A. ED0044301 PIP-II CDS DVB Statement of Work.pdf

PIP-II CDS DVB Statement of Work

Preparation Date: 25-Sept-2025

Date: 25-Sept-2025

Preparing Organization: CDS, PIP-II, Fermi Forward Discovery Group, LLC (FFDG)

Document Number: ED0044301

Document Approval

Signatures Required Date Approved

Originator: Romain BRUCE, Cryogenic engineer As in Teamcenter

Reviewer: Ram Dhuley, L3M and CAM for PIP-II CDS As in Teamcenter

Reviewer: Jeremy Nudell, PIP-II Project Engineer As in Teamcenter

Reviewer: Matt Luedke, PIP-II Quality Assurance As in Teamcenter

Approver: Joe Ozelis, L2M for PIP-II SRFCryo As in Teamcenter

ED0044301 PIP-II CDS DVB Statement of Work

Fermi National Accelerator Laboratory 2

Revision History

Revision Date of Release Description of Change

- As in Teamcenter Initial Release

A

B

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1. INTRODUCTION

1.1. Proton Improvement Plan – II

1.2. Distribution Valve Box (DVB) assembly

2. SCOPE AND DELIVERABLES

2.1. Statement of Work scope

2.2. FNAL Scope

2.3. SUBCONTRACTOR Scope

2.4. Delivery terms

3. PROJECT EXECUTION

3.1. Bidding Phase

3.2. Technical and Cost Evaluation Phase

3.3. Project Execution Phase

4. GENERAL REQUIREMENTS

4.1. General

4.2. Operational Lifetime

4.3. DEVICE process parameters

4.4. Heat Leak

4.5. Transient Operation

4.6. Environmental Conditions

4.7. Cryogenic Process Piping (CPP)

4.8. DVB Warm Manifold

4.9. Internal Supports

4.10. Vacuum space

4.11. High Temperature Thermal Shield (HTTS)

4.12. Helium Leak Tightness

4.13. Flexibility

4.14. Thermo-acoustic oscillations (TAO)

4.15. External Supports

4.16. Control valves

4.17. Pressure relief devices

4.18. Check valves

4.19. Solenoid valves

4.20. Temperature measurement

4.21. Pressure measurement

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4.22. Mass flow meter

4.23. Joints, flanges, blanks and gaskets

5. INTERFACE REQUIREMENTS

5.1. General

5.2. Physical space constraints and requirements

5.3. Liftings points

5.4. Cryogenic transfer line connections

5.5. Auxiliary interfaces

5.6. Interfaces to DVB platform

5.7. Electrical and process controls

6. FABRICATION, ASSEMBLY, AND INSTALLATION REQUIREMENTS

6.1. Fabrication

6.2. Cryogenic Insulation

6.3. Labeling

6.4. Welding

6.5. Brazing

6.6. Welded and Brazed joint repair

6.7. Tube and Pipe Bending

6.8. Cleaning

6.9. Assembly and Installation

7. APPLICABLE CODES, DOCUMENTS, AND STANDARDS

7.1. General

7.2. List of Standards

8. MATERIALS

9. DESIGN REVIEWS

9.1. General

9.2. Kick-off Meeting

9.3. Preliminary Design Review (PDR)

9.4. Final Design Review (FDR)

9.5. Manufacturing Readiness Review (MRR)

9.6. Shipping/Transportation Readiness Review (TRR)

10. DELIVERY SCHEDULE AND HOLD POINTS

11. REPORTING/MEETING REQUIREMENTS

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12. QUALITY REQUIREMENTS

12.1. Non-conformance management

12.2. Modifications management

12.3. SUBCONTRACTOR’s Quality Assurance Plan (QAP)

12.4. SUBCONTRACTOR’s Quality Control Plan (QCP)

12.5. SUBCONTRACTOR’s Manufacturing Inspection Plan (MIP)

13. ACCEPTANCE

13.1. Leak check

13.2. Pressure Tests

13.3. Cold Leak Tests

13.4. Factory Acceptance Testing (FAT) at SUBCONTRACTOR site

13.5. Delivery inspection at FNAL site

13.6. Site Acceptance Test (SAT) at FNAL site

14. POST AWARD DESIGN AND MANUFACTURING

15. SHIPPING AND HANDLING

15.1. General

15.2. Crate handling requirements

15.3. Crate labeling

15.4. Shipping Shock & Vibration Monitoring

15.5. Maximum Permissible Shock and Vibration Loads

15.6. Crate Access and Storage

15.7. Crate Fabrication Requirements

16. Deliverable Documentation during Project Execution

16.1. Design, manufacturing, and testing phase

16.2. Final delivery

17. LIST OF ATTACHMENTS

APPENDIX A

A.1 ACRONYMS and DEFINITIONS

A.1.1 Technical Acronyms

A.1.2 Organizational Acronyms

A.1.3 Definitions

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1. INTRODUCTION

1.1. Proton Improvement Plan – II

1.1.1. Fermi National Accelerator Laboratory (FNAL) located in Batavia, IL is building a next generation proton accelerator called the Proton Improvement Plan II (PIP-II) as an upgrade of its accelerator complex. The PIP-II accelerator (Linac) design is based on superconducting radio frequency (SRF) technology employed in twenty-three SRF cryomodules. The linac requires cryogenic helium for operation, which is provided by the Cryogenic Distribution

System (CDS). The CDS comprises the equipment needed to feed and return cryogenic helium from a cryogenic plant to the SRF cryomodules. The CDS includes Distribution Valve

Box (DVB) assembly, intermediate transfer line (ITL), and tunnel transfer line (TTL). Figure

1-1 presents a schematic overview of the PIP-II CDS.

Figure 1-1 Schematic of PIP-II Cryogenic Distribution System

1.1.2. The coordinate directions (X,Y,Z) used by the PIP-II project are related to the physical directions as given in Table 1-1.

