SSP_50316-Rev_C.docx

DOCX document 527 KB Posted

Attached to
Human Space Flight Technical Integration Contract (HSFTIC) Federal contract opportunity
Solicitation number
80JSC019R0023
Issued by
National Aeronautics and Space Administration Johnson Space Center

About this file

This document provides details for a solicitation seeking technical integration services for human space flight programs. NASA/JSC plans to issue a Request for Proposal for a Human Space Flight Technical Integration Contract, with an anticipated release date of November 1, 2019 and offer due date of December 11, 2019. The procurement is set aside for small businesses with a NAICS code of 541715 and size standard of 1,250 employees. The solicitation and any associated documents will be available online at the specified websites. Prospective offerors must notify the agency of their intent to submit an offer and monitor the websites for solicitation releases and amendments.

SSP 50316-Rev C

View the file

Other files for this federal contract opportunity

Other files attached to Human Space Flight Technical Integration Contract (HSFTIC), newest first.
File Type Posted
HSFTIC_J-4_Applicable_and_Reference_Document_List.xlsx XLSX spreadsheet
SSP_50035_Revision_C_Retired.docx DOCX document
SSP_50314-Rev_C.docx DOCX document
SSP41142P2_RD_CD_012045_2.pdf PDF
SSP-50803.doc DOC document
PPD_524_RB_FINAL_MRICB_Charter.docx DOCX document
GPO_Website_Ref.pptx PPTX presentation
SSP_50481-RevC.docx DOCX document
42124_P2_RC_.pdf PDF
SSP_50094-RevB.pdf PDF
SSP_50659_Rev_E.xlsx XLSX spreadsheet
IMPR_Package_Mar_Apr_18.pptx PPTX presentation
SSP_41167-RevJ.docx DOCX document
SSP_50835_Rev_E.doc DOC document
42097P1_RD.pdf PDF
SSP42003_P2_RevC.pdf PDF
Applicable_3.zip ZIP file
MD_101_RA_FINAL.docx DOCX document
SSP_50477-RevC.pdf PDF
SSP_50670-Rev_A-DCN001-Collated_Master.doc DOC document
SSP_50781-RevA-DCN_003.docx DOCX document
PPD_517.pdf PDF
SSP_41002-RevR.docx DOCX document
SSP_50901.docx DOCX document
SSP_54059_54060-Baseline.docx DOCX document
SSP5003.PDF PDF
SSP30559RD-Errata.pdf PDF
SSP_41000-RevCJ.pdf PDF
42137P1_RC_CD_012230.pdf PDF
SSP_41163-Rev_L.docx DOCX document
9.0.zip ZIP file
SSP_42001-RevW.docx DOCX document
SSP_50875.docx DOCX document
SSP41017p2rJ.pdf PDF
41143Pt2RD.pdf PDF
SSP_50489-Rev_G.docx DOCX document
41015P2RH.pdf PDF
SSP_42121_Part_2.pdf PDF
SSP_50309_Part_1.pdf PDF
SSP_50477-RevC_Joint_Crew_Provisioning_Catalog.pdf PDF
JSC_Form_1240.pdf PDF
SSP_41160-RevH.docx DOCX document
Increment_Utilization_Accomplishment_Report_Blank_Book_RevB(March_2019).docx DOCX document
SSP_50102.pdf PDF
SSP_50146-RevB-SSCD_15566.pdf PDF
SSP_50034_Revision_D.DOC DOC document
SSP_50227-RevC.docx DOCX document
SSP_50621-RevF-DCN001-Collated_Master.pdf PDF
SSP41004_P2_RJ.pdf PDF
DRAFT_HSFTIC_Work_Load_Indicators.xlsx XLSX spreadsheet
Show all 50

Human Space Flight Technical Integration Contract (HSFTIC) has more files on GovTribe.

On GovTribe

Work with this file on GovTribe

  • Download the original file
  • Contacts named in this file
  • Similar government files
  • Ask GovTribe AI about this file

Text version

Oxygen Generation System Rack to Node 3 Interface Control Document

International Space Station Program

Revision C October 20, 2010

Type 1 NASA Approved

National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, TX Contract # PIC-NNJ09GA18B DRD # PIC-SI-01

European Space Agency

REVISION AND HISTORY PAGE

REV.

DESCRIPTION

PUB. DATE

-
Initial Release per SSCN 002330, EFF 12-16-99
02-02-00
A
Revision A released per SSCD EFF 08-23-01

Incorporates the following IRNs EFF 06/05/01: IRN 50316-01 (PIRN 50316-NA-0003), IRN 50316-02 (PIRN 50316-NA-0004C), IRN 50316-03 (PIRN 50316-NA-0005B), IRN 50316-04 (PIRN 50316-NA-0006), IRN 50316-05 (PIRN 50316-NA-0009), IRN 50316-06 (PIRN 50316-NA-0011), IRN 50316-07 (PIRN 50316-NA-0012), IRN 50316-08 (PIRN 50316-NA-0014)

03-11-02

IRN 0009 (PIRN 50316-NA-0002B) per SSCN 006764
07-02-02

CCBD ND3-00-0017 modifies pages 3-14 & 3-34 in accordance with the IRN 50316-09, EFF 05-23-02

IRN 0010 (PIRN 50316-NA-0007) per SSCN 006764
07-02-02

CCBD ND3-00-0017 modifies pages viii, x, 3-15 & 3-35 in accordance with the IRN 50316-10, EFF 05-23-02

IRN 0011 (PIRN 50316-NA-0015) per SSCN 006764
07-02-02

CCBD ND3-00-0017 modifies pages 3-17, 3-18, 3-19, 3-22 and 3-23 in accordance with the IRN 50316-11, EFF 05-23-02

IRN 0012 (PIRN 50316-NA-0015) per SSCN 006764
07-02-02

CCBD ND3-00-0017 modifies pages 3-12 and 3-32 in accordance with the IRN 50316-12, EFF 05-23-02

IRN 0013 (PIRN 50316-NA-0016B) per SSCN 006889
09-25-02

CCBD ND3-00-0018 modifies pages 2-2, 3-1, 3-3, 3-6, 3-12, 3-16 through 3-20, 3-23, 3-25, 3-32, 3-37 through 3-39, 3-41, A-1, and A-3 in accordance with IRN 50016-13 EFF 06/27/02

IRN 0014 (PIRN 50316-NA-0017A) per SSCN 006889
09-25-02

CCBD ND3-00-0018 modifies pages 3-15 and 3-36 in accordance with IRN 50016-14 EFF 06/27/02

IRN 0015 (PIRN 50316-NA-0019) per SSCN 006889
09-25-02

CCBD ND3-00-0018 modifies page 3-9 in accordance with IRN 50016-15 EFF 06/27/02

SSP 50316C October 20, 2010

SSP 50316C October 20, 2010 ii

REVISION AND HISTORY PAGE - Continued

REV.

DESCRIPTION

PUB. DATE

IRN 50316-0016 (PIRN 50316-NA-0020B) per SSCN 007102
09-26-02

CCBD ND3-00-0019 modifies pages 3-13, 3-14, 3-15, 3-33, 3-34, 3-35 in accordance with the IRN 50316-16, EFF 9/19/02

IRN 50316-0017 (PIRN 50316-NA-0021A) per SSCN 007102
09-26-02

CCBD ND3-00-0019 modifies pages viii, ix, xi, xii, 3-8, 3-16, 3-26, 3-28, 3-37, & 3-42 and adds pages 3-16.1, 3-16.2 and 3-16.3 in accordance

With the IRN 50316-17, EFF 9/19/02

B
Revision B released per SSCD 008151 EFF 03-09-04

CCBD ND3-00-0025 & ND3-00-0028 approve Revision B to replace Revision A in its entirety and incorporate the following IRNs, EFF 7/17/03: IRN 50316-09 (PIRN 50316-NA-0002B); IRN 50316-10 (PIRN 50316-NA-0007): IRN 50316-11 (PIRN 50316-NA-0015); IRN 50316-12 (PIRN 50316-NA-0018); IRN 50316-13 (PIRN 50316-NA-0016B); IRN 50316-14 (PIRN 50316-NA-0017A); IRN 50316-15 (PIRN 50316-NA-0019); IRN 50316-16 (PIRN 50316-NA-0020B); IRN 50316-17 (PIRN 50316-NA-0021A); IRN 50316-18 (PIRN 50316-NA-0013A): and IRN 50316-19 (PIRN 50316-NA-0022) 06-24-05

C
Revision C (Reference SSCD 012698, Eff 04/12/11)
05/04/11

Revision C incorporates the following approved PIRNs:

PIRN SSCN

PIRN 50316-ES-0001 012698

PIRN 50316-NA-0023 012698

PIRN 50316-NA-0024 008007

PIRN 50316-NA-0025C 012698

PIRN 50316-NA-0026A 012698

PREFACE

The contents of this document are intended to be consistent with the tasks and products to be prepared by Program participants. The Oxygen Generation System Rack to Node 3 Interface Control Document, shall be implemented on all new ISS contractual and internal activities and shall be included in any existing contracts through contract changes. This document is under the control of the Vehicle Control Board as designated by the Space Station Control Board, and any changes or revisions will be approved by the Vehicle Control Board Chairperson.

