Att 1 - MINOS Basic IDIQ SOO-dtd 26 Aug 22.pdf

BAA# FA8650-23-S-5012 Statement of Objectives, Basic IDIQ

Attachment 1

STATEMENT OF OBJECTIVES – BASIC IDIQ

IDIQ Contract: FA8650-23-D-5400

Materials for Integrated Nano-electronic and Optoelectronic Structures (MINOS)

1.0 Background

USAF missions require sustained operations in extremely harsh environmental conditions. Material advances are needed to optimize mission success in the areas of electronic, photonic, optoelectronic and quantum materials. The Air Force Research Laboratory, Materials and Manufacturing Directorate, Electronic Materials Branch (AFRL/RXEE) has a long-standing history of conducting research on electronic, optical and optoelectronic materials for Intelligence, Surveillance and Reconnaissance (ISR) and Electronic Warfare (EW). As the restrictions on size and weight, and the requirements for power and alternate forms of navigation become ever more stressing, the need for more advanced electronic, optical, optoelectronic and quantum materials and devices is becoming more critical for conducting future ISR and EW missions. This contract will continue the advances made in these areas and extend them through efforts aimed at Basic Research including fundamental research in collaboration with university partners; Advanced Research (6.2) and Advanced Technology Development (6.3) in collaboration with both university and industrial partners; Advanced Component Development and Prototypes (6.4), System Development and Demonstration (6.5), RDT&E Management Support (6.6), and Operational System Development (6.7) in collaboration with industrial partners. The goal of this contract is to advance and transition the technologies into fielded systems that will provide new capabilities to accomplish the most stressing Air Force missions.

2.0 Objectives: The objectives of this contract are to execute research and development which exploit competencies that enhance electronic, optoelectronic, photonic, magnetic, ferroic, and quantum materials, wide-bandgap (WBG) semiconductors, ultra wide-bandgap (UWBG) semiconductors, digital & analog switching materials, electronic materials integration and hybrid systems to enable next-generation effective and novel ISR and EW systems for DAF applications.

Required tasks and their objectives are delineated below.

3.0 Tasks and Technical Requirements:

3.1 Program Management: Provide the programmatic oversight necessary to plan, coordinate, schedule and report all activities in the performance of this effort. This includes all technical, financial and programmatic aspects including the timely and accurate accounting of all tasks.3.2 Electronic Materials Research, Development, and Prototyping: Perform research, development, demonstration, verification, validation and technology transition of electronic materials for all aspects of ISR and EW applications. This includes but is not limited to wide-bandgap (WBG) semiconductors, ultra wide-bandgap (UWBG) semiconductors, magnetic, ferroic materials, digital & analog switching materials, as well as electronic materials integration.

3.3 Photonic, Optoelectronic and Quantum Materials Research, Development, and Prototyping:

Perform research, development, demonstration, verification, validation and technology transition of

IDIQ Contract: FA8650-23-D-5400 Attachment 1 Materials for Integrated Nano-electronic & Optoelectronic Structures Statement of Work

26 Aug 2022 photonic, optoelectronic and quantum materials for all aspects of ISR and EW applications. This includes but is not limited to solid-state qubits; optical, RF, and hybrid material technologies; modulator materials, RF magnetic materials and materials for integrated photonics; and optoelectronic sensing.

3.4 Emergent Opportunities in Electronics, Optics and Photonics: Perform research, development, demonstration, verification, validation and technology transition of the latest advances in electronic, photonic, optoelectronic and quantum materials. This includes the development of case-specific feasibility demonstrators and prototypes for demonstrating specific required capabilities in focused efforts that may be time-constrained.

3.5 Modeling and Theory: Develop theoretical models and computational tools to guide experimental work of materials used in electronic, magnetic, photonic, opto-electronic, and optical applications.

These models may cover a broad range of physical lengths from an atomistic level to a macro device level. Potential areas to consider include, but are not limited to, density functional theory, molecular dynamic theory, and finite element analysis, which could be used as building blocks for integrated computational materials science and engineering (ICMSE) approaches in material research.

3.6 Material Synthesis/Growth: Develop research materials through the use of various physical vapor and chemical vapor deposition processes to grow thin films of desired magnetic, electronic, opto-electronic, and optical nature. Examples of such systems are pulsed laser deposition (PLD), sputtering, molecular beam epitaxy (MBE), atomic layer deposition (ALD), molecular layer deposition (MLD) or other vacuum based systems as needed. Also, synthesis of materials may be done in a beaker mixing various chemicals in solution at room temperature or at high temperatures (>1000oC) where a melt is required. Such equipment may need modifications or supplies to complete the task.