Table 1-1 PIP-II coordinate system details

Coordinate direction Physical direction

X East

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-X West

Y North

-Y South

Z Vertically up

-Z Vertically down

1.2. Distribution Valve Box (DVB) assembly

1.2.1. The Distribution Valve Box (DVB) assembly is located inside the Cryoplant building between the Cold Box (CB) and the Intermediate Transfer Line (ITL). The DVB assembly comprises the DVB, DVB Warm Manifold, and CB Interconnect.

1.2.2. Figure 1-2 shows a general layout in 3D of the DVB. The DVB starts at the Cold Box (CB) in the Cryoplant building and runs east to west to the ITL interface that is on top of the Utilities building. The main body of the DVB sits on a platform located inside the Cryoplant building.

Figure 1-2 Illustration of the Distribution Valve Box (DVB) in Cryoplant Building (envelope in orange), connecting the Cold Box (CB) to the Intermediate Tunnel Transfer Line (ITL).

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1.2.3. The DVB is a vacuum jacketed, thermally shielded, multi-circuited piping transfer line, including control valves, flow measurement devices, and thermometers; Table 1-2 provides nomenclature of the DVB process components:

Table 1-2 DVB process components

Name Line description

Vacuum jacket Vacuum jacket enclosing the DVB cryogenic components

HTTS High Temperature Thermal Shield

HTTS Supply Helium supply line for High Temperature Thermal Shield

HTTS Return Helium return line for High Temperature Thermal Shield

4.5 K Supply 4.5 Kelvin helium supply line

LTTS Return Helium return line for Low Temperature Thermal Shield

2 K Return 2 Kelvin helium supply line

CD Return Line for returning helium flows during system cooldown/warmup

1.2.4. DVB Warm Manifold is located on the side of the DVB and is composed of safety and controlled valves and exhaust pipes connecting DVB CPP to the warm helium connections in the Cryoplant Building This manifold also contains the warm instrumentation that monitor the pressure inside the process lines.

1.2.5. CB Interconnect is the vacuum jacketed transfer line that connects the DVB to the Cold Box.

This part is separated from the DVB for ease of installation of the DEVICE inside the

Cryoplant Building.

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2. SCOPE AND DELIVERABLES

2.1. Statement of Work scope

2.1.1. This Statement of Work (SoW) covers the design, fabrication, assembly, factory acceptance tests, and delivery of the DVB assembly by a SUBCONTRACTOR to FNAL site. DVB assembly components hereafter will be referred to using the term DEVICE.

2.2. FNAL Scope

2.2.1. In the Request for Proposal phase, FNAL shall provide:

2.2.1.1. This Statement of Work

2.2.1.2. Minimum Requirements Specification

2.2.1.3. DEVICE assembly layout drawings listed in Table 2-1.

Table 2-1 Layout drawings to be provided by FNAL at RFP

Drawing reference Description

F10251985 DVB LAYOUT, PIPII CDS

F10037530 FNAL 6” parallel plate vacuum relief

F10124028 DVB P&ID

2.2.2. During the project execution phase, FNAL shall supply components and documents to

SUBCONTRACTOR according to the approximate timetable shown in Table 2-2.

Table 2-2 Timeline and items that FNAL will supply to SUBCONTRACTOR

Item Estimate dispatch from FNAL

Cryoplant building crane details and specifications 1 week after Kick-Off Meeting

DVB platform drawing 1 week after Kick-Off Meeting

Blank template for bi-weekly status to be filled out by the SUBCONTRACTOR

1 week after Kick-Off Meeting

Shock loggers for installation on shipping crates 8 weeks prior to start of shipment

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2.3. SUBCONTRACTOR Scope

2.3.1. The SUBCONTRACTOR shall provide all materials necessary to fabricate complete deliverables of Section 2.3. The SUBCONTRACTOR shall provide complete design, engineering, and drafting services required to generate 3D models, analyses, and internal fabrication drawings (as deemed necessary), and all documentation needed to manage manufacturing and supporting their suppliers.

2.3.2. The SUBCONTRACTOR shall design, engineer, fabricate, test, and deliver to FNAL site a fully functional and ready to test DEVICE based on this Statement of Work.

2.3.3. The SUBCONTRACTOR shall provide all labor to assemble, test, and supervise the manufacture of the DEVICE regardless of where these are made within the

SUBCONTRACTOR’s plant or in a second facility or sub-contractor.

2.3.4. The SUBCONTRACTOR shall design and fabricate jigs and fixtures to ensure ports, brackets, and other important components are maintained to specified tolerances.

2.3.5. The SUBCONTRACTOR shall procure and fabricate all adapters for vacuum pumping, pressure tests, and cold leak tests. All adapters shall be delivered to FNAL along with the

DEVICE and shall become FFDG property.

2.3.6. The SUBCONTRACTOR shall complete and pass all cleanliness requirements, material certifications, dimensional checks, thermal shock tests, leak checks, pressure tests in strict adherence to the clauses and the document deliverables detailed of this Statement of Work.

2.3.7. The SUBCONTRACTOR shall handle and transport the assembled and fully tested DEVICE to FNAL site in strict adherence to the clauses of this Statement of Work.

2.4. Delivery terms

2.4.1. SUBCONTRACTOR shall be responsible for delivering the DEVICE to FNAL site. The

DEVICE components shall be delivered disconnected from each other so that they can be installed independently of each other at FNAL site.

2.4.2. Delivery at Place (DAP) to FNAL site in Batavia, Illinois, USA per Incoterm 2020 shall be applied as the method of delivery.

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3. PROJECT EXECUTION

Purchase Order will be owned and managed by Fermi Forward Discovery Group (FFDG), LLC.

3.1. Bidding Phase

OFFEROR shall submit the following documents in English language with their proposal.

Information considered proprietary should be identified as such.