/s/ Kevin Window4/14/11
SignatureDate

Kevin Window Vehicle Office Manager ISS Program Office

INTERNATIONAL SPACE STATION PROGRAM

Oxygen Generation System Rack to Node 3 Interface Control Document

CONCURRENCE

Created by:
Gregg D. Singer

OM/ARES

(PRINT NAME)

ORG

/s/ Gregg D. Singer

3/28/11

(SIGNATURE)

DATE

Prepared by:
Sharon E. Hock

OM/ARES

(PRINT NAME)

ORG

/s/ Sharon E. Hock

3/28/11

(SIGNATURE)

DATE

Approved by:
Tyson E. Richmond

OM/NASA

(PRINT NAME)

ORG

/s/ Tyson E Richmond

4-5-11

(SIGNATURE)

DATE

DQA:
Victoria C. Rodriguez

OM/ARES

(PRINT NAME)

ORG

/s/ Victoria C. Rodriguez

3/28/2011

(SIGNATURE)

DATE

INTERNATIONAL SPACE STATION PROGRAM

oxygen generation system rack to Node 3 interface control DOCUMENT

LIST OF CHANGES

All changes to paragraphs, tables, and figures in this document are shown below:

Board Name
Entry Date
Change
Paragraph(s)
February 2000
Initial Release
All
March 2002
Revision A
All
July 2002
IRN 0009
3.2.1.4.7.2.1, 3.2.2.4.7.2.1
July 2002
IRN 0010
3.2.1.4.7.5, 3.2.2.4.7.6
July 2002
IRN 0011
Tables 3.2.1.5-3, 3.2.1.5-4, 3.2.1.6-1, 3.2.1.6-2, 3.2.1.6-3
July 2002
IRN 0012
3.2.1.4.5.2, 3.2.1.4.5.3, 3.2.2.4.5.2, 3.2.2.4.5.3
September 2002
IRN 0013
2.1, 3.1.1, 3.1.1.1, 3.1.1.2, 3.2.1.4.5.6, 3.2.1.4.9, 3.2.1.5.1, 3.2.1.6, 3.2.1.7, 3.2.2.4.5.5, 3.2.2.4.9, 3.2.2.5.1, 3.2.2.5.2, 3.2.2.6, A.1, Figure 3.2.1.3-1, Tables 3.2.1.5-3, 3.2.1.5-4, 3.2.1.6-3
September 2002
IRN 0014
3.2.1.4.8.2, 3.2.1.4.8.2.1, 3.2.1.4.8.3, 3.2.2.4.8.2, 3.2.2.4.8.2.1, 3.2.2.4.8.3
September 2002
IRN 0015
Table 3.2.1.4-2
September 2002
IRN 0016
3.2.1.4.6, 3.2.1.4.6.2.1, 3.2.1.4.6.3, 3.2.1.4.7, 3.2.1.4.7.2, 3.2.1.4.7.3, 3.2.1.4.7.5, 3.2.2.4.6, 3.2.2.4.6.2.1, 3.2.2.4.6.3, 3.2.2.4.7.2, 3.2.2.4.7.3, 3.2.2.4.7.4, 3.2.2.4.7.6
September 2002
IRN 0017
3.2.1.4.2.1.1, 3.2.1.4.9, 3.2.1.4.9.1, 3.2.1.4.9.2, 3.2.1.4.9.5, 3.2.1.4.10, 3.2.1.4.11, 3.2.1.4.11.1, 3.2.1.4.11.2, 3.2.1.4.11.3, 3.2.1.4.11.4, 3.2.1.8.4, 3.2.2.4.2.1, 3.2.2.4.9, 3.2.2.4.9.1, 3.2.2.4.9.2, 3.2.2.4.9.4, 3.2.2.4.10, 3.2.2.4.11, 3.2.2.4.11.1, 3.2.2.4.11.2, 3.2.2.4.11.3, 3.2.2.4.11.4, 3.2.2.7.4, Figure 3.2.1.4.9-1
June 2005
Revision B
All
January 2011
Revision C
All

