Att 3 - MINOS TO 2 SOO-dtd 10 Aug 22.pdf

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Materials for Integrated Nano-electronic and Optoelectronic Structures (MINOS)
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FA865023S5012
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Attachment 3 Statement of Objectives – MINOS Task Order 02

Task Order Title: Research and Development of Electronic Materials for DAF Applications

Task Order Objectives: The objectives of this Task Order are associated with performing research & development (R&D) in wide-bandgap (WBG) semiconductors, ultra wide-bandgap (UWBG) semiconductors, magnetic, ferroic materials, digital & analog switching materials, as well as electronic materials integration, with an eye towards next-generation novel Intelligence, Surveillance and Reconnaissance (ISR) and Electronic Warfare (EW) systems for Department of the Air Force (DAF) applications. This includes, but is not limited to activities associated with thin film deposition processes, electronic/ferroic materials characterization processes, electrical, magnetic and microwave device characterization processes and modeling of electrical/magnetic material and devices. .

Required tasks and their objectives are delineated below.

Description of Work:

To accomplish the stated objectives, the contractor shall provide research, development, synthesis, modeling, testing and analytical resources necessary to ensure successful execution of the identified efforts. In addition, trade studies of technology in electronic materials and independent validation and verification of materials performance will be possible in all focus areas. Typical examples of the R&D activities within each application focus area contemplated are provided but are not limited to those below:

1. Program Management: Program Management: Provide the programmatic oversight necessary to plan, coordinate, schedule and report all activities in the performance of this effort. This includes all technical, financial and programmatic aspects including the timely and accurate accounting of all work performed.

2. WBG/UWBG Semiconductors for Power Electronics: Perform research & development associated with materials, devices, structures, and components associated with WBG and UWBG semiconductor materials for power electronics at frequencies from DC to microwave.

New state-of-the-art processes in materials growth, materials characterization, device modeling, equipment, and most importantly, appropriate people should be considered when performing research & development in UWBG/WBG materials and processes associated with power conversion and power amplification for low frequencies and microwave frequencies associated with ISR and EW components.

3. Ferroic Materials: Perform research & development associated with microwave materials, devices, structures, and components associated with ferroic materials, including resonant microwave magnetic materials, piezoelectric materials, and ferroelectric materials. New state-of-the-art processes in materials growth, microwave ferroic devices, material & device characterization, material & device modeling, and equipment, should be considered when performing research & development in ferroic materials and processes associated with RF and microwave ISR and EW components.

BAA# FA8650-23-S-5012 1 of 3 Statement of Objectives, Task Order 02 10 August 2022

4. Digital and Analog Switching Materials: Perform research & development associated with materials, devices, structures, and components associated with switching materials, including but not limited to insulator-metal transition materials, phase change materials, memristor materials, domain wall switching in ferroelectric materials and domain wall switching in magnetic materials. New state-of-the-art mechanisms, materials, devices, material & device characterization, material & device modeling, and equipment, should be considered when performing research & development in materials and processes associated with energy efficient computing components for ISR and EW.

5. Materials Integration: Perform research & development associated with the integration of electronic and magnetic materials. New state-of-the-art processes in materials growth, materials patterning, heterogeneous materials integration, device fabrication, materials integration characterization, and equipment should be considered in when performing research & development in materials integration associated with ISR and EW components.

6. [FUNDAMENTAL RESEARCH] Research community leverage and interaction: In order to harvest and leverage the significant fundamental research & development investment of DoD and government agencies in this technical area, the Government intends to partner and interact with these past, ongoing, and future efforts in a variety of ways. Pilot demonstration efforts, focused experimental activities, seedling efforts for future programs, visits, hosting onsite research activities, and consulting with external SMEs are among the anticipated modes of exploration that should be enabled through this activity. This component of the program will be maintained fundamental research.

7. Acquisition of Special Test Equipment: Perform purchasing of capital special test equipment for the new, continued, improved, and/or enduring capability to characterize electronic, photonic, optoelectronic and quantum materials and devices within the AFRL/RXE laboratories.

CLASSIFICATION:

The highest level of security classification of this Task Order is TOP SECRET.

DELIVERABLES:

A001 – DI-MISC-80711A/T – SCIENTIFIC AND TECHNICAL REPORTS – FINAL REPORT (ONE/R)

A002 – DI-FNCL-80331A/T – FUNDS AND MAN-HOUR EXPENDITURE REPORT (MTHLY)

A003 – DI-MGMT-81468A/T – CONTRACT FUNDS STATUS REPORT (CFSR) (QTRLY)

A004 – DI-MGMT-80368A/T – STATUS REPORT (QTRLY)

A005 – DI-ADMN-81373/T – PRESENTATION MATERIAL (ASREQ)

A006 – DI-MISC-80711A/T – SCIENTIFIC AND TECHNICAL REPORTS – DATA MANAGEMENT PLAN (ASGEN)

A007 – DI-IPSC-81488/T – COMPUTER SOFTWARE PRODUCT – SOURCE CODE (ASGEN)

A008 – DI-MISC-80652/T – TECHNICAL INFORMATION REPORT – SF 424 UPDATE (ANNLY)

A009 – DI-IPSC-81443A/T – SOFTWARE USER MANUAL (SUM) (ASGEN)

A010 – DI-IPSC-81448A/T – FIRMWARE SUPPORT MANUAL (FSM) (ASREQ)

A011 – SI-SESS-81248B/T – INTERFACE CONTROL DOCUMENT (ICD) (ASGEN)

A012 – DI-IPSC-81432A/T – SYSTEM/SUBSYSTEM DESIGN DESCRIPTION (SSDD) (ASREQ)

BAA# FA8650-23-S-5012 2 of 3 Statement of Objectives, Task Order 02

SECURITY REQUIREMENTS

OPERATIONS SECURITY (OPSEC)

The contractor shall participate in all activities associated with the disciplines of the organization’s Industrial Security, Information Security, Personnel Security, Operations Security (OPSEC), and Antiterrorism programs, following appropriate measures in each program as required for this particular contract. Security measures are required to reduce program vulnerability from successful adversary collection, exploitation of critical information, and violations of export control requirements.

The prime contractor shall ensure all subcontractors, if applicable, conform to these requirements as required by the prime contractor.

PROGRAM PROTECTION PLAN (PPP) REQUIREMENTS

Any potential critical program information (CPI) generated as part of this effort will be reviewed to determine the need for a PPP or to be included as part of an existing PPP.

BAA# FA8650-23-S-5012 3 of 3 Statement of Objectives, Task Order 02

Security REQUIREMENTS
Operations Security (OPSEC)

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