 Testing ............................................................................................. 4-7

4.8.2.2 Tuning ............................................................................................. 4-7

4,8,2,2.1 Circuit Checks ............................................................................. 4-7

4.8.2.2.1.1 Measurements/Tuning ............................................................. 4-7

4.8.2.2.1.i.1 Return Loss ($II) ................................................................. 4-7

4.8.2.2,1,1,2 Insertion Phase ($21) ........................................................... 4-9

4, 8,2,2,1,1,3 Combined Output Power ...................................................... 4-9

4.8.2.2.1.1.4 Transistor Current Tuning .................................................... 4-11

4.8.2.2.1.1.5 Tuning Check ....................................................................... 4-11

4.8.2.2.1.1.5.1 Insertion Phase Angle ....................................................... 4_11 4.8.2.2.1.1,5,2 Transistor Current ............................................................. 4-11

4,8,2,2.2 Tuning Location Restrictions ...................................................... 4-12 4,9 Test Procedure ........................................................................................ 4-12

4.10 Troubleshooting ..................................................................................... 4-14

4.11 Assembly Drawings and Parts Lists ....................................................... 4-14

4.12 Wire Data ............................................................................................... 4-14

(31July1998) xi

TABLEOFCONTENTS--(Continued) _ "

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Chapter 5 - Power Module CCA PN 3D62739G01 Repair

5.1 Scope ...................................................................................................... 5-1

5.2 Tools and Test Equipment ..................................................................... 5-1

5.3 Consumable Material ............................................................................. 5-1

5.4 Disassembly ........................................................................................... 5-2

5.5 Examination and Cleaning ..................................................................... 5-2

5.6 Repair and Replacement ......................................................................... 5-2

5.7 Reassembly ............................................................................................. 5-3

5.8 Test Description ..................................................................................... 5-3

5.8.1 Performance Tests .............................................................................. 5-3

5.8.1.1 Test 0 - Return Loss Test ................................................................ 5-3

5.8.1.1.1 Q1 Return Loss At 1215 MHz ..................................................... 5-3

5.8.1.1.2 Q1 Return Loss At 1250 MHz ..................................................... 5-3

5.8.1.1.3 Q1 Return Loss At 1300 MHz ..................................................... 5-3

5.8.1.1.4 Q1 Return Loss At 1350 MHz ..................................................... 5-3 5,8.1.1.5 Q1 Return Loss At 1400 MHz ..................................................... 5-4

5.8.1.2 Test 1 - BITE/Cap Test ................................................................... 5-4 • -

5.8.1.2.1 BITE/Cap Input Voltage .............................................................. 5-4

5.8.1.2.2 BITE/Cap Output Voltage ........................................................... 5-4

5.8.1.2.3 BITE/Cap Droop ......................................................................... 5-4

5.8.1.3 Test 2 - Output Power Test ............................................................. 5-4

5.8.1.3.1 Output Power At 1215 MHz ....................................................... 5-4

5.8.1.3.2 Output Power At 1250 MHz ....................................................... 5-4

5.8.1.3.3 Output Power At 1300 MHz ....................................................... 5-4

5.8.1.3.4 Output Power At 1350 MHz ....................................................... 5-4

5.8.1.3.5 Output Power At 1400 MHz ....................................................... 5-4

5.8.1.3.6 Pulse Integrity .............................................................................. 5-4

5.8.1.4 Test 3 - Output Flatness Test .......................................................... 5-5

5.8.1.4.1 Output Flamess At 1215 MHz ..................................................... 5-5

5.8.1.4.2 Output Flatness At 1300 MHz ..................................................... 5-5

5.8.1.4.3 Output Flamess At 1400 MHz............................ 5-6

5.8.1.5 Test 4 - Average Current Draw Test ............................................... 5-6

5.8.1.5.1 Average Current Draw At 1215 MHz ......................................... 5-6

5.8.1.5.2 Average Current Draw At 1300 MHz ......................................... 5-6

5.8.1.5.3 Average Current Draw At 1400 M/-Iz ......................................... 5-6

5.8.1.6 Test 5 - Insertion Phase Measurement ............................................ 5-6

5.8.1.7 Test 6 - Spurious Emissions Test .................................................... 5-6

5.8.1.7.1 Wide Band Spurious Emissions Test .......................................... 5-6

5.8.1.7.2 Narrow Band Spurious Emissions Test ....................................... 5-6 xii (31July1998)

" TABLEOFCONTENTS--(Continued)