Table of Contents

1.INTRODUCTION1-1
1.1Purpose1-1
1.2Scope1-1
1.3precedence1-1
1.4delegation of authority1-1
1.5responsibility and change authority1-1
2.DOCUMENTS2-1
2.1APPLICABLE documents2-1
3.Interfaces3-1
3.1GENERAL3-1
3.1.1INTERFACE DESCRIPTION3-1
3.1.1.1OXYGEN GENERATION SYSTEM Description3-3
3.1.1.2Node 3 DESCRIPTION3-3
3.1.2INTERFACE RESPONSIBILITIES3-3
3.1.2.1RESPONSIBILITY FOR Oxygen Generation System3-3
3.1.2.2RESPONSIBILITY FOR Node 33-3
3.1.2.3RESPONSIBILITY FOR interconnect cabling/tubing/connectors3-3
3.1.3COORDINATE SYSTEMS3-3
3.1.4engineering units, tolerances and conversions3-3
3.1.4.1engineering units and tolerances3-3
3.1.4.1.1Tolerances3-4
3.2INTERFACE REQUIREMENTS3-4
3.2.1OXYGEN GENERATION SYSTEM RACK REQUIREMENTS3-4
3.2.1.1ENVELOPE REQUIREMENTS3-4
3.2.1.2MASS Properties3-4
3.2.1.2.1MASS3-4
3.2.1.2.2CENTER OF MASS3-4
3.2.1.3STRUCTURAL/MECHANICAL ATTACHMENT3-4
3.2.1.3.1Rack Interface Panel3-4
3.2.1.3.1.1Accessibility3-4
3.2.1.4FLuid Interfaces3-7
3.2.1.4.1Fire Suppressant3-7
3.2.1.4.2RECEIVE COOLANT3-7
3.2.1.4.2.1OGS heat transport capability3-7
3.2.1.4.2.1.1OGS HEAT LOAD3-7
3.2.1.4.2.2receive Coolant characteristics3-7
3.2.1.4.2.2.1receive coolant specification3-7
3.2.1.4.2.2.2receive coolant temperature3-7
3.2.1.4.2.2.3RECEIVE COOLANT PRESSURE3-7
3.2.1.4.2.2.4RECEIVE coolant Flow rate3-7
3.2.1.4.2.2.5RECEIVE coolant quantity3-7
3.2.1.4.2.2.6RECEIVE coolant leakage rate3-7
3.2.1.4.2.3Receive Coolant connector3-7
3.2.1.4.3RETURN COOLANT3-9
3.2.1.4.3.1Return COOLANT CHARACTERISTICS3-9
3.2.1.4.3.1.1Return COOLANT SPECIFICATIONS3-9
3.2.1.4.3.1.2Return COOLANT TEMPERATURE3-9
3.2.1.4.3.1.3RETURN coolant pressure drop3-9
3.2.1.4.3.2Return Coolant connector3-9
3.2.1.4.4Receive Nitrogen3-9
3.2.1.4.4.1Receive Nitrogen Temperature3-9
3.2.1.4.4.2Receive Nitrogen Pressure3-9
3.2.1.4.4.2.1Receive Nitrogen maximum design Pressure3-9
3.2.1.4.4.3Receive Nitrogen Flow rate3-9
3.2.1.4.4.4Receive Nitrogen Interface control3-9
3.2.1.4.4.5receive Nitrogen connector3-10
3.2.1.4.5Receive Feed water3-10
3.2.1.4.5.1Receive feed water Temperature3-10
3.2.1.4.5.2Receive feed water Pressure3-10
3.2.1.4.5.2.1Receive feed water maximum design Pressure3-10
3.2.1.4.5.3Receive feed water Flow rate3-10
3.2.1.4.5.4Receive feed water Interface control3-10
3.2.1.4.5.5Receive feed water connector3-10
3.2.1.4.5.6receive feed water quality3-10
3.2.1.4.6Supply Waste water3-10
3.2.1.4.6.1Supply Waste water Temperature3-10
3.2.1.4.6.2Supply Waste water Pressure3-10
3.2.1.4.6.2.1Supply Waste water maximum design Pressure3-11
3.2.1.4.6.3Supply Waste water Flow rate3-11
3.2.1.4.6.4Supply waste water Interface control3-11
3.2.1.4.6.5Supply waste water connector3-11
3.2.1.4.6.6supply waste water gas content3-11
3.2.1.4.7SUPPLY Waste GAS3-11
3.2.1.4.7.1SUPPLY Waste GAS Temperature3-11
3.2.1.4.7.2SUPPLY Waste GAS Pressure3-11
3.2.1.4.7.2.1SUPPLY Waste gas maximum design Pressure3-11
3.2.1.4.7.3SUPPLY Waste GAS Flow rate3-12
3.2.1.4.7.4Supply waste gas connector3-12
3.2.1.4.7.5SUPPLY WASTE GAS WATER CONTENT3-12
3.2.1.4.8RECeive Carbon DIoxide (Scar)3-12
3.2.1.4.8.1RECeive Carbon DIoxide Temperature3-12
3.2.1.4.8.2RECeive Carbon DIoxide Pressure3-12
3.2.1.4.8.2.1RECeive Carbon DIoxide maximum design Pressure3-12
3.2.1.4.8.3RECeive Carbon DIoxide Flow rate3-12
3.2.1.4.8.4RECeive Carbon DIoxide Interface control3-12
3.2.1.4.8.5Receive carbon dioxide connector3-13
3.2.1.4.9SUPPLY CABIN OXYGEN3-13
3.2.1.4.9.1SUPPLY CABIN OXYGEN Temperature3-13
3.2.1.4.9.2SUPPLY CABIN OXYGEN Pressure3-13
3.2.1.4.9.3SUPPLY CABIN OXYGEN Flow rate3-13
3.2.1.4.9.4Supply CABIN OXYGEN Interface control3-13
3.2.1.4.9.5SUPPLY CABIN OXYGEN WATER CONTENT3-13
3.2.1.4.10RECEIVE CABIN AIR3-13
3.2.1.4.11RETURN RACK AIR3-13
3.2.1.4.11.1RETURN RACK AIR TEMPERATURE3-13
3.2.1.4.11.2RETURN RACK AIR PRESSURE3-13
3.2.1.4.11.3RETURN RACK AIR FLOW RATE3-13
3.2.1.4.11.4CABIN AIR HEAT LOAD3-13
3.2.1.5ELECTRICAL INTERFACES3-16
3.2.1.5.1Receive POWER3-16
3.2.1.5.1.1POWER QUALITY3-17
3.2.1.6MDM hardwire interface3-18
3.2.1.6.1mil-std-1553B interfaces3-20
3.2.1.6.1.11553B BUS STANDARD FORMAT3-23
3.2.1.6.1.21553B bus signal characteristics3-23
3.2.1.6.1.2.11553B bus coupling3-23
3.2.1.6.1.3terminal operations3-23
3.2.1.6.1.41553B bus interface functions3-23
3.2.1.6.2Time distribution3-23
3.2.1.7SOFTWARE INTERFACES3-23
3.2.1.8environments3-23
3.2.1.8.1OGS Bonding Interface3-23
3.2.1.8.2STRUCTURAL LOADS3-23
3.2.1.8.2.1Acceleration3-23
3.2.1.8.3vibroacoustics3-24
3.2.1.8.4ATMOSPHERE3-24
3.2.1.8.4.1ATMOSPHERE CHARACTERISTICS3-24
3.2.1.8.4.1.1atmosphere temperature3-24
3.2.1.8.4.1.2atmosphere pressure3-24
3.2.1.8.4.1.3Atmosphere humidity3-24
3.2.1.8.4.1.4REPRESSURIZATION/DEPRESSURIZATION3-24
3.2.1.8.4.1.5OXYGEN concentration3-24
3.2.2NODE 3 INTERFACE REQUIREMENTS3-24
3.2.2.1ENVELOPE REQUIREMENTS3-24
3.2.2.2MASS PROPERTIES3-24
3.2.2.2.1MASS3-24
3.2.2.2.2CENTER OF MASS3-24
3.2.2.3STRUCTURAL/MECHANICAL ATTACHMENT3-25
3.2.2.3.1RACK Interface panel3-25
3.2.2.3.1.1Accessibility3-25
3.2.2.4FLUID INTERFACES3-25
3.2.2.4.1Fire suppressant3-25
3.2.2.4.2SUPPLY COOLANT3-25
3.2.2.4.2.1Node 3 HEAT TRANSPORT CAPABILITY3-25
3.2.2.4.2.2supply Coolant characteristics3-25
3.2.2.4.2.2.1supply coolant specification3-25
3.2.2.4.2.2.2supply coolant temperature3-25
3.2.2.4.2.2.3supply coolant pressure3-25
3.2.2.4.2.2.4Supply Coolant Flow Rate3-25
3.2.2.4.2.2.5SUPPLY coolant rate/PRESSURE DROP3-26
3.2.2.4.2.2.6SUPPLY coolant quantity3-26
3.2.2.4.2.2.7SUPPLY coolant leakage rate3-26
3.2.2.4.2.3Supply Coolant connector3-26
3.2.2.4.3receive RETURN COOLANT3-26
3.2.2.4.3.1receive RETURN COOLANT CHARACTERISTICS3-26
3.2.2.4.3.1.1receive RETURN COOLANT SPECIFICATIONS3-26
3.2.2.4.3.1.2receive RETURN COOLANT TEMPERATURE3-26
3.2.2.4.3.2Return Coolant connector3-26
3.2.2.4.4SUPPLY Nitrogen3-26
3.2.2.4.4.1SUPPLY Nitrogen Temperature3-26
3.2.2.4.4.2SUPPLY Nitrogen Pressure3-26
3.2.2.4.4.2.1SUPPLY Nitrogen maximum design Pressure3-27
3.2.2.4.4.3SUPPLY Nitrogen Flow rate3-27
3.2.2.4.4.4supply Nitrogen connector3-27
3.2.2.4.5SUPPLY Feed water3-27
3.2.2.4.5.1SUPPLY Feed water Temperature3-27
3.2.2.4.5.2SUPPLY Feed water Pressure3-27
3.2.2.4.5.2.1SUPPLY Feed water maximum design Pressure3-27
3.2.2.4.5.3SUPPLY Feed water Flow rate3-27
3.2.2.4.5.4supply feed water connector3-27
3.2.2.4.5.5Supply feed water quality3-27
3.2.2.4.6Receive WASTE water3-27
3.2.2.4.6.1Receive WASTE water Temperature3-28
3.2.2.4.6.2Receive WASTE water Pressure3-28
3.2.2.4.6.2.1Receive WASTE water maximum design Pressure3-28
3.2.2.4.6.3Receive WASTE water Flow rate3-28
3.2.2.4.6.4receive waste water connector3-28
3.2.2.4.6.5receive waste water gas content3-28
3.2.2.4.7RECEIVE Waste GAS3-28
3.2.2.4.7.1RECEIVE Waste GAS Temperature3-28
3.2.2.4.7.2RECEIVE Waste GAS Pressure3-28
3.2.2.4.7.2.1RECEIVE Waste GAS maximum design Pressure3-29
3.2.2.4.7.3receive waste GAS FLOW rate3-29
3.2.2.4.7.4receive waste GAS Interface control3-29
3.2.2.4.7.5waste gas connector3-29
3.2.2.4.7.6Receive Waste Gas Water Content3-29
3.2.2.4.8Supply Carbon DIoxide (scar)3-29
3.2.2.4.8.1Supply Carbon DIoxide Temperature3-29
3.2.2.4.8.2Supply Carbon DIoxide Pressure3-30
3.2.2.4.8.2.1Supply Carbon DIoxide maximum design Pressure3-30
3.2.2.4.8.3Supply Carbon DIoxide Flow rate3-30
3.2.2.4.8.4Supply carbon dioxide connector3-30
3.2.2.4.9receive CABIN OXYGEN3-30
3.2.2.4.9.1receive CABIN OXYGEN Temperature3-30
3.2.2.4.9.2receive CABIN OXYGEN Pressure3-30
3.2.2.4.9.3receive CABIN OXYGEN Flow rate3-30
3.2.2.4.9.4RECEIVE CABIN OXYGEN WATER CONTENT3-30
3.2.2.4.10SUPPLY CABIN AIR3-30
3.2.2.4.11RECEIVE RETURN RACK AIR3-30
3.2.2.4.11.1RECEIVE RETURN RACK AIR TEMPERATURE3-30
3.2.2.4.11.2RECEIVE RETURN RACK AIR PRESSURE3-30
3.2.2.4.11.3RECEIVE RETURN RACK AIR FLOW RATE3-31
3.2.2.4.11.4CABIN AIR HEAT LOAD3-31
3.2.2.5ELECTRICAL INTERFACES3-31
3.2.2.5.1POWER3-31
3.2.2.5.1.1power quality3-31
3.2.2.5.1.2POWER CONTROL3-31
3.2.2.5.2mil-std-1553B interfaces3-31
3.2.2.5.2.11553B BUS format/standard3-31
3.2.2.5.2.21553B bus signal characteristics3-32
3.2.2.5.2.2.11553B bus coupling3-32
3.2.2.5.2.3terminal operations3-32
3.2.2.5.2.41553B bus interface functions3-32
3.2.2.5.3C&DH Connectors3-32
3.2.2.5.4TIME DISTRIBUTION3-32
3.2.2.6SOFTWARE INTERFACES3-32
3.2.2.7environments3-32
3.2.2.7.1Bonding Interface3-32
3.2.2.7.2STRUCTURAL LOADS3-32
3.2.2.7.2.1Acceleration3-32
3.2.2.7.3vibroacoustics3-33
3.2.2.7.4ATMOSPHERE3-33
3.2.2.7.4.1Atmosphere characteristics3-33
3.2.2.7.4.1.1atmosphere temperature3-33
3.2.2.7.4.1.2atmosphere pressure3-33
3.2.2.7.4.1.3atmosphere humidity3-33
3.2.2.7.4.1.4REPRESSURIZATION/DEPRESSURIZATION3-33
3.2.2.7.4.1.5OXYGEN concentration3-33

