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ATTACHMENT 1
MINIMUM REQUIREMENTS MATRIX
Number
Requirement
Type
Yes / No
Proposed Approach
3
Able to accept Government form DD1155 as purchase order
2
3
Accept documentation via email
2
3
Accept documentation via file transfer protocol (FTP)
2
3
Accept documentation via mailed compact disc (CD)
2
3
Accept documentation via mailed digital versatile disc DVD
2
3
Accept documentation via modem
2
3
Accept documentation via secure FTP
2
3
Accept purchase orders verbally (over the telephone)
2
3
Accept purchase orders via email
2
3
Manufacture Antenna (RF) PCBs
2
3
Manufacture logic PCBs
2
3
Manufacture Solder Stencils
2
3
Provide quotations via email
2
3
Provide quotations via telefax
2
3
Provide quote no more than one day after requested, for deliveries within one week.
2
3
Provide quote no more than three days after request, for deliveries of greater than one week.
2
3
Use drawings
2
3
Use Gerber files
2
3.1
PCB quantity 1 to infinite
2
3.2
Accept IPC-356A net list from Government
2
3.2
Conductive epoxy filled hole down to 0.008" diameter
2
3.2
Control trace impedances
2
3.2
Copper capped vias
2
3.2
Double sided PCBs
2
3.2
Drilled hole position drift less than 0.003" per 24 inch panel
2
3.2
Finished pad sizes match design files
2
3.2
Finished trace sizes match design files
2
3.2
Flex circuit PCBs
2
3.2
IPC-6012 Class 2
2
3.2
IPC-6013 Class 2
2
3.2
Mark with permanent sequential serial numbers
2
3.2
Mixed through hole and surface mount same board
2
3.2
Multi-layer PCBs
2
3.2
Non-conductive epoxy filled holes down to 0.008" diameter
2
3.2
PCB surface finish of ENIG
2
3.2
PCB surface finish of Gold fingers
2
3.2
PCB surface finish of Hard Gold
2
3.2
PCB surface finish of OSP
2
3.2
PCB surface finish of Silver
2
3.2
PCB surface finish of Soft Gold
2
3.2
PCB surface finish of Tin/Lead solder
2
3.2
Plated shut vias
2
3.2
Reworked IAW IPC-7711/7721
2
3.2
Rigid-Flex circuit PCBs
2
3.2
Screen-On solder paste (SIPAD)
2
3.2
Silkscreen markings on PCB
2
3.2
Single sided PCBs
2
3.2
Solder masking on PCB
2
3.2
Surface Mount Boards
2
3.2
Through Hole Boards
2
3.2
Trace pitch (spacing) down to 0.004"
2
3.2
Use provided IPC-356A net list to test finished PCBs
2
3.2
Verify trace impedances
2
3.2.1
Track Government furnished materials (GFM) IAW FAR 52.245-1
2
3.4
Deliver PCBs with turnaround of 24 hrs.
2
3.5
Documented quality control program
2
3.5
Quality program complies with IPC-6012
2
3.5
Quality program complies with IPC-6013
2
3.5
Quality program complies with IPC-A-600
2
3.6
Additional pricing factors
2
3.6
Standard pricing schema that at minimum includes parameters of number of layers, number of boards to be produced, number of holes per board, and a correction factor for delivery schedule.
2
3.7
Required certifications
2
3.7.1
Class 2
2
3.2.2
Support prototype PCB development
2
3.7.1.1
United States/Canada Joint Certification Program (JCP) REQUIRED
2
3.7.1.2
International Traffic in Arms Regulations (ITAR) Certification REQUIRED
2
3.7.1.3
ISO9000 compliance REQUIRED
2
3.2
BGA suitable pad patterns per IPC-6012
3
3.2
IPC-6012 Class 3A
3
3.2
IPC-6013 Class 3
3
3.2
LGA suitable pad patterns per IPC 6012
3
3.2
Provide physical cross section (micro-section) coupons
3
3.2.1
RF / Antenna boards IAW IPC-6012 Class 3
3
3.5
Able to conduct 100% inspection on class 3 PCBs
3
3.5
Electrical Test Certification of Conformance against gov provided IPC-356A net list (CDRL A001)
3
3.5
Manufacturer’s Material Test Report (CDRL A002)
3
3.5
Final Test Inspection Report (CDRL A002)
3
3.5
Inspectors certified to IPC-A-600
3
3.5
Micro section test report (CDRL A002)
3
3.5
Micro sectioned board / coupon
3
3.5
PCB Lot Certification of Conformance (CDRL A001)
3
3.5
Provide IPC-6012/6013 Class 3 boards
3
3.7.2
Class 3
3
3.7.2.1
United States/Canada Joint Certification Program (JCP) REQUIRED
3
3.7.2.2
International Traffic in Arms Regulations (ITAR) Certification REQUIRED
3
3.7.2.3
AS9100 Compliance REQUIRED
3
3.7.2.4
AS9100 Certification ENCOURAGED
3
3
Accept documentation via DoD controlled password protected download site (like AMRDEC SAFE)
ITAR
4.3
Quotes include at a minimum:
Q
4.4
Time and materials quote for support in calling our requirements in board designs involving new technology or processes.
Q
4.3.a
Price per board
Q
4.3.b
Price for non-recurring work (NRE) such as engineering and tooling
Q
4.3.c
Price for testing
Q
4.3.d
Price for complete order, including estimated shipping
Q
4.3.e
Proposed delivery date and/or alternate Lead Times
Q
4.3.f
If subcontracting is contemplated, the quote shall include
Q
4.3.f.1
Name, address of subcontractor
Q
4.3.f.2
Business size (reference FAR 19.102, Size Standards). If subcontractor is a small business, include any additional small business subcategories that the subcontractor represents
Q
4.3.f.3
NAICS Code for work or items provided by subcontractor
Q
4.3.f.4
Price (dollars)
Q
4.3.f.5
Percent of work
Q
4.3.f.6
Subcontractors must meet all Quality and Certification requirements noted in this contract
Q
3.1
Solder stencil quantity 1 to infinite
S
3.3
Aluminum stencils
S
3.3
Electro-formed stencils
S
3.3
Foil ONLY stencils
S
3.3
Framed solder paste stencils compatible with DEK VectorGuard systems
S
3.3
Framed solder paste stencils compatible with Essemtec Tucano stencil printer
S
3.3
Full size solder paste stencils
S
3.3
Hybrid (laser cut and chemically etched apertures) stencils
S
3.3
Kapton stencils
S
3.3
Laser cut stencils
S
3.3
mini solder paste stencil systems for rework
S
3.3
Mylar stencils
S
3.3
Prototype solder paste stencils
S
3.3
Relief stencils
S
3.3
Stacked stencils
S
3.3
Stainless steel stencils
S
3.3
Stencil surface finish of ENIG
S
3.3
Stencil surface finish of Gold fingers
S
3.3
Stencil surface finish of Hard Gold
S
3.3
Stencil surface finish of OSP
S
3.3
Stencil surface finish of Silver
S
3.3
Stencil surface finish of Soft Gold
S
3.3
Stencil surface finish of Tin/Lead
S
3.3
Stencil surface finish of various release materials
S
3.3
Stepped thickness stencils
S
File details come from the government source that posted it.
Updated .