Paragraph Title Page

5.8.2 Diagnostic Tests ................................................................................. 5-6

5.8.2.1 Testing ............................................................................................. 5-7

5.8.2.2 Tuning ............................................................................................. 5-7

5.8.2.2.1 Circuit Checks ............................................................................. 5-7

5.8.2.2.1.1 MeasurementsfIYuning ............................................................. 5-7 5.8.2.2,1.1.1 Input Return Loss Tuning ..................................................... 5-7

5.8.2.2.1.1.2 Setting Drive to the Four Output Transistors ....................... 5-7

5.8.2.2.1.1.3 Equalizer Leg Adjustment .................................................... 5-10

5.8.2.2.1.1.4 Output Transistor Tuning for Power and Flatness ............... 5-11

5.8.2.2.1.1.5 Output Transistor Phasing Adjustment ................................ 5-11

5.8.2.2.1.1.6 Insertion Phase ..................................................................... 5-12 5.8.2,2.2 Tuning Location Restrictions ...................................................... 5-12 5,9 Test Procedure ........................................................................................ 5-13

5.10 Troubleshooting ..................................................................................... 5-14

5.11 Assembly Drawings and Parts Lists ....................................................... 5-14

5.12 Wire Data ............................................................................................... 5-14

APPENDIXES

A List of Acronyms and Abbreviations ..................................................... A-1 B Assembly Drawings ............................................................................... B- 1 C Parts Lists ............................................................................................... C- 1 D Wire Data ............................................................................................... D-1

(31 July 1998) xiii

LIST OF ILLUSTRATIONS

Figure Title Page

1-1 Reusable Container ................................................................................ 1-8

1-2 Tuning Wand Fabrication ....................................................................... 1-15 1-3 Sample Tuning Diagram ........................................................................ 1-17 1-4 Tuning Diagram Interpretation ............................................................... 1- 18 1-5 Foil Installation ...................................................................................... 1-20 1-6 Select Test Menu .................................................................................... 1-31

1-7 Data Control Dialog Box ........................................................................ 1-33 1-8 Select UUT Part No. Dialog Box ........................................................... 1-33 1-9 Text Input Dialog Box (Program Initialization) ..................................... 1-34 1-10 Example Test Selection Menu, Test Log Display, and Test

Status Display ..................................................................................... 1-35 1-11 Test Failure Window .............................................................................. 1-37

1-12 Test Input Dialog Box (Program Exit) ................................................... 1-37

2-1 Narrow Band Sweep Spurious Emissions Spectrum Criteria ................ 2-9 2-2 Wide Band Sweep Spurious Emissions Spectnma Criteria .................... 2-11

3-1 Criteria for Rejection of Pulse Integrity Test ......................................... 3-5

4-1 Criteria for Rejection of Pulse Integrity Test ......................................... 4-5 4-2 Location of Tuning Stubs and No Tuning Areas ................................... 4-8

5-1 Criteria for Rejection of Pulse Integrity Test ......................................... 5-5 5-2 Location of Tuning Stubs and No Tuning Areas ................................... 5-8 5-3 Capacitor Re-orientation ........................................................................ 5-11 xiv (31July1998)

LIST OF TABLES

Number Title Page

1-1 UUTs Tested on PAMTS ....................................................................... 1-2

1-2 Test Equipment and Tools Required ...................................................... 1-2 1-3 Consumable Material Required .............................................................. 1-3 1-4 Related Publications ............................................................................... 1-6

1-5 Cleaning Contaminated Items ................................................................ 1-I0

2-1 Consumable Material Required for PN 3D56069G01 ........................... 2-2 2-2 Performance Tests for PN 3D56069G01 ............................................... 2-15

3-1 Consumable Material Required for PN 3D56075GO1 ........................... 3-2 3-2 Performance Tests for PN 3D56075G01 ............................................... 3-13

4-1 Consumable Material Required for PN 3D56076G01, G02 .................. 4-2 4-2 Performance Tests for PN 3D56076G01, G02 ....................................... 4-13

5-1 Consumable Material Required for PN 3D62739G01 ........................... 5-2 5-2 Performance Tests for PN 3D62739G01 ............................................... 5-13