List of figures

3.1.1.1-1 Oxygen Generation System Rack to Node 3 Functional Interface

Diagram3-2
3.2.1.3-1 OGS/Node 3 Rack Interface Plane3-5
3.2.1.3-2 OGS Specific Panel Connector Locations3-6
3.2.1.4.9-1 OGS Rack Faceplate (Page 1 of 2)3-14
3.2.1.4.9-1 OGS Rack Faceplate (Page 2 of 2)3-15

list of tables

3.1.4.1-1 Linear Tolerances3-4
3.2.1.4-2 Fluid Interface Connectors3-8
3.2.1.5-3 J1 Main Power Connector Description and Pin Assignments3-16
3.2.1.5-4 J2 Main Power Connector Description and Pin Assignments3-17
3.2.1.6-1 J3 Hardwire Data Connector Description and Pin Assignments3-18
3.2.1.6-2 J4 1553B A Data Connector Description and Pin Assignments3-21
3.2.1.6-3 J5 1553B B Data Connector Description and Pin Assignments3-22

appendix list

A ABBREVIATIONS AND ACRONYMS A - 1

SSP 50316C October 20, 2010 iii xv iv

INTRODUCTION

Purpose The purpose of this document is to define the physical, functional, and environmental interface between the Oxygen Generation System Rack (OGS) and the Node 3.

Scope The scope of this document is limited to the interfaces between the OGS and the Node 3.

precedence In the event of conflict between SSP 41000, ISS System Specification, and the contents of this Interface Control Document (ICD), the requirements of SSP 41000 shall take precedence.

delegation of authority NASA may delegate the responsibility for preparation and maintenance of this ICD.

responsibility and change authority This document is prepared and maintained in accordance with SSP 30459, NASA Space Station Interface Control Plan.

3-6

DOCUMENTS

APPLICABLE documents The following documents of the exact issue shown form a part of this document to the extent specified herein.

ASTM E380
Standard Practice for Use of the International System of Units (SI) (the Modernized Metric System)

(Reference 3.1.4.1.1)

MIL-STD-1553B

Rev B Notice 2 8-Sept-1986 Digital Time Division Command/Response Multiplex Data Bus (Reference 3.2.1.6.1, 3.2.1.6.1.1, 3.2.1.6.1.2, 3.2.1.6.1.2.1, 3.2.1.6.1.3, 3.2.1.6.1.4, 3.2.2.5.2, 3.2.2.5.2.1, 3.2.2.5.2.2, 3.2.2.5.2.2.1, 3.2.2.5.2.3, 3.2.2.5.2.4)

MIL-DTL-27500
Cable, Electrical, Shielded and Unshielded, Aerospace, General Specification for

(Reference Table 3.2.1.6-1 )

RR00022V2
Remote Power Controller Module, Component Data Interface Specification

(Reference 3.2.1.7)

SSP 41002
International Standard Payload Rack to NASA/ESA/JAXA Modules ICD

(Reference 3.1.1.1)

SSP 30459
NASA Space Station Interface Control Plan

(Reference 1.5)

SSP 30482
Electrical Power Specifications and Standards, Volume 1: EPS Electrical Performance Specifications

(Reference 3.2.1.5.1.1, 3.2.2.5.1.1)

SSP 30261:002
Space Station Multiplexer/ Demultiplexer Standard ICD

(Reference 3.2.1.6)

SSP 30573
Fluid Procurement and Use Control Specification

(Reference 3.2.1.4.2.2.1, 3.2.1.4.3.1.1, 3.2.2.4.2.2.1, 3.2.2.4.3.1.1)

SSP 41017 Part 1
Rack to Mini Pressurized Logistics Module Interface Control Document

(Reference 3.2.1.1, 3.2.1.2.1, 3.2.1.3, 3.2.1.8.1, 3.2.1.8.2, 3.2.1.8.2.1, 3.2.1.8.3, 3.2.1.8.4.1.4, 3.2.2.1, 3.2.2.2.1, 3.2.2.3, 3.2.2.7.2, 3.2.2.7.3, 3.2.2.7.4.1.4, Figure 3.2.1.3-1)

SSP 41017 Part 2
Rack to Mini Pressurized Logistics Module Interface Control Document

(Reference 3.1.3, 3.2.1.3, 3.2.1.8.1, 3.2.1.8.4.1.4, 3.2.2.3, 3.2.2.7.1, 3.2.2.7.4.1.4, Figure 3.2.1.3-1)

SSP 41000
ISS System Specification

(Reference 1.3)

SSP 50005
International Space Station Flight Crew Standard

(Reference 3.2.1.3.1.1, 3.2.2.3.1.1)

SSP 50318
Prime Item Development Specification for Node 3 (Reference 3.2.1.4.5.6, 3.2.2.4.5.5)
SSP 50405-05
Software Interface Control Document (ICD) Hub Control Zone (HCZ) Multiplexer/ Demultiplexer (MDM) to International Space Station (ISS) Book 5 Oxygen Generation Assembly (OGA) Interface

(Reference 3.2.1.7)

SSQ 21635
Connector and Accessories, Electrical, Circular, Miniature, IVA/EVA Compatible, Space Quality, General Specification for International Space Station Program

(Reference 3.2.2.5.3)

SSQ 21652
Wire, Electric, Silicon-insulated, Nickel-coated Copper, Space Quality, General Specification for

(Reference Tables 3.2.1.5-3, 3.2.1.5-4)

SSQ 21656
Wire and Cable, Electric, fluoropolymer-insulated Nickel coated copper or Copper Alloy, General Specification For

(Reference Tables 3.2.1.6-1)

Boeing Drawing 683-16348
Coupling, Quick Disconnect, Fluid, Self-Sealing, Internal Source Control Drawing

(Reference Table 3.2.1.4-2)

Interfaces

GENERAL

INTERFACE DESCRIPTION

The interfaces specified herein are applicable to the OGS and the Node 3. The Node 3 will provide power, data, thermal coolant, feed water, carbon dioxide (scar), nitrogen, environmental, cabin atmosphere, and the structural/mechanical interfaces at the rack location. The OGS will provide data, return thermal coolant, waste nitrogen/hydrogen, waste water, waste methane/carbon dioxide (scar), cabin oxygen, environmental, cabin atmosphere and structural/mechanical interfaces. A functional interface diagram is shown in Figure 3.1.1.1-1 Oxygen Generation System Rack to Node 3 Functional Interface Diagram.