3.7 Fabrication/Processing: Fabricate materials into various shapes and sizes and creating areas that are conducting (like metals), semiconducting (like dichalgenides) or insulating (like oxides, nitrides). In order to do this, various techniques will be needed but not limited to focused ion beam, ultra violet lithography, nano lithography, e-beam lithography, reactive ion etching, wet chemical treatment involving acids and solvents, metal vaporation / sputtering, ion implantation, and mechanical and electronic fixture arrangements. Such equipment may need modifications or supplies to complete the task.

3.8 Characterization/Testing: Many types of characterization and testing procedures are needed to study both material quality and device operation. In general, these can fall into magnetic, electronic, optical and thermal testing techniques, combined with mechanical loading in some test scenarios. These techniques can encompass the areas of microscopy, spectroscopy, transport, and radiation. Typical techniques include, but are not limited to: atomic, electric, piezoelectric, and magnetic force microscopy; scanning electron and transmission electron microscopy, infra-red, thermal atomic force microscopy; secondary ion mass spectroscopy, x-ray photo electron spectroscopy, Raman spectroscopy, impedance and dielectric spectroscopy, scanning tunneling probe spectroscopy, magnetic field measurements like Hall Effect, resonance; optical absorption and emission, photoluminescence; time domain thermoreflectance; spin and electron currents; x-ray diffraction; micron-scale in-situ measurement. The development of new characterization and testing techniques also applies.

3.9 [FUNDAMENTAL RESEARCH] Research Community Leverage and Interaction: In order to harvest and leverage the significant fundamental research investment of DoD and government agencies in this technical area, the Government intends to partner and interact with past, ongoing, and future efforts in a variety of ways. Pilot demonstration efforts, focused experimental activities, seedling efforts for future programs, visits, hosting onsite research activities, and consulting with external SMEs are among the

IDIQ Contract: FA8650-23-D-5400 Attachment 1 Materials for Integrated Nano-electronic & Optoelectronic Structures Statement of Objectives

26 Aug 2022 anticipated modes of exploration that should be enabled through this activity. This component of the overall research program will be maintained as fundamental research.

3.10 Acquisition of Special Test Equipment: Perform purchasing of special test equipment for the new, continued, improved, and/or enduring capability to characterize electronic, photonic, optoelectronic and quantum materials and devices within the AFRL/RXE laboratories.

CLASSIFICATION:

The highest level of security classification of this IDIQ is TOP SECRET.

DELIVERABLES:

A001 – DI-MISC-80711A/T – SCIENTIFIC AND TECHNICAL REPORTS – FINAL REPORT (ONE/R)

A002 – DI-FNCL-80331A/T – FUNDS AND MAN-HOUR EXPENDITURE REPORT (MTHLY)

A003 – DI-MGMT-81468A/T – CONTRACT FUNDS STATUS REPORT (CFSR) (QTRLY)

A004 – DI-MGMT-80368A/T – STATUS REPORT (QTRLY)

A005 – DI-ADMN-81373/T – PRESENTATION MATERIAL (ASREQ)

A006 – DI-MISC-80711A/T – SCIENTIFIC AND TECHNICAL REPORTS – DATA MANAGEMENT PLAN (ASGEN)

A007 – DI-IPSC-81488/T – COMPUTER SOFTWARE PRODFUCT – SOURCE CODE (ASGEN)

A008 – DI-MISC-80652/T – TECHNICAL INFORMATION REPORT – SF 424 UPDATE (ANNLY)

A009 – DI-IPSC-81443A/T – SOFTWARE USER MANUAL (SUM) (ASGEN)

A010 – DI-IPSC-81448A/T – FIRMWARE SUPPORT MANUAL (FSM) (ASREQ)

A011 – SI-SESS-81248B/T – INTERFACE CONTROL DOCUMENT (ICD) (ASGEN)

A012 – DI-IPSC-81432A/T – SYSTEM/SUBSYSTEM DESIGN DESCRIPTION (SSDD) (ASREQ)

SECURITY REQUIREMENTS

OPERATIONS SECURITY (OPSEC)

The contractor shall participate in all activities associated with the disciplines of the organization’s Industrial Security, Information Security, Personnel Security, Operations Security (OPSEC), and Antiterrorism programs, following appropriate measures in each program as required for this particular contract. Security measures are required to reduce program vulnerability from successful adversary collection, exploitation of critical information, and violations of export control requirements. The prime contractor shall ensure all subcontractors, if applicable, conform to these requirements as required by the prime contractor.

PROGRAM PROTECTION PLAN (PPP) REQUIREMENTS

Any potential critical program information (CPI) generated as part of this effort will be reviewed to determine the need for a PPP or to be included as part of an existing PPP.