(31 July 1998) xv/xvi

CHAPTER 1

GENERAL INFORMATION

1.1 INTRODUCTION.- This repair manual contains depot-level maintenance for the Air Route Surveillance Radar-Model 4 (ARSR-4) units under test (UUTs) tested on the Power Amplifier Module Test Set (PAMTS). In some instances, the test performed on the PAMTS UUT also tests other PAMTS subassemblies that are part of the UUT. The PAMTS automatically runs a series of performance tests which determine the operational status of the site replaceable lowest replaceable unit (LRU) under test. If the LRU fails a performance test, the operator can initiate on-line diagnostic tests to isolate faults to a defective circuit or component. A mouse, keyboard, and display provide the operator/equipment interface. Information provided in this chapter includes a list of the PAMTS UUTs tested on the PAMTS; depot repair facility requirements; lists of tools, test equipment, and consumable materials needed to test and repair the LRUs; a list of related publications; and standard shop practices that apply to the repair of the LRUs, Also provided are procedures for initializing and exiting the tests on the PAMTS, and general troubleshooting information for isolating and correcting faults on defective LRUs. Specific repair data for each of the UUTs is provided in chapters 2 through 5. The chapters are arranged in alphanumeric order by UUT part number. Repair data provided in each individual chapter includes lists of tools, test equipment, and consumable material required; information and instructions on disassembly, examination, cleaning, repair, replacement, and reassembly; operational test information; and troubleshooting information. All acronyms and abbreviations used in this manual are defmed in Appendix A. Assembly drawings showing the component locations and part identification for each LRU are contained in Appendix B. Parts lists providing complete parts ordering information for each LRU are contained in Appendix C. Wiring data for applicable LRU cables is contained in Appendix D. Printed circuit track layouts are shown on assembly drawings which are contained in Appendix B. The schematic diagram and technical description for each LRU are provided in the appropriate chapter of the ARSR-4 System Site-Replaceable LRUs Schematics and Descriptions Instruction Book, TI 6340.26.

1.2 DEPOT REPAIRABLE ASSEMBLIESSUBASSEMBLIES.- Table 1-I contains a list of the

UIYTs tested on the PAMTS. The fLrst column of the table contains the part number of the UUT.

The second column contains the ARSR-4 System reference designation of the UUT, and the third column contains the name of the UUT. The fourth column lists the number of the chapter in this manual that contains the depot repair data. The fifth column identifies the chapter number of the ARSR-4 System Site-Replaceable LRUs Schematics and Descriptions Instruction Book that contains the schematic diagram and technical description for each UUT.

(31July1998) 1-1

Ronald Breaux Highlight

Table 1-1. UUTs Tested on PAMTS

ARSR-4 System Repair TI 6340.26 PartNumber RefDes Name Chapter Chapter

3D56069G01 9A2AR2,3, 4 Preamplifierassembly 2 52

3D56075G01 9A2A6 Lookdown driver assembly 3 49

3D56076G0 l, G02 various CCA, power module 4 49, 52

3D62739G01 various CCA, power module 5 49, 52 iU iii

1.3 DEPOT REPAIR FACILITY REQUIR_EMENTS.- There are no special depot repair facility requirements unique to any of the UUTs. Testing shall be performed at an ambient temperature of 25 (+15, -5) degrees Celsius, barometric pressure of 30 (+_2) inches of mercury, and relative humidity of up to 90 percent room ambient.

1.4 TOOLS MID TEST EQUIPMENT.- The tools and test equipment required for testing, troubleshooting and maintenance of all UUTs are listed in Table 1-2. Common hand tools are not listed.

Table 1-2. Test Equipment and Tools Required

Part Number/ Manufacturer

Qty Name Type/M0del/Spec. (CAGE) Remarks

1 PAM Test Console AD421401G01 Northrop Used for UUT test and Assembly Grumman repair

(18323)

1 PAMFixture AD421410G01 Northrop Used for test and repair Assembly Grumman ofPowerAmplifier

(18323) ModuleCCA

1 Cooling Fixture AD421415G01 Northrop Used for test and repair Assembly Gmmman ofPowerAmplifier

(18323) ModuleCCA

1 Cable Assembly, AD421424G01 Northrop Used for test and repair Preamp Grumman ofPreamplifier

(18323) Assembly

1 Cable Assembly, AEM21425G01 Northrop Used for test and repair Lookdown Gmmman ofLookdownDriver

Driver (18323) Assembly

1 Phase Reference AA421645G01 Northrop Used for test and repair Assembly Grum_rnan ofPowerAmplifier

(18323) ModuleCCA

1-2 (31July1998)

Table 1-2. Test Equipment and Tools Required--Continued i

Part Number/ Manufacturer

Qty Name Type/Model/Spec. (CAGE) Remarks

1 Cable Assembly, AD421965GO1 Northrop Used for test and repair semi-rigid Grumman ofPowerAmplifier

(18323) ModuleCCA

1 Cable Assembly, AD421966G01 Northrop Used for test and repair semi-rigid Grumman of PowerAmplifier

(18323) ModuleCCA

1.5 CONSUMABLE MATERIAL.- The consumable material required for the test and repair of the UU_s is listed in Table 1-3. Equivalent material may be substituted.