The Node 3 to OGS interface plane is defined at the rack interface panel and rack structural/mechanical attach points. Note: The only exception is oxygen released to the cabin and atmosphere exchange between the Node 3 and OGS. In these cases the interface plane is not relevant.

Figure 3.1.1.1-1 Oxygen Generation System Rack to Node 3 Functional Interface Diagram

OXYGEN GENERATION SYSTEM Description The OGS is contained in an International Standard Payload Rack (ISPR) containing the Oxygen Generation Assembly (OGA), Power Supply Module, Remote Power Distribution Assembly (RPDA)/Remote Power Controller Module (RPCM), Rack Interface Panel, Bracket Assembly/Coldplate mounting, Rack Power Switch (RPS), Smoke Detector, Avionics Air Assembly (AAA), coldplates, rack structure, and scarring for the Carbon Dioxide Reduction Assembly (CRA). The OGS Rack is fully compatible with the ISPR attachment mechanisms and envelopes.

Node 3 DESCRIPTION The Node 3 is a pressurized element used to supplement and in some cases replace the Habitation Module’s functions for crew accommodations. The Node 3 will contain Environmental Control Life Support System (ECLSS), Waste and Hygiene Compartment (W&HC), and Avionics Racks.

INTERFACE RESPONSIBILITIES

RESPONSIBILITY FOR Oxygen Generation System Unless otherwise noted herein, Marshall Space Flight Center (MSFC), under agreement with the International Space Station (ISS) Program Office, has the responsibility for designing the OGS to the interface requirements herein.

RESPONSIBILITY FOR Node 3 Unless otherwise noted herein, Agenzia Spaziale Italiana has the responsibility for designing the Node 3 to the interface requirements herein.

RESPONSIBILITY FOR interconnect cabling/tubing/connectors The Node 3 is responsible for providing interconnecting cabling/tubing/connectors to the rack interface panel. The OGS is responsible for providing rack interface panel connectors. Male halves of the connectors are provided at the rack interface panel of the OGS. Female connector halves are parts of the Node 3.

COORDINATE SYSTEMS

The coordinate system applicable to the Node 3 to OGS interface is as defined in SSP 41017, Part 2, paragraph 3.1.3.

engineering units, tolerances and conversions engineering units and tolerances Dimensions in this document are shown in the English (inch, pound, second) system of units followed by the equivalent International System (SI) (metric) value in parenthesis. Measurements may be verified in either system of units.

Tolerances Linear tolerances on English dimensions are as indicated in Table 3.1.4.1-1 Linear Tolerances. Linear tolerances on metric dimensions are derived from English measurements and tolerances as defined in ASTM E380, Standard Practice for Use of the International System of Units (The Modernized Metric System), section 4.5. Angular tolerances are ±0.1° on all angles unless otherwise stated.

Table 3.1.4.1-1 Linear Tolerances

English dimension
Implied tolerance (inches)
x.xx
+/- 0.030
x.xxx
+/- 0.010

INTERFACE REQUIREMENTS

OXYGEN GENERATION SYSTEM RACK REQUIREMENTS

ENVELOPE REQUIREMENTS

The OGS shall comply with the envelopes defined in SSP 41017, Part 1, paragraph 3.2.1.1, except for the presence of the Rack Interface Panel specified in 3.2.1.3.1.

MASS Properties

MASS

The OGS shall comply with the mass requirements defined in SSP 41017, Part 1, paragraph 3.2.1.2.

CENTER OF MASS

Deleted.

STRUCTURAL/MECHANICAL ATTACHMENT

The structural/mechanical interface description shall be as defined in SSP 41017, Part 1, paragraph 3.2.1.3.

The OGS structural/mechanical interface is as defined in SSP 41017, Part 2, paragraphs 3.2 and 3.3.

Rack Interface Panel The OGS shall incorporate provisions for a rack interface panel for connection of utilities between OGS and Node 3. The interface plane is at the rack interface panel located on the OGS systems rack as shown in Figure 3.2.1.3-1 OGS/Node 3 Rack Interface Plane. Figure 3.2.1.3-2, OGS Specific Panel Connector Locations, defines the rack interface panel layout.

Accessibility The OGS to Node 3 utility shall comply with accessibility requirements of SSP 50005.

Functional Interface Plane is the external surface of the Rack Interface Panel on the OGS Rack.

OGS

Rack Interface Panel in Node 3

L C

L C Z Rack Attach Point X Y

Center Point of Surface of the Rack Interface Panel See SSP 41017 for Datum point definition Datum

Coordinates from Rack Datum point X = 19.63 Y = -11.12 Z = 5.19

Figure 3.2.1.3-1 OGS/Node 3 Rack Interface Plane

NOTE 1: View of RIP is from front face of rack.

NOTE 2: All Connector Master Keyways are in the 12:00 o’clock position.

Figure 3.2.1.3-2 OGS Specific Panel Connector Locations SSP 50316C October 20, 2010

FLuid Interfaces Fire Suppressant The OGS shall receive fire suppressant via injection into the front panel of the rack.

RECEIVE COOLANT

The OGS shall receive single-phase moderate temperature loop water coolant from the Node 3 for active heat acquisition and transport. The receive coolant interfaces are at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

OGS heat transport capability

OGS HEAT LOAD

The Heat Load rejected to the Moderate Temperature Loop (MTL) by the OGS Rack, including CRA, shall be limited to 2880 watts.

receive Coolant characteristics receive coolant specification The OGS shall receive coolant with the requirements of SSP 30573, Fluid Procurement and Use Control Specification.

receive coolant temperature The OGS shall receive moderate temperature coolant at 61 to 65 deg Fahrenheit (16 to 18.3 deg Celsius).

RECEIVE COOLANT PRESSURE

The OGS shall receive moderate temperature coolant at an operating pressure range of 18 to 100 psia (184 to 690 kPa).

RECEIVE coolant Flow rate The OGS shall receive moderate temperature loop coolant at a minimum flow rate of 483 lb./hr.

RECEIVE coolant quantity The OGS shall contain no more than 10.0 lbs. (4.54 kg) of water in its internal cooling loop for the moderate temperature loop.

RECEIVE coolant leakage rate The OGS maximum coolant leakage rate, for moderate temperature loop coolant received at the maximum pressure specified in paragraph 3.2.1.4.2.2.3, shall be 9E-3 scc/hr.

Receive Coolant connector The OGS Rack shall receive coolant at the Rack Interface Panel via a “MT Water Supply” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

SSP 50316C October 20, 2010

3-8

Table 3.2.1.4-2 Fluid Interface Connectors

Connection:
Category (1)(4)
Keying (2)
QD Body Size
Rack Side Vendor Part Number (2)
Node 3 Side Vendor Part Number (2)
MT Water Supply
6
B(75°)
1/2 in
2003-XX08X-T06B
2000-XX12X-T06B
MT Water Return
6
C(105°)
1/2 in
2003-XX08X-T06C
2000-XX12X-T06C
N2
8
B(75°)
3/8 in
2003-XX04X-N08B
2000-XX06X-N08B
Feed Water
7
D(135°)
1/2 in
2003-XX04X-P07D
2000-XX08X-P07D
Waste Water
7
E(165°)
1/2 in
2003-XX08X-W07E
2000-XX08X-W07E
Waste Gas (H2/N2)
2
J(315°)
1/2 in
2003-XX08X-M02J (3)
2000-XX08X-M02J (3)
Waste Gas (CO2/CH4)(5)
2
A(45°)
1/2 in
2003-XX08X-M02A
2000-XX08X-M02A
CO2
2
F(195°)
1/2 in
2003-XX08X-C02F
2000-XX08X-C02F

(1) Categories as defined in Boeing drawing 683-16348.

(2) Vendor part numbers and keying as defined by Symetrics drawing 200.

(3) Actual vendor part number will be different to meet H2 material compatibility requirements. Functional interface remains unchanged from noted part number.