3.1.1. Total cost to furnish all facilities, equipment, special tooling, consumables and materials, except where explicitly excluded in this statement of work, including the cost to perform all work and services necessary to engineer, design, fabricate, test, and deliver to the FNAL site a fully functional DEVICE ready for testing and installation

3.1.2. A complete itemized list of deliverables, including engineering documentation and physical hardware deliverables

3.1.3. Lists of exceptions to this specification and reasoning for exception

3.1.4. Completed PIP-II CDS DVB Minimum Requirements document

3.1.5. A Gantt chart or similar with 1-week granularity showing milestones with anticipated completion dates relative to the start of the contract including, but not limited to, the following:

a. Start of contract

b. Kick-Off Meeting

c. Review of PM documents

d. Review of QA and QC documents

e. Review of detailed schedule

f. Preliminary Design Review (PDR)

g. Final Design Review (FDR)

h. Manufacturing Readiness Review (MRR)

i. Review of the detailed design and complete production documents

j. Start of fabrication

k. Testing the DEVICE at the SUBCONTRACTOR’S premises

l. Transportation Readiness Review (TRR)

m. Delivery of the DEVICE to the FNAL site

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3.1.6. A technical proposal comprising:

a. ASME BPV and B31.3 compliance strategy

b. Proposed number of DEVICE sections / interfaces

c. Proposed type of MLI, including spacer material and MLI installation procedure employed on prior systems built for liquid helium temperature service

d. Proposed choice of HTTS material

e. Proposed HTTS thermal strap mounting technique, if strap is present

f. Proposed low thermal conductivity CPP spacer design including expansion allowance

g. Proposed CPP anchor design

h. Proposed external supports anchor design

i. Proposed external supports connection method to the DEVICE for both rigid and sliding supports

j. Proposed expansion joint design(s) for internal CPP lines, if present

k. Proposed expansion joint design(s) for external vacuum vessel, if present

l. Proposed interconnect design for all CPP, HTTS, and vacuum vessel connections

m. Proposed method to prevent rotation relative to vacuum vessel of internal CPP and

HTTS during testing, shipping, and installation

n. Leak test procedure using helium mass spectrometer employed on prior systems built for sub-atmospheric liquid helium service

o. Installation and check out of cryogenic instrumentation used on piping/vessels built for liquid helium service

p. Pressure test procedure in accordance with ASME employed on prior built systems

q. Cold leak test procedure employed on prior systems built for sub-atmospheric liquid helium service

r. Sample welding plan, WPS, examination, and acceptance testing procedures

s. Sample shipping and handling plan welding plan

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3.1.7. Copy of OFFEROR Quality Assurance Plan (QAP) satisfying requirements of Paragraph 12.3

3.1.8. OFFEROR company profile and experience document showcasing:

a. Company Organization Chart highlighting the key technical personnel and staffing level with skillset required for this project. Note that SUBCONTRACTOR shall immediately communicate to the FNAL changes in key personnel or qualified individuals anytime during the project execution

b. Company profile showcasing design and engineering capabilities (including design and analysis softwares) and workshop facilities

c. 2 examples from within 10 years of prior successful supply of cryogenic valve boxes/transfer lines that resemble the current scope in scale, timeline, and technical requirements

d. Sample Quality Control Plan (QCP) developed by OFFEROR for a prior project that resembles the current scope in scale, timeline, and technical requirements.

3.2. Technical and Cost Evaluation Phase

3.2.1. FFDG will evaluate responsive proposals and award a subcontract to the best value offeror.

3.3. Project Execution Phase

3.3.1. Details of this phase are stated in Sections 4-9.

4. GENERAL REQUIREMENTS

4.1. General

4.1.1. This Statement of Work defines performance requirements of a fully functional DEVICE. The subcontractor shall meet all requirements detailed in this Statement of Work.

4.1.2. The subcontractor may request modifications that would simplify fabrication, decrease costs, or improve performance of the DEVICE. Any requests for deviations and/or exceptions shall be consistent with the Terms and Conditions provided in the RFP documents.

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4.1.3. The SUBCONTRACTOR shall supply all facilities, equipment, special tooling, consumables, and material, except where explicitly excluded in this specification, and perform all work and services necessary to engineer, analyze, design, fabricate, assemble, test and deliver to the

FNAL site in Batavia, IL a functional DEVICE suitable for long-term uninterrupted operation in strict compliance with this specification.

4.1.4. Any shipping fixtures shall become the property of FFDG.

4.1.5. The SUBCONTRACTOR shall supply engineering analyses, design models, and fabrication drawings, all of which are subject to FNAL written approval.

4.1.6. The SUBCONTRACTOR shall supply all relevant original equipment manufacturer (OEM) technical documentation to FNAL upon delivery.

4.1.7. All technical materials associated with procurement of the DEVICE including, but not limited to calculations, CAD models, drawings, and test reports, shall be distributable to appropriate

PIP-II project partners and personnel during and after completion of this contract.

4.1.8. IMPORTANT: All electrical equipment shall be NRTL certified. CE mark or equivalent shall not be accepted.

4.2. Operational Lifetime

4.2.1. The DEVICE has an operational lifetime of >20 years with a yearly operating time of >8,000 hours.

4.2.2. The DEVICE shall be designed to withstand at least 200 thermal cycles during the operating lifetime. A thermal cycle is temperature change from ambient temperature to approximately

80 K, which is approaching the high temperature shield nominal temperature. For thermal cycles, the system temperature rate change will be limited to <1.5 K per minute.

4.3. DEVICE process parameters

4.3.1. The DEVICE design parameters and nominal operating parameters at steady state are presented in Table 4-1.

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Table 4-1 DEVICE process parameters

Process line/component

Design parameters Parameters at steady state operation

Design pressure

MDMT Nominal pressure Nominal temperature

- [bar.a] [K] [bar.a] [K]

4.5 K Supply 20 4.5 2.9 4.5

2 K Return 4.1 2 0.03 3.8

LTTS Return 20 4.5 2.9 9

HTTS Supply 24 40 18 40

HTTS Return 24 40 18 80

CD Return 20 4.5 1.1 80

HTTS - 40 - 80

Vacuum Jacket 1.5 245 0 indoor ambient

Warm manifold* - - - indoor ambient

*The warm manifold design parameters and nominal pressure are similar to the process line which they are connected to.

4.4. Heat Leak

4.4.1. The DEVICE shall be designed to minimize the effects of heat leak from ambient temperature components into the cryogenic process piping (CPP) lines, and also to minimize heat transfer between CPP lines.