Table 1-3. Consumable Material Required ., ,,, ,,t ,,,, ,, ,,,,.,.,., Part Number/ Manufacturer

Name Type/Model/Spec. (CAGE) Remarks

Adhesive, epoxy, PDS53320LG; NolXhrop Grumman Used to mount dielectric,low (97942) componentstoa outgassing DOD-A-82720, Military substrateormodule

NSN 8040-01-080-1490; Specifications (81349)

Scotchweld 2216 B/A gray, Minnesota Mining NSN 8040-00-145-0019 and Manufacturing

(94960)

Adhesive, epoxy, M53311EQ; Northrop Grumman Used to mount silverfilled (97942) componentstoa

Ablebond 84-1LMI NB-1, Ablestik Laboratories substrate or module

NSN 8040-01-339-8655 (21109)

Adhesive, epoxy, M53320TW; Northrop Grumman Used to mount thermally- (97942) componentstoa conductive, Epo-Tek H74 Epoxy Technology substrate or module dielectric (33246)

Adhesive, M45793FL; Northrop Gmmman Used to bond and seal silicone, (97942) componentson rubber, RTV, MIL-A-46106, type I, clear, General Services substrate or module clear NSN 8040-00-225-4548; Administration

RTV3145clear, (80244) NSN 8040-00-117-8510 Dow Coming

(71984)

(31July1998) 1-3

Table 1-3. Consumable Material Required--Continued

Part Number; Manufacturer

Name Type/Model/Spec. (CAGE) Remarks

Adhesive, M45793HB; Northrop Grumman Used to bond and seal silicone (97942) componentsona rubber, RTV, MIL-A-46106, type I, General Services substrate or module white NSN 8040-00-118-2695; Administration

(80244)

RTV 162, GeneralElectric

NSN 8040-00-118-2695 (01139)

Adhesive, M53320UA; Northrop C_amman Used to lock threaded thread-locking (97942) hardwareand

MIL-S-46163, type II, General Services threaded components gradeM, Administration to a substrateor NSN 8030-01-054-3968; (80244) module

Loetite222, Loctite

NSN 8030-01-069-3046 (05972)

Catalyst, M54601BV; Northrop Grumman Used to repair surface polya_mide (97942) damage to base

Versamid125, Miller-Stephenson laminatesof

NSN 8030-00-893-4224 Chemical polyamide (18598) substrates, encapsulate components on a substrate or module, and bond tuning foil on substrates

Copper foil, PDS 13447CC; Northrop Grumman Used for substrate electro- (97942) tuning deposited PDS13447CC Atlantic Copper and tin-coated Brass

(tuningfoil) (4L694)

Cotton swab, M76700AB 11E; Northrop Grumman Used for cleaning and nonsterile (97942) sub_tratetuning wooden stick, M76700AB 11E Harwood Products 6-inch long

1-4 (31 July 1998)

Part Number/ Manufacturer

Name Type/Model/Spec. (CAGE) Remarks

Finger cot, latex M76502DA00C (small), NoIxhrop Grumman Used for handling clean M76502DA00D (97942) parts (medium), M76502DA00E (large), or M76502DA00F (extra large);

Vesler Cot 615, Bittner Rubber size 00C small, 00D (medium), 00 E (large), or 00F (extra large)

Indium foil PDS 14147AA; Northrop Grumman Used for substrate (97942) tuning

PDS1417AA IndiumCorp of America

(74858)

Isopropyl TT-I-735, grade A, Federal Used for general alcohol NSN 6810-01-136-7012 Specifications cleaning

(81348)

Liquiddetergent, MIL-D-16791 Federal Usedfor general general NSN 7930-00-282-9699 Specifications cleaning purpose (81348)

Primer MI1_-S-22473,grade N, General Services Used to prime threaded NSN 8030-00-900-2373; Administration hardware and

(80244) threadedcomponents HI?12, Hernon NSN 8030-00-900-2373 Manufacturing

(61603)

Resin, epoxy PDS53841AF; Northrop Grumman Used to repair surface (97942) damagetobase

Epon828, ShellOil laminatesof NSN 8030-00-086-1506 (54527) polyamide substrates, encapsulate components on a substrate or module, and bond tuning foil on substrates

(31July1998) 1-5

Part Number/ Manufacturer

Name Type/Model/Spec. (CAGE) Remarks

Solder, flux M17630AV; Northrop Gmmman Used for substrate cored, 60 SN/ (97942) tuning 40PB QQ-S-571; Federal

Specifications (81348)

Ersin 381 Multicore Solders

(03051) ,,,,,,,,,,, ,i,,,,,,,,,,,,,,, ,,,, ,,,,,,,,,,,,,,,,,,,,,

1.6 RELATED PUBLICATIONS.- All related publications required to support the test and repair of the UUTs are listed in Table 1-4.