(4) All vendor category 2 quick disconnects have been qualified at 250 psia operational, 500 psia proof, and 1000 psia burst.

(5) The Waste Gas (CO2/CH4) interface was included as a scar for CO2 Reduction. However, the final design of the CO2 Reduction Assembly does not utilize this interface, and the associated connectors are to be left unmated.

RETURN COOLANT

The OGS shall return moderate temperature coolant to the Node 3. The return coolant interfaces are at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

Return COOLANT CHARACTERISTICS Return COOLANT SPECIFICATIONS The return water coolant shall comply with the requirements of SSP 30573.

Return COOLANT TEMPERATURE The OGS shall return moderate temperature coolant at 61 to 120 °F.

RETURN coolant pressure drop The OGS (including CRA) shall have a moderate temperature coolant pressure drop of 7.2 + 0.1 psid at a flow rate of 483 lb/hr.

Return Coolant connector The OGS Rack shall return coolant at the Rack Interface Panel via a “MT Water Return” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

Receive Nitrogen The OGS shall receive nitrogen from the Node 3. The nitrogen interface is at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

Receive Nitrogen Temperature The OGS shall receive nitrogen from the Node 3 at a temperature range of 60 to 113 deg Fahrenheit (15.6 to 45 deg Celsius).

Receive Nitrogen Pressure The OGS shall receive nitrogen from the Node 3 at a pressure range of 90 to 135 psia. The nominal pressure range while the nitrogen system is in use/flowing shall be 90 to 120 psia and while not in use/flowing is 110 to 135 psia.

Receive Nitrogen maximum design Pressure The OGS shall receive nitrogen at a maximum pressure of 200 psia. This can occur only during off nominal situations.

Receive Nitrogen Flow rate The OGS shall receive nitrogen from the Node 3 at a flow rate up to 0.2 lb./min, assuming the OGS is the only active nitrogen use point.

Receive Nitrogen Interface control Instrumentation and controls of the gaseous nitrogen interface shall be located within the OGS.

receive Nitrogen connector The OGS rack shall receive nitrogen at the Rack Interface Panel via an “N2” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

Receive Feed water The OGS shall receive feed water from the Node 3 either from the potable water bus or the fuel cell bus. The feed water interface is at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

Receive feed water Temperature The OGS shall receive feed water from the Node 3 at a temperature range of 65 to 113 deg Fahrenheit (18.3 to 45 deg Celsius).

Receive feed water Pressure The OGS shall receive feed water from the Node 3 at a pressure range of 14 to 30 psig.

Receive feed water maximum design Pressure The OGS shall receive feed water at a maximum pressure of 35 psig.

Receive feed water Flow rate The OGS shall receive feed water from the Node 3 at a maximum flow rate of 100 lb/hr at the minimum interface pressure.

Receive feed water Interface control Instrumentation and controls of the feed water interface shall be located within the OGS.

Receive feed water connector The OGS rack shall receive feed water at the Rack Interface Panel via a “Feed Water” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

receive feed water quality The feed water received by the OGS rack will be potable water in accordance with SSP 50318, Table VI or fuel cell water from the potable water storage rack.

Supply Waste water The OGS shall supply waste water to the Node 3. The waste water interface is at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations. The OGS will supply waste water to Node 3 only when the Water Recovery System (WRS) is available to receive waste water.

Supply Waste water Temperature The OGS shall supply waste water to the Node 3 at a temperature range of 63 to 113 deg Fahrenheit (17.2 to 48.9 deg Celsius).

Supply Waste water Pressure The OGS shall supply waste water to the Node 3 at a back pressure of 0 to 8 psig.

Supply Waste water maximum design Pressure The waste water bus Maximum Design Pressure (MDP), resulting from the worst case two failure condition, is 85 psig. The OGS will not deliver water to the bus when this failure condition exists.

Supply Waste water Flow rate The OGS shall supply waste water to the Node 3 at a nominal flow rate up to 0.54 lb./hr (scar) and at a maximum flow rate of 200 lb/hr. The maximum flow condition occurs only when the OGA rejects feed water to the waste water bus.

Supply waste water Interface control Instrumentation and controls of the waste water interface shall be located within the OGS.

Supply waste water connector The OGS rack shall supply waste water at the Rack Interface Panel via a “Waste Water” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

supply waste water gas content The OGS shall supply waste water to the Node 3 with a maximum gas content of 10% by volume at 40F and 20.7 psia.

SUPPLY Waste GAS The OGS rack will supply waste gases from both the OGA and the CRA to Node 3 at the H2/N2 interface on the rack interface panel, as shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations. Under nominal operation, the CRA will supply waste gas only when the OGA is not supplying waste gas.

SUPPLY Waste GAS Temperature

a.The OGS shall supply either waste hydrogen and nitrogen or waste carbon dioxide and methane to the Node 3 at a temperature range of 65 to 109 deg Fahrenheit (18.3 to 42.8 deg Celsius).
b.Deleted.

SUPPLY Waste GAS Pressure

a. The OGS shall supply waste hydrogen and nitrogen to the Node 3 at a pressure from 2.0 x 10-4 to 0.5 psia.

b. The OGS shall supply waste carbon dioxide or methane to the Node 3 at a pressure from 0 to 1 psia.

SUPPLY Waste gas maximum design Pressure

a.The OGS shall supply either waste hydrogen and nitrogen or waste carbon dioxide and methane to the Node 3 at a maximum design pressure 100 psia.
b.Deleted.

SUPPLY Waste GAS Flow rate

a. The OGS shall supply waste hydrogen and nitrogen to the Node 3 at a maximum flow rate of 0.12 lb./hr.

b. The OGS shall supply waste carbon dioxide and methane to the Node 3 at a maximum flow rate of 0.72 lb./hr.

Supply waste gas connector

a.The OGS rack shall supply either waste H2/N2 or waste CO2/CH4 at the Rack Interface Panel via a “H2/N2” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.
b.The CO2/CH4 waste gas interface defined in Table 3.2.1.4-2 will not be used. The connectors shall be left permanently unmated.

SUPPLY WASTE GAS WATER CONTENT

a.Under normal operating conditions, and after a single failure, the OGS shall supply hydrogen/nitrogen waste gas from the OGA having a water vapor content of 0.035 lb./hr. The worst case hydrogen/nitrogen water content, after two failures will be 100 lb./hr. for a maximum duration of 100 seconds.
b.Under normal operating conditions, the OGS shall supply CO2/CH4 waste gas from the CRA having a water vapor content of 0.03 lb./hr, maximum. The worst case CRA waste gas water vapor content under failure conditions will be 0.075 lb/hr for a maximum duration of 5 minutes.

RECeive Carbon DIoxide (SCAR) The OGS shall receive carbon dioxide from the Node 3. The carbon dioxide interface is at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

RECeive Carbon DIoxide Temperature The OGS shall receive carbon dioxide from the Node 3 at a temperature range of 55 to 113 deg Fahrenheit (13 to 45 deg Celsius) (TBR).

RECeive Carbon DIoxide Pressure The OGS shall receive carbon dioxide from the Node 3 at a pressure from 0 to 1 psia.

RECeive Carbon DIoxide maximum design Pressure The OGS shall receive carbon dioxide from the Node 3 at a maximum pressure of 15.2 psia.

RECeive Carbon DIoxide Flow rate The OGS shall receive carbon dioxide from the Node 3 at a flow rate up to 2 lb/hr.

RECeive Carbon DIoxide Interface control Instrumentation and controls of the carbon dioxide interface shall be located within the OGS.

Receive carbon dioxide connector The OGS rack shall receive CO2 at the Rack Interface Panel via a “CO2” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

SUPPLY CABIN OXYGEN

The OGS shall supply oxygen directly to the Node 3 cabin from the face of the rack. The location of the oxygen port is shown in Figure 3.2.1.4.9-1, OGS Rack Faceplate.

SUPPLY CABIN OXYGEN Temperature The OGS shall supply cabin oxygen to the Node 3 at a temperature range of 60 to 113 deg Fahrenheit (15.6 to 45 deg Celsius).

SUPPLY CABIN OXYGEN Pressure The OGS shall supply cabin oxygen to the Node 3 at a back pressure of 0 psig.

SUPPLY CABIN OXYGEN Flow rate The OGS shall supply cabin oxygen to the Node 3 at a maximum flow rate of 0.85 lb./hr.