4.4.2. CPP lines shall have bends to reduce radiation heat transfer from piping branches that have a direct view from room temperature regions.

4.4.3. The heat leak to the DEVICE shall not exceed the values presented in Table 4-2. Temperature levels are defined by the corresponding operating temperature of the CPP lines as follows:

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Table 4-2 DEVICE Heat Leak Budget at nominal steady state operation

DEVICE component Heat leak budget [W]

2 K return 3

4.5 K Supply 1.6

LTTS Return 1.7

HTTS Supply 1

HTTS Return 10

CD Return 2.2

Thermal Shield 67

4.4.4. The SUBCONTRACTOR shall provide an engineering analysis of the DEVICE heat leak subject to FNAL written approval.

4.5. Transient Operation

4.5.1. Transient operation of the DEVICE is characterized by thermal cycling any or all of the

Cryogenic Process Piping (CPP) lines.

4.5.2. The DEVICE and its subcomponents, including each individual CPP circuit, shall be designed to be independent of cool down/warm up rates and sequences.

4.5.3. The DEVICE shall include all design loads and load cases as required by the governing CODE.

The DEVICE loads shall include, but not limited to, the following:

a. CPP pressurization

b. Dead weight

c. Vacuum and pressure load due to expansion joints (if such joints are present)

d. Thermal loads

e. Pressure test loads

f. Transient loads (including transportation loads)

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4.5.4. CODE allowable stress values shall be used to verify the adequacy of the design.

4.6. Environmental Conditions

4.6.1. The DEVICE shall be designed for use indoors in the PIP-II Cryoplant building at the FNAL site. Typical environmental conditions for the PIP-II Cryoplant building are presented in Table

4-3.

Table 4-3 Environmental Conditions of the FNAL Site

Parameter Unit Value

Indoor Temperature, Min/Max [K] 293/298

Atmospheric Pressure [bar.a] 0.98

Relative Humidity, Min/Max [%] 0/55

4.7. Cryogenic Process Piping (CPP)

4.7.1. All CPP lines in the DEVICE shall be designed to transfer helium and include the following process lines:

a. 4.5 K Supply

b. 2 K Return

c. LTTS Return

d. HTTS Supply

e. HTTS Return

f. Cooldown (CD) Return

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4.7.2. The minimum hydraulic diameter of the DEVICE CPP lines shall not be less than the dimensions presented in Table 4-4 except by FNAL written approval and at the location of the

Coriolis mass flow meters.

4.7.3. Unless explicitly defined by this specification, each CPP line of the DEVICE shall be designed to avoid undesirable contact with other CPP lines and components within the DEVICE.

Wherever appropriate the use of low-thermal conductivity spacers should be used to minimize heat leak effects to CPP lines.

4.7.4. The DEVICE shall be designed such that CPP lines within each individual DEVICE section are equipped with a means to restrict internal rotation for all load cases, including, but not limited to, operations, transients, transport, and installation.

4.7.5. The SUBCONTRACTOR shall provide an engineering analysis of the CPP per CODE for all applicable load cases including, but not limited to, thermal, pressure, vacuum, transportation and any other worst case identified load case combinations and is subject to FNAL written approval.

Table 4-4 DEVICE Process Piping Sizes

Line/component Minimum Size

4.5 K Supply 2 NPS Sch10

2 K Return 10 NPS Sch10

LTTS Return 2 NPS Sch10

HTTS Supply 2 NPS Sch10

HTTS Return 2 NPS Sch10

CD Return 3 NPS Sch10

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4.8. DVB Warm Manifold

4.8.1. DVB Warm Manifold is connected to the penetrative branches of CPP and house the relief valves, manual valves, warm control valves, and pressures transmitters.

4.8.2. This manifold will be placed relative to the DVB as depicted in Figure 4-1. The drawing

F10251985 provides details of the DVB Warm Manifold.

Figure 4-1 Warm manifold envelope

4.8.3. The location of DVB Warm Manifold shall be close to the warm connection in the Cryoplant

Building. The interface locations are detailed in Section 5.5.

4.9. Internal Supports

4.9.1. The DEVICE shall be designed with internal supports of the CPP and various cold sub-components.

4.9.2. The internal supports shall be designed to withstand all loads exerted on a given supported component as required by CODE and this specification including, but not limited to, thermal loads, pressure loads, vacuum loads, and pressure testing loads as well as moments due to misalignment, and loads generated by potential flexible hoses and bellows used for thermal compensation of the DEVICE internally and at the interconnects to both the Cold Box and ITL.

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4.9.3. The internal supports shall be designed to minimize the heat leak to the CPP lines and adjacent cold components to which the internal supports are attached.

4.9.4. The internal supports shall be designed to allow for independent cool down of each CPP line.

The internal support shall have features those lower frictional forces during any sliding movement.

4.9.5. Internal supports shall be designed such that all CPP lines and the HTTS remain within alignment tolerance as presented in Section 5.

4.9.6. The internal supports shall be designed to avoid any deterioration of the multilayer insulation

(MLI) due to differential movements of the CPP lines or HTTS.

4.9.7. The internal supports shall be designed to provide an unobstructed cross-sectional flow area equal to or larger than the vacuum vessel relief port area as detailed in paragraph 4.10.15 to minimize longitudinal relief flow impedance in the case of an internal line rupture.

4.9.8. The SUBCONTRACTOR shall provide an engineering analysis and other design documentation of the internal support scheme for the DEVICE including, but not limited to, material selection, calculated heat leak, and design safety factors, subject to FNAL written approval.

4.10. Vacuum space

4.10.1. The vacuum space operating and design parameters are presented in Table 4-1.

4.10.2. At each interface, the DEVICE vacuum vessel shall match the interface dimensions as presented in Section 5.

4.10.3. Portions of the DEVICE vacuum vessel may require a larger diameter than 28 inches to allow clearance for anchors, supports, piping re-orientation, controlled valves, Coriolis mass flow meter, relief pipes or compensation systems.

4.10.4. The vacuum insulation space shall be designed for continuous sealed vacuum operation without active continuous pumping.