Table 1-4. Related Publications

Publication

No. Title BriefDescription

TI 6340.26 ARSR-4 System Lookdown Driver Includes detailed technical

(from Unit 9) Site-Replaceable LRUs descriptions and schematics for Schematics and Descriptions lookdown driver PN 3D56075G01 Instruction Book, Chapter 49, and power module 3D56076G01, Volume49 G02

ARSR-4 System Preamplifier Assembly Includes detailed technical (from Unit 9) Site-Replaceable LRUs descriptions and schematics for Schematics and Descriptions preamplifier PN 3D56069G01 and Instruction Book, Chapter 52, power module 3D56076G01, G02 Volume 52

TI 6340.54 ARSR-4 System UUTs Tested on Includes depot-level repair data for GENRAD Test Set Depot regulator preamplifier PN Maintenance Repair Manual 706J535G01 (p/o preamplifier assembly PN 3D56069G01) and BITE CCA Pig 3D57241G01 (p/o lookdown driver PN 3D56075G01)

TI 6340.57 ARSR-4 System UUTs Tested on LLRF Includes depot-level repair data for Test Set Depot Maintenance Repair lookdown driver PN 3D56075G01 Manual (low power tests only), output monitor PN 3D57165G01 (pto preamplifier assembly PN 3D56069G01 and lookdown driver), and switch assembly PN 3D57264G01 (pit lookdown driver)

1-6 (31July1998)

Table 1-4. Related Publications--Continued

Publication

No. Title BriefDescription

TO 00-25-234 General Shop Practice Requirements for Includes standard shop practices for the Repair, Maintenance, and Test of the repair and test of electrical ElectricalEquipment equipment

1.7 STANDAgJ) SHOP PRACTICES.- The following paragraphs provide general repair information for the UUTs tested on PAMTS. The general repair information includes unpacking and packing procedures, examination and cleaning procedures, and disassembly and reassembly information. Instructions for unique repair are given in the repair chapter applicable to the particular LRU. Refer to TO 00-25-234, General Shop Practice Requirements for the Repair, Maintenance, and Test of Electrical Equipment, for detailed information and instructions for UUT repair.

1.7.1 Unpacking.- The following paragraphs provide general procedures for unpacking UUTs when they are received at the depot. Since these units are ESD sensitive, special handling precautions are included.

1.7.1.1 Special Handling Precautions.- When not being worked on or when being transported outside of protected areas, items shall be enclosed in ESD protective packaging or contain shunting devices that short all pins to case for protection from triboelectric charging, direct contact with charged objects, and electrostatic fields.

CAUTION

__ This unit containselectrostaticdischarge

(ESD) sensitive devices. Refer to DOD-STD- 1686 and DOD-HDBK-263 for proper ESD precautions to use when handling this unit. Failure to use proper ESD precautions could result in damage to ESD sensitive devices.

1.7.1.2 Unpacking Procedure.- To unpack UUTs, proceed as follows:

1. Place package to be opened on suitable work surface.

(31July1998) 1-7

CAUTION

The UUT is packaged in a reusable container. Refer to the opening instructions placarded on the side of the container before attempting to open the container. Failure to follow instructions could result in damage to the container or to the UUT inside.

2. Using knife, carefully cut along cutline on reusable container as shown in Figure 1-1.

TYPICALOPENING

INSTRUCTIONSLABEL

TYPICAL REUSABILITY

INSTRUCTIONSLABEL eLf[LINE

Figure 1-1. Reusable Container

3. Lift top of container. Set cover aside for later reuse.

4. Lift and remove packing material covering UUT. Set aside for later reuse.

5. Carefully lift UUT out of container and place on suitable work surface.

6. Place packing material back in container and set top in place. Set container aside for later reuse.

7. Using knife or scissors, carefully open plastic bag.

8. Remove UUT and place on suitable work surface.