Supply CABIN OXYGEN Interface control Instrumentation and controls of the cabin oxygen interface shall be located within the OGS.

SUPPLY CABIN OXYGEN WATER CONTENT

The OGS shall supply oxygen having a water content of less than 5 cc/day to the Node 3 cabin.

RECEIVE CABIN AIR

The OGS shall receive cabin air from the Node 3 cabin at a flow rate of 5.9 cfm via a AAA inlet port on the OGS Rack faceplate. Additional characteristics of Node 3 cabin air are defined in 3.2.1.8.4 herein. The location of the AAA inlet port is shown in Figure 3.2.1.4.9-1, OGS Rack Faceplate.

RETURN RACK AIR

The OGS shall return rack air to the Node 3 cabin via rack leakage.

RETURN RACK AIR TEMPERATURE

The OGS shall return rack air to the Node 3 cabin at a temperature range of 66 to 78 deg Fahrenheit (18.9 to 25.6 deg Celsius).

RETURN RACK AIR PRESSURE

The OGS shall return rack air to the Node 3 cabin at a back pressure of 0 psig.

RETURN RACK AIR FLOW RATE

The OGS shall return rack air to the Node 3 cabin at a flow rate of 5.9 cfm.

CABIN AIR HEAT LOAD

The heat load imposed on the cabin air by the combination of rack air return and cabin oxygen supply from the OGS rack shall not exceed 30 Watts sensible and 10 Watts latent.

3-15

OXYGEN

OUTLET

PORT

Figure 3.2.1.4.9-1 OGS Rack Faceplate (page 1 of 2)

Section C-C -J-

Detail A

Figure 3.2.1.4.9-1 OGS Rack Faceplate (page 2 of 2)

ELECTRICAL INTERFACES

Receive POWER The Node 3/OGS Rack electrical power interfaces are at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

a. The OGS rack shall receive a single 6 kW main power feed from Node 3 on connector J1 at the RIP.

b. The OGS rack shall receive a single 3 kW main power feed from Node 3 on connector J2 at the RIP.

The electrical power connector pin assignments are shown in Table 3.2.1.5-3 J1 Main Power Connector Description and Pin Assignments and in Table 3.2.1.5-4 J2 Main Power Connector Description and Pin Assignments.

Table 3.2.1.5-3 J1 Main Power Connector Description and Pin Assignments CONNECTOR ID (J1 Power)

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G25LN3SN
Connector Part No. (OGS Rack)
NATC07T25LN3PN
Insert Arrangement
25L-3

PIN FUNCTION TABLE

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Notes
A
120 VDC SUPPLY
EO
4
SC
SSQ 21652
B
NOT USED
C
120 VDC RETURN
EO
4
SC
SSQ 21652

Table 3.2.1.5-4 J2 Main Power Connector Description and Pin Assignments CONNECTOR ID (J2 Power)

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G25LN3SA
Connector Part No. (OGS Rack)
NATC07T25LN3PA
Insert Arrangement
25L-3

PIN FUNCTION TABLE

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Notes
A
120 VDC SUPPLY
EO
8

SSQ 21652

B
NOT USED
C
120 VDC RETURN
EO
8

SSQ 21652

POWER QUALITY

Applicable electrical power quality standards are defined in SSP 30482, Electrical Power Specifications and Standards, Volume 1 for “Interface B”.

MDM hardwire interface The Node 3 shall exchange MDM hardwire data with the following OGS components in accordance with SSP 30261:002:

a. Avionics Air Assembly

b. Rack Power Switch

c. Area Smoke Detector

d. CO2 Valve

e. Carbon Dioxide Management Subassembly (CMS) Pressure Transducer The MDM hardwire interface is at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations. The MDM hardwire data connector pin assignments are shown in Table 3.2.1.6-1 J3 Hardwire Data Connector Description and Pin Assignments. The OGS to Node 3, MDM hardwire cables shall be less than 60 feet in length.

Table 3.2.1.6-1 J3 Hardwire Data Connector Description and Pin Assignments CONNECTOR ID (J3 Hardwire Data)

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G17N35PN
Connector Part No. (OGS Rack)
NATC07T17N35SN
Insert
17-35

J3 PIN FUNCTION TABLE

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Notes
1
SMOKE DET OBSCURATION +
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
2
SMOKE DET OBSCURATION -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
3
Not Used
4
Not Used
5
SMOKE DETECTOR SCATTER+
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
6
SMOKE DETECTOR SCATTER -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
7
Not Used
8
Not Used
9
Not Used
10
Not Used
11
CMS PRESSXDCR RANGE +
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
12
CMS PRESSXDCR +
EO
22
TP
SSQ 21656 or MIL-DTL-27500
13
CMS PRESSXDCR -
EO
22
TP
SSQ 21656 or MIL-DTL-27500
14
CO2 SOL CMD +
EO
22
TP
SSQ 21656 or MIL-DTL-27500
15
CO2 SOL CMD -
EO
22
TP
SSQ 21656 or MIL-DTL-27500
16
Not Used
17
Not Used
18
CMS PRESSXDCR RANGE -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
19
AAA FLOW TEMP1 MEAS +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
20
AAA FLOW TEMP2 MEAS +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
21
AAA FLOW TEMP2 MEAS -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
22
CO2 HOLD CMD +
EO
22
TP
SSQ 21656 or MIL-DTL-27500
23
CO2 HOLD CMD -
EO
22
TP
SSQ 21656 or MIL-DTL-27500
24
Not Used
25
Not Used
26
AAA FLOW TEMP1 MEAS -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
27
AAA ENABLE CMD +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
28
AAA ENABLE CMD -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
29
RPS POWER INDICATOR +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
30
RPS POWER INDICATOR -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
31
Not Used
32
Not Used
33
Not Used
34
CO2 OPEN POSITION +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
35
SMOKE DET BIT ENABLE +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
36
SMOKE DET BIT ENABLE -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
37
RPS SWITCH POSITION +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
38
RPS SWITCH POSITION -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
39
Not Used
40
Not Used
41
CMS PRESSXDCR MEAS +
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
42
CO2 OPEN POSITION -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
43
CO2 CLOSE POSITION +
HO
22
TP
SSQ 21656 or MIL-DTL-27500
44
CO2 CLOSE POSITION -
HO
22
TP
SSQ 21656 or MIL-DTL-27500
45
AAA SPEED FEEDBACK +
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
46
Not Used
47
Not Used
48
CMS PRESSXDCR MEAS -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
49
AAA SPEED CMD +
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
50
AAA SPEED CMD -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
51
AAA SPEED FEEDBACK -
ML
22
TSP
SSQ 21656 or MIL-DTL-27500
52
Not Used
53
Not Used
54
Not Used
55
Not Used

mil-std-1553B interfaces Node 3 shall provide the following 1553B data interfaces to the following components in the OGS Rack. Each interface shall consist of two separate, bi-directional 1553B stubs.

a. OGA Process Controller

b. Sabatier Reactor Subassembly (SRS) (scar).

c. RPCM.

d. CMS (scar).

The 1553B data interfaces are provided by J4 for Bus A and J5 for Bus B at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations. The 1553 data connector pin assignment is shown Table 3.2.1.6-2 J4 1553B A Data Connector Description and Pin Assignments and in Table 3.2.1.6-3 J5 1553B B Data Connector Description and Pin Assignments.