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4.10.5. There shall be no vacuum barrier within the DEVICE. The DEVICE shares a common vacuum with the ITL. A vacuum barrier exists at the DEVICE – Cold Box interface, which is inside the

Cold Box.

4.10.6. The DEVICE vacuum jacket shall be designed to withstand thermal expansion/contraction resulting from the worst load case in Section 4.5.3 as well as thermal contraction of the vacuum jacket resulting from an internal process pipe leak/rupture. To accommodate this requirement, the vacuum vessel may include, but is not limited to, the use of a vacuum flexible element, i.e., vacuum bellows. The minimum temperature to consider on the vacuum jacket during these events is 245 K.

4.10.7. Each vacuum bellows shall have a cover to protect the convolutions in the event of accidental contact with other equipment during shipping, installation, and operation. The cover shall not make direct contact with any of the bellows convolutions and shall have a protective liner to prevent wearing of the convolution surfaces should contact occur.

4.10.8. The force at the external vacuum barriers at the Cold Box and the ITL shall not exceed those given in Paragraph 5.4.1 for the surface Cold Box end and Paragraph 5.4.2 for the ITL end.

4.10.9. CODE allowable stress values and design criteria shall be used for the vacuum vessel design.

The vessel shall be designed such that allowable stresses are not exceeded and to ensure that the vessel is resistant to buckling. The vacuum vessel need not be ASME code stamped.

4.10.10. For geometries not specifically covered by CODE, the external pressure for buckling failure predicted by Finite Element Analysis (FEA) shall not be less than 3.5 times the maximum pressure differential.

4.10.11. Weld design configurations not specifically approved or prohibited by the ASME BPVC may be used, subject to FNAL written approval.

4.10.12. All openings in the vacuum vessel shall be adequately reinforced in compliance with the CODE and allowable stress values.

4.10.13. The DEVICE vacuum vessel shall be designed to withstand vacuum, pressure, and weight loads, and all dynamic forces that may occur in the case of an accidental loss of insulating vacuum.

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4.10.14. There shall be no water condensation on the DEVICE vacuum vessel during normal operation.

4.10.15. The DEVICE vacuum space shall be protected from over-pressurization above the design pressure given in Table 4-1.

4.10.15.1. The DEVICE assembly shall include 2 FNAL style 6 inch parallel-plate vacuum relief devices, one on the DVB and one on the CB interconnect. SUBCONTRACTOR shall fabricate this device using the design provided in FNAL drawing F10037530.

4.10.15.2. Both locations are subject to FNAL approval. Note that the ITL, which has insulating vacuum common with the DEVICE, shall be considered as having 17,000 mm2 of vacuum vessel relieving area.

4.10.15.3. All relief devices shall be directed up vertically and shall be accessible for maintenance, repair, and replacement from the platform.

4.10.15.4. The vacuum relief shall be oriented such that the relief will not discharge in the direction of personnel in the general vicinity. More details will be provided at the Kick-

Off Meeting.

4.10.16. The DEVICE vacuum space shall allow for vacuum pumping.

4.10.16.1. The DEVICE shall include one ISO-K 100 (4 inch) vacuum flange for vacuum pump connection.

4.10.16.2. The flange location and valve must be accessible from the DVB platform to attach vacuum pump.

4.10.16.3. The vacuum flange shall be capped for delivery and installation.

4.10.17. The SUBCONTRACTOR shall provide all hardware necessary to complete and seal the insulating vacuum space for all operational, testing, and transporting conditions. Vacuum pump-out connections shall have a right-angle ISO-K 100 vacuum valve accessible from the platform.

4.10.18. There shall not be any trapped gas volumes anywhere within the DEVICE during pump down of the vacuum space. In all instances where a potential for a trapped volume of gas exists in the insulating vacuum space (virtual leak), a vent hole shall be designed into the necessary components such that the structural integrity and operation of all components within the

DEVICE are not compromised.

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4.10.19. The SUBCONTRACTOR shall provide an engineering analysis of the vacuum vessel including detailed design of welds, reinforcement of joints, material selection, and examination and testing records subject to CODE compliance and FNAL written approval.

4.11. High Temperature Thermal Shield (HTTS)

4.11.1. The DEVICE shall have a HTTS to minimize the thermal radiation heat load to the internal

CPP lines from the ambient temperature vacuum vessel. The HTTS shall be cooled via thermal contact with the HTTS Return line.

4.11.2. The HTTS materials shall have high thermal conductivity and shall have good thermal contact with HTTS Return such that the maximum HTTS temperature gradient is less than 10 K at steady state DEVICE operation.

4.11.3. The SUBCONTRACTOR shall provide an engineering analysis of the DEVICE HTTS thermal gradient subject to FNAL written approval.

4.11.4. The DEVICE HTTS shall not have cooldown rate limitations. The shield and its trace tube shall have adequate flexibility to minimize thermal stresses due to temperature differentials encountered during cooldown. No loading conditions shall allow the primary or secondary stresses to exceed the ASME B31.3 Process Piping allowable stress. The

SUBCONTRACTOR shall provide an engineering analysis of the shield stress distribution during cool down and warm-up.

4.11.5. The SUBCONTRACTOR shall provide their preferred thermal strap mounting technique for

FNAL approval. When bolted assemblies are used, indium shall be used to increase thermal contact; alternatives to indium may be used with FNAL approval.

4.11.6. At all vacuum vessel port locations, the HTTS shall have a stand-off baffle to minimize radiant heat transfer through the port opening. A sample design is presented in Figure 4-2. The effective cross sectional flow area of the baffle shall not be less than that of the vacuum vessel port. A single layer of reflective tape shall be applied to the outward facing portion of the baffle to minimize radiant heat transfer. No MLI shall obstruct or block the baffle. Vacuum vessel port sizes and locations are presented in Paragraph 4.10.15.

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Figure 4-2 HTTS Baffle Design

4.11.7. A minimum of six temperature sensors shall be mounted to the thermal shield to monitor and control shield temperature; two on the top and bottom and two on each side of the DVB main body anchored to the platform, and at least two at intermediate locations on the shield, one on the CB interconnect shield and one downstream the DVB main body, close to the ITL interface.