Table 3.2.1.6-2 J4 1553B A Data Connector Description and Pin Assignments CONNECTOR ID (J4 1553B Channel A)

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G13N35PN
Connector Part No. (OGS Rack)
NATC07T13N35SN
Insert
13-35

PIN FUNCTION TABLE

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Notes
1
NOT USED
2
NOT USED
3
NOT USED
4
NOT USED
5
NOT USED
6
NOT USED
7
NOT USED
8
NOT USED
9
NOT USED
10
NOT USED
11
NOT USED
12
NOT USED
13
NOT USED
14
NOT USED
15
LB-SYS-FLY-1 A HI
RF
22
TSP
Sabatier Process Controller (scar)
16
LB SYS-FLY-1 A LO
RF
22
TSP
Sabatier Process Controller (scar)
17
LB SYS-FLY-1 A HI
RF
22
TSP
OGA Process Controller
18
LB SYS-FLY-1 A LO
RF
22
TSP
OGA Process Controller
19
LB SEPS-N3-14 A HI
RF
22
TSP
RPCM 1B4A
20
LB SEPS-N3-14 A LO
RF
22
TSP
RPCM 1B4A
21
LB SYS-FLY-1 A HI
RF
22
TSP
CMS Process Controller (scar)
22
LB SYS-FLY-1 A LO
RF
22
TSP
CMS Process Controller (scar)

Table 3.2.1.6-3 J5 1553B B Data Connector Description and Pin Assignments CONNECTOR ID (J5 1553B Channel B)

Mating Cable Connector Part No. (Node 3 Cable)
NATC06G13N35PA
Connector Part No. (OGS Rack)
NATC07T13N35SA
Insert Arrangement
13-35

PIN FUNCTION TABLE

Cont ID
Signal Function
EMC Class
AWG
Wire Type
Notes
1
NOT USED
2
NOT USED
3
NOT USED
4
NOT USED
5
NOT USED
6
NOT USED
7
NOT USED
8
NOT USED
9
NOT USED
10
NOT USED
11
NOT USED
12
NOT USED
13
NOT USED
14
NOT USED
15
LB-SYS-FLY-1 B HI
RF
22
TSP
Sabatier Process Controller (scar)
16
LB SYS-FLY-1 B LO
RF
22
TSP
Sabatier Process Controller (scar)
17
LB SYS-FLY-1 B HI
RF
22
TSP
OGA Process Controller
18
LB SYS-FLY-1 B LO
RF
22
TSP
OGA Process Controller
19
LB SEPS-N3-14 B HI
RF
22
TSP
RPCM 1B4A
20
LB SEPS-N3-14 B LO
RF
22
TSP
RPCM 1B4A
21
LB SYS-FLY-1 B HI
RF
22
TSP
CMS Process Controller (scar)
22
LB SYS-FLY-1 B LO
RF
22
TSP
CMS Process Controller (scar)

1553B BUS STANDARD FORMAT

The Node 3/OGS Rack 1553B interface shall be in accordance with MIL-STD-1553B.

1553B bus signal characteristics The OGS /Node 3 data interface signal characteristics shall be in accordance with MIL-STD-1553B.

1553B bus coupling

a. The Node 3/OGS 1553B interfaces shall be transformer coupled, on the Node 3 side of the Interface, in accordance with MIL-STD-1553B.

b. The OGS 1553B harness inside the rack shall be less than 10 feet.

terminal operations The OGS components with software shall respond as a remote terminal to the Node 3 bus controller in accordance with MIL-STD-1553B.

1553B bus interface functions The OGS shall provide the MIL-STD-1553B interface capability defined in paragraph 3.2.1.7 herein.

Time distribution Not applicable.

SOFTWARE INTERFACES

The OGS Rack to Node 3 software interfaces shall be as defined in the following documents:

a.SSP 50405, Software Interface Control Document (ICD) Hub Control Zone (HCZ) Multiplexer/ Demultiplexer (MDM) to International Space Station (ISS) Book 5 Oxygen Generator Assembly (OGA) Interface
b.RR00022V2, Remote Power Controller Module, Component Data Interface Specification

environments OGS Bonding Interface The OGS Rack shall provide a bonding receptacle in accordance with SSP 41017, part 1, paragraphs 3.2.1.3.4 and 3.2.2.3.5, and SSP 41017, part 2, paragraph 3.2.1.

STRUCTURAL LOADS

The OGS shall withstand structural loads as specified in SSP 41017, Part 1, paragraph 3.2.1.4.3, without loss of functionality as defined herein.

Acceleration The OGS shall withstand launch and landing accelerations as defined in SSP 41017, Part 1, paragraph 3.2.1.4.2, without loss of functionality as defined herein.

vibroacoustics The OGS shall withstand launch and landing vibroacoustics as defined in SSP 41017, Part 1, paragraph 3.2.1.4.1, without loss of functionality as defined herein.

ATMOSPHERE

The OGS shall exchange atmosphere with the Node 3 cabin.

ATMOSPHERE CHARACTERISTICS

atmosphere temperature The OGS shall operate in an ambient atmosphere temperature of 63° to 85°F.

atmosphere pressure The OGS shall operate in the Node 3 at ambient pressures between 13.9 to 15.2 psia.

Atmosphere humidity The OGS shall operate in an atmosphere with a dew point of 40° to 60°F (4.5° to 15.5°C) and a relative humidity between 25% to 70%.

REPRESSURIZATION/DEPRESSURIZATION

The OGS rack structure, when exposed to pressure changes caused by fire suppression, controlled module depressurization, and controlled module pressurization, will not permanently deform. The rack structure shall withstand the following conditions:

Max. Depressurization rate per SSP 41017, paragraph 3.2.1.4.4.

Max. Repressurization rate = 8 psi/min (920 Pa/s) OXYGEN concentration The OGS shall operate within an oxygen concentration of up to 24.1%.

NODE 3 INTERFACE REQUIREMENTS

ENVELOPE REQUIREMENTS

The Node 3 shall reserve volume for the OGS rack envelope as defined in SSP 41017, Part 1, paragraph 3.2.2.1, except for (1) the volume to route the utilities to the Rack Interface Panel and (2) the volume to stow the utilities for launch.

MASS PROPERTIES

MASS

The Node 3 shall accommodate an integrated rack with the mass requirements defined in SSP 41017, Part 1, paragraph 3.2.2.2.

CENTER OF MASS

Deleted.

STRUCTURAL/MECHANICAL ATTACHMENT

The structural/mechanical interface description is defined in SSP 41017, Part 1, paragraph 3.2.2.3.

The Node 3 structural/mechanical interface is as defined in SSP 41017, Part 2, paragraphs 3.2 and 3.3.

RACK Interface panel The Node 3 shall interface with an OGS rack interface panel for connection of utilities between Node 3 and OGS. The interface plane is at the rack interface panel as shown in Figure 3.2.1.3-1 OGS/Node 3 Rack Interface Plane. Figure 3.2.1.3-2 OGS Specific Panel Connector Locations defines the rack interface panel layout.

Accessibility The Node 3 to OGS utility shall comply with accessibility requirements of SSP 50005.

FLUID INTERFACES

Fire suppressant Not applicable.

SUPPLY COOLANT

The Node 3 shall supply single-phase moderate temperature loop water coolant to the OGS for active heat acquisition and transport. The supply coolant interfaces are at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

Node 3 HEAT TRANSPORT CAPABILITY The Node 3 shall accommodate a maximum MTL heat load from the OGS Rack, including CRA, of 2880 Watts.

supply Coolant characteristics supply coolant specification The single-phase water coolant shall comply with the requirements of SSP 30573.

supply coolant temperature The Node 3 shall supply moderate temperature coolant at 61 to 65 °F (16 to 18.3 °C).

supply coolant pressure The Node 3 shall nominally supply moderate temperature coolant at an operating pressure in the range of 18 to 100 psia.

Supply Coolant Flow Rate The Node 3 shall supply moderate temperature loop coolant at a minimum flow rate of 483 lb./hr.

SUPPLY coolant rate/PRESSURE DROP The Node 3 shall accommodate a pressure drop of 7.2 + 0.1 psid at a flow rate of 483 lb/hr across the rack to Node 3 Moderate Temperature Loop interface.

SUPPLY coolant quantity Not Applicable.

SUPPLY coolant leakage rate The Node 3 shall accommodate a rack coolant leakage rate of 9E-3 scc/hr at the maximum pressure specified in paragraph 3.2.2.4.2.2.3.

Supply Coolant connector The Node 3 shall supply coolant at the rack interface panel via a “MT Water Supply” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

receive RETURN COOLANT The Node 3 shall receive moderate temperature return coolant from the OGS. The receive return coolant interfaces are at the rack interface panel shown in Figure 3.2.1.3-2 OGS Specific Panel Connector Locations.

receive RETURN COOLANT CHARACTERISTICS receive RETURN COOLANT SPECIFICATIONS The Node 3 shall receive coolant with the requirements of SSP 30573.

receive RETURN COOLANT TEMPERATURE The Node 3 shall receive return moderate temperature coolant at a temperature in the range of 61 to 120°F.

Return Coolant connector The Node 3 shall receive coolant at the rack interface panel via a “MT Water Return” connector as defined in Table 3.2.1.4-2 Fluid Interface Connectors.

SUPPLY Nitrogen The Node 3 shall supply…

This is the start of the file's text. The full file is on GovTribe.

File details come from the government source that posted it. Updated .