The position of these sensors shall be defined at the PDR to verify proper shield thermal gradient. See Section 4.20 for sensor requirements.

4.12. Helium Leak Tightness

4.12.1. Maximum integral helium leak rates occurring during testing and operation of the DEVICE shall not exceed the values presented in Table 4-5. Leak testing shall be performed at design pressure for each CPP line and vacuum pressure no larger than 0.1 Pa using pure helium gas as the pressurized fluid.

Table 4-5 Maximum Acceptable Vacuum Helium Leak Rates at Design Pressure

Vacuum Circuit Description Maximum Acceptable Integral

Helium Leak Rate

- [Pa*m3*s-1]

Cryogenic process piping to insulating vacuum

1x10-10

Atmosphere to insulating vacuum

1x10-9

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4.13. Flexibility

4.13.1. The DEVICE shall compensate for thermal contraction/expansion as a result of thermal cycling individual CPP circuits. A thermal cycle is a temperature change from ambient temperature to approximately 80 K, which approaches the high temperature thermal shield nominal temperature.

4.13.2. The DEVICE shall be designed with adequate flexibility of the CPP circuits and HTTS throughout the operating lifetime for the full range of expected DEVICE operating temperatures and pressures, without exceeding CODE allowed stresses.

4.13.3. The DEVICE CPP interface connections to the Cold Box and ITL will be rigidly connected. All thermal expansion/contraction of CPP, HTTS, and vacuum circuits shall be fully compensated internally within the DEVICE.

4.13.4. The SUBCONTRACTOR shall provide an engineering analysis of the DEVICE flexibility, relative to CODE allowable stresses, subject to FNAL written approval.

4.14. Thermo-acoustic oscillations (TAO)

4.14.1. The piping shall be designed to prevent thermal oscillations (e.g. thermo-acoustic) between warm and cold areas that may affect instrumentation accuracy, increase heat loads, and introduce system instability. The SUBCONTRACTOR shall submit design approaches at the

Kick Off meeting and design calculations at the Preliminary Design Review. These methods may include, but are not limited to, the following, subject to FNAL approval:

4.14.1.1. Use of geometrical combinations shown by Rott stability curves for all lines, accounting for length and inner diameters ratios, percentage of tube space occupied by instrumentation wiring, and thermal intercept temperature; suggested reference material for thermal acoustic oscillations: N.Rott, “Thermally driven acoustic oscillations, Part II: stability limit for helium”, J. Appl. Math. Phys. 24 (1973) 54-72;

P.Gupta, R.Rabehl, “Design guidelines for avoiding thermo-acoustic oscillations in helium piping systems”, Applied Thermal Engineering 84 (2015) 104-109.

4.14.1.2. Use of thermal intercepts at appropriate locations

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4.14.1.3. Use of other techniques with proven successful operating experience. This may include, but is not limited, the addition of room temperature tee ports to increase warm gas damper volumes.

4.15. External Supports

4.15.1. The DEVICE shall be equipped with external supports to support and anchor the DEVICE as needed to the platform in the Cryoplant Building. Figure 4-3 shows the two rectangular beams on the platform to which the DVB supports will be connected.

Figure 4-3 DVB platform in the Cryoplant building, side (left) and top (right) views – the carbon steel beam that will hold the DVB are highlighted in orange in the model .

4.15.2. There are four anchor locations on these beams: two fixed anchors (CDS1) on the west side and two sliding anchors (CDS2) on the east side. Figure 4-4 shows the exact location of these supports relative to the cold box interface. The sliding anchor will help to minimize the stress loads on the vacuum vessel and anchors during vacuum break and pipe rupture events.

Additional information about the connection between DVB anchors and the platform (Bolt pattern, bolt size, …) will be shared during the KOM.

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Figure 4-4 Location of the fixed and sliding anchors of the DVB platform (Top View).

4.15.3. Table 4-6 indicates the maximum allowable loads per each anchor at CDS1 (fixed anchor) and CDS2 (sliding anchor) locations on the DVB platform.

Table 4-6 Maximum allowable loads per anchor plate

Connection point

MX,

[Nm]

MY,

[Nm]

MZ,

[Nm]

Fx, [N]

Fy, [N]

Fz, [N]

CDS1 (fixed) - +72800 -83200

- ±12400 - -7900

CDS2 (sliding) - 18300 - - - -6500

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4.15.4. The external supports shall provide DEVICE adjustability after mounting to the platform of ± 1 inches in all three principal directions to compensate for variations in platform elevation and position but also in case of misalignments during installation.

4.15.5. The external supports shall allow for DEVICE thermal contraction/expansion in the event of an internal line rupture or loss of insulating vacuum.

4.15.6. The SUBCONTRACTOR shall ensure proper fit of the external supports to the DEVICE.

4.15.7. External supports saddles or any other portion of the external supports in close contact with the vacuum jacket shall be made of stainless steel and/or other cryogenically rated material.

4.15.8. The platform structure details are given in FC0119241 (3D model).

4.15.9. The vendor shall provide load cases and calculations of loads imparted by the DEVICE to the platform for FNAL review and approval.

4.15.10. The SUBCONTRACTOR shall provide documentation for each external supports design for the DEVICE including, but not limited to, the following subject to FNAL written approval:

a. Welding inspections

b. Material certifications

c. Engineering analyses including calculated stresses in the external supports and loads/forces transmitted to the floor or pipe bridge.

d. Design safety factors

4.16. Control valves

4.16.1. All valves, actuators, and positioners shall be procured by the SUBCONTRACTOR and installed on the DEVICE. All control valves shall use a Siemens or Samson electropneumatic positioner with a 4-20 mA, 2-wire input for valve position readback and 4-20 mA, 2 wire output for valve position control from PLC. . The choice of the cryogenic valve shall be subject to

FNAL approval. Control valve locations are shown in DVB PI&D, drawing F10124028.

4.16.2. The manufacturer for the cryogenic control valve PV-0060 and the Warm Control Valve (PV-

0015 and PV-0045) shall be WEKA. Valve requirements are stated in Table 4-8.

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4.16.3. Control valves shall be equipped with a continuous feedback signal of the valve position to control system.

4.16.4. Austenitic stainless steels shall be used for cryogenic valves. Any materials used to complete a pressure boundary shall conform to ASME B31.3 material requirements for normal fluid service category at the appropriate operating temperature range.

4.16.5. Cryogenic valves shall be of the extended spindle type with co-axial control stem. They shall be metal bellows sealed with an additional back-up seal and plugged leak test port.

4.16.6. All cryogenic valves shall have 875 mm cryogenic length to minimize heat load.

4.16.7. All valves shall have the manufacturer name and model number clearly and permanently marked on the valve for visual observation.

4.16.8. All cryogenic valves shall be mounted with the warm end up if mounted on the vacuum vessel, or as recommended by the valve manufacturer.

4.16.9. The valve installation shall meet all original equipment manufacturer (OEM) installation requirements, including but not limited to flexibility and deflection requirements with internal compensation inside the vacuum vessel.

4.16.10. All control valves shall be leak tight across the seal and seat when closed. Leak rates measured at room temperatures and maximum working pressure shall not exceed the values listed in Table 4-7.

Table 4-7 Cryogenic control valves allowable leakage

Valve Leakage Description Maximum Acceptable Helium Rate

Pa*m3*s-1

Individual leak across seat 1x10-5

Individual leak rate to vacuum 1x10-10

Individual leak rate to atmosphere 1x10-9

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4.16.11. Provisions shall be made for valve stem replacement under cryogenic conditions at slightly higher than atmospheric pressure. All control valves shall be oriented such that their stem or actuators can be replaced without extensive removal of adjacent equipment on the DEVICE.

4.16.12. All pneumatic and manual valves shall have means of locking them out of service for maintenance. For pneumatic valves, isolation and venting of supply lines to actuator is an option.

4.16.13. The SUBCONTRACTOR shall provide air supply manifold(s) at the DEVICE suitable for all

DEVICE pneumatic control valves. The air manifold shall include, but is not limited to, a main compressed air shutoff valve, a pressure regulator, a filter system, an air pressure limit switch, and individual air supply shut-offs for each pneumatic valve.

4.16.14. The SUBCONTRACTOR shall provide applicable control valve OEM technical documentation.

Table 4-8 Control Valves specification.

Tag ID number PV-0015 PV-0045 PV-0060

Process line HTTS Supply branch on

DVB Warm Manifold

4.5 K Supply branch on

DVB Warm Manifold CD Return line inside DVB

Control valve quantity 1 1 1

Process line size ¾ inch ¾ inch 2-1/2 inch

Process line design pressure 24 bara 24 bara 20 bara

MDMT ambient ambient 4.5 K

Stem material SS SS SS

Radiation exposure none none none

Cv 12 12 112

Plug profile eq% 1:100 eq% 1:100 eq% 1:100

Actuator function fail closed fail closed fail closed

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4.17. Pressure relief devices

4.17.1. The SUBCONTRACTOR shall provide relief devices for the six circuits as defined in Error! Not a valid bookmark self-reference.. Requirements are presented and recommended reliefs to comply are presented. The number and all parameters of relief valves must comply with the parameters indicated in the initial instrumentation list document.

Table 4-9 Specification for the DVB relief valves

Tag

Circuit design press., bara

Reliev ing

Temp, K

Make Style orifice diameter size, in

Inlet & outlet size & style

Set Press., barg

Article or Model number

Comments

SV-

20 13 Leser 459 0.354 ¾” x 1” flanged 19.95 4594.2162 Balanced bellows

SV-

20 80 Generant or equivalent

CRV or equiv.

>0.3 ½” threaded 19 CRV-8-K-275 --

SV-

4.1 7 Consolidat ed 1910 API-K 3” x 4” flanged 3.10

1905-30K-1-L3-

MS-31-RF/RS-

GS-HP

guard gas connection/ balanced bellows

SV-

4.1 80 Generant or equivalent

CRV or equiv.

>0.3 ½” threaded 3.10 CRV-8-K-45 --

SV-

20 10 Leser 459 0.512 ¾” x 1” flanged 9.00 4594.2172 balanced bellows

SV-

24 40 Leser 459 0.354 ¾” x 1” flanged 24.15 4594.2162 balanced bellows

SV-

24 80 Generant or equivalent

CRV or equiv.

>0.3 ½” threaded 23 CRV-8-K-333 --

SV-

24 80 Leser 459 0.512 ¾” x 1” flanged 23.00 4594.2172 balanced bellows

SV-

20 80 Generant or equivalent

CRV or equiv.

>0.3 ½” threaded 9 CRV-8-K-130 --

SV-

20 80 Leser 459 0.512 ¾” x 1” flanged 9.00 4594.2172 balanced bellows

SV-

24 80 Generant or equivalent

CRV or equiv.

>0.3 ½” threaded 23 CRV-8-K-333 --

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4.17.2. The SUBCONTRACTOR shall provide documentation indicating the make, model, and performance datasheet of each relief device for FNAL approval prior to procurement. The model number indicated in Pressure relief devices

4.17.3. The SUBCONTRACTOR shall provide relief devices for the six circuits as defined in Error! Not a valid bookmark self-reference.. Requirements are presented and recommended reliefs to comply are presented. The number and all parameters of relief valves must comply with the parameters indicated in the initial instrumentation list document.

4.17.4. Table 4-9 may not be exact. The selected relief devices shall be suitable for the process conditions for which they are intended to be used.

4.17.5. All safety relief devices shall be ASME Code NB/UV stamped. Not needed for thermal expansion (trapped volume) reliefs, which are SV-0013, SV-0023, SV-0043, SV-0060, and

SV-0075.

4.17.6. All safety valves shall be full-lift valves with a leak-proof cap. All safety valves shall be provided with tools/components for removing and capping the valve opening for the purpose of the pressure test execution.

4.17.7. Relief SV-0021 flanged connection shall carry double o-ring configuration with helium guard gas connection.

4.17.8. The SUBCONTRACTOR shall make provisions for periodic inspection, testing or replacement of safety relief devices without cutting or welding.

4.17.9. Reactive and thermal contraction induced forces during relief venting shall be analyzed for both the inlet and outlet piping. The SUBCONTRACTOR shall provide the analysis, including force and moment limits to ensure that ASME B31.3 Code allowable stresses are not exceeded.

4.17.10. The relief which vents to the guard helium space (SV-0021) shall accommodate variable back pressure compensation (e.g. balance bellows relief).

4.17.11. Check valves shall not be used between process lines and pressure relief devices.

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4.17.12. Mounting flanges for relief devices shall be as close to the vacuum vessel as possible to reduce pressure drop and reduce heat leak to the inlet piping. The design and installation shall meet applicable Codes.

4.18. Check valves

4.18.1. All check valves shown in the P&ID shall be supplied by the SUBCONTRACTOR.

4.18.2. All cryogenic check valves shall be purchased by the SUBCONTRACTOR and shall be of the

Universal Socket Weld (US) type with the following characteristics:

a. 316/316L Stainless Steel body construction

b. PTFE seat material

c. 0.5 psid cracking press

d. ure

e. 316 stainless steel spring

f. Check valve inlet and outlet pipe size corresponding to the pipe size shown on the P&ID drawings.

g. Cv ≥ 230

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4.18.3. FNAL must approve details of the SUBCONTRACTOR check valve purchase order prior to placement to confirm the valve details are correct.

4.18.4. The check valve housing shall be welded to the internal pipework such that the connection welding process does not deteriorate the valve seal. The welding shall be carefully done at the lowest power. Cool the check valve with a wet cloth and adjust the inert gas purge inside, in flow direction of the check valve. Discoloration of weld shall not be wider than 0.25 inches.

4.18.5. The SUBCONTRACTOR shall provide FNAL with a description of the test procedure and a completed check list demonstrating that all check valves have been suitably tested post-welding to verify flow direction and seat tightness.

4.18.6. The SUBCONTRACTOR shall follow all piping design instructions provided by the check valve manufacturer to ensure the flow is fully developed by the time it enters the check valve inlet.

The SUBCONTRACTOR shall maintain a straight length of 10 pipe diameters between flow obstructions (elbows, tees, etc.) and the check valve inlet or provide flow calculations to FNAL demonstrating that the flow will be fully developed at the check valve inlet.

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4.19. Solenoid valves

4.19.1. All solenoid valves shall be a plunger, 2/2 way direct acting, normally open valves, operated with 24V/DC. Each solenoid valve shall be equipped with a dedicated cable plug. All the valves shall have the possibility of manual actuation for quick commissioning and maintenance The valves should be certified for operation with helium gas. The stopper and plunger guide tube of every solenoid valve shall be welded together to enhance leak-tightness.

4.19.2. The valve design shall consider the mounting procedures, to minimize the helium leakage and to avoid any deformations of the valve. All phases of the assembly of the valves shall be planned and supervised with extreme care, to avoid any damage to the valves.

4.19.3. The number and all parameters of manual valves must comply with the parameters indicated in the initial instrumentation list document.

4.20. Temperature measurement

4.20.1. LakeShore Cryotronics® Cernox® sensors (model CX-1030-CU-HT-1.4L) shall be used in the

DEVICE for temperature measurement of the process lines. Lakeshore Cryotronics® Platinum sensor PT-103s (IEC 751 conformance) may be used on the thermal shield. Thermometer locations are shown in DVB PI&D.

4.20.2. Temperature sensors shall be suitable for temperature measurement for the full range between room temperature and the minimum design temperature of the circuit.

4.20.3. Suitable temperature sensor mounting options are subject to FNAL approval.

4.20.4. Each sensor shall have a unique serial number. This unique number shall be clearly marked on the exterior of the feedthrough as well as engraved or stamped near the mounting surface.

4.20.5. Each Cernox sensor shall be purchased with the following:

4.20.5.1. Calibration range of 1.4 K to 325 K

4.20.5.2. Phosphor bronze or similar low temperature conductive material 32 AWG lead wire extensions that are a minimum of 2 m long

4.20.5.3. Thermalization pad.

4.20.6. Each Platinum sensor shall be purchased with the following:

Fermi National Accelerator Laboratory 36

4.20.6.1. “2S” SoftCal option representing a 2-point calibration range of 77 K to 305K

4.20.6.2. “-QT” for Quad-TwistTM phosphor bronze 32 AWG lead wire extensions that are a minimum of 2 m long.

4.20.7. Each measuring point shall have two sensors – one primary and one secondary, except for the sensors located at the surface of the HTTS. All sensors shall be wired to feedthrough connectors located on the DVB vacuum vessel. The feedthrough shall be clearly labeled showing each sensor’s unique identification number.

4.20.8. Each measuring point on the 2 K Return line shall have a top and bottom measuring location at the surface of the pipe, one located on top of the pipe and facing cold helium lines and one at the bottom facing the warm thermal shield. Each of these locations shall also have two sensors – one primary and one secondary.

4.20.9. The SUBCONTRACTOR shall supply all feedthrough connectors and all connector adapters, subject to FNAL approval.

4.20.10. Adequate strain relief for all temperature sensor leads shall be applied.

4.20.11. All temperature sensors used on the DEVICE shall be wired using a 4-wire technique and shall be clearly detailed in a SUBCONTRACTOR provided wiring diagram. Wire pairs shall be installed in a manner which reduces the effects of electromagnetic interference between adjacent wires and external sources.

4.20.12. IMPORTANT: All electrical leads shall be shorted prior to welding on nearby components to prevent damage to thermometers due to inductive currents.

4.20.13. IMPORTANT: SUBCONTRACTOR shall install thermometers following the step-by-step procedure in strict accordance with the FNAL supplied document. This document will be provided at the Kick-Off Meeting.

4.20.14. The mounted thermometers can get damaged during subsequent pipe welding operation due to excessive heating or AC electrical frequencies involved with the welding processes. The mounted thermometers shall be handled according to the following:

Fermi National Accelerator Laboratory 37

4.20.14.1. Prior to welding, every…