SSP41148.pdf
PDF 48 KB Posted
- Attached to
- Human Space Flight Technical Integration Contract (HSFTIC) Federal contract opportunity
- Solicitation number
- 80JSC019R0023
About this file
This document is a notice of a forthcoming solicitation for the Human Space Flight Technical Integration Contract (HSFTIC). NASA/JSC plans to issue a Request for Proposal (RFP) on or about November 1, 2019 for technical integration services to support human space flight programs, with proposals due on or about December 11, 2019. The procurement is set aside for small businesses with a NAICS code of 541715 and size standard of 1,250 employees. The solicitation and any amendments will be available on the JSC procurement website and FBO.gov. Prospective offerors must notify the agency of their intent to submit a proposal and monitor the websites for solicitation releases and amendments. All technical questions must be submitted in writing.
SSP41148
View the file
Other files for this federal contract opportunity
Show all 50
Human Space Flight Technical Integration Contract (HSFTIC) has more files on GovTribe.
On GovTribe
Work with this file on GovTribe
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
SSP 41148
National Aeronautics and Space Administration International Space Station Program Johnson Space Center Houston, Texas Contract No. NAS15–10000 (DR VE06)
International Space Station Program
Revision D
September 30, 1998
Type 3 Document, For Information, Surveillance, Review or Management Control
Active Common Berthing Mechanism to Passive Common Berthing Mechanism Interface Control Document, Part 1
SSP 41148 Part 1 Revision D 30 September 1998
REVISION AND HISTORY PAGE
REV. DESCRIPTION PUB.
DATE
– Baseline Issue 12–08–94
CHANGE 1, IRN 0145 (REFERENCE SSCN 000145 EFF. 6/24/96) 06–24–96
CHANGE 2, IRN 0003 per CCR 000263 03–18–97
A Revision A per CCR 000475 10–10–97 Incorporated Approved PIRNs as follows:
PIRN 41148–0001, 41148–0002 & 41148–0003.
For information: The PIRNs rolled into Revision A by previously released IRNs or as part of Revision A are noted below with their associated SSCN.
PIRN 41148–0001 IRN 0003 SSCN 000263
PIRN 41148–0002 IRN 0003 SSCN 000263
PIRN 41148–0003 IRN 0003 SSCN 000263
PIRN 41148–0004 IRN 0145 SSCN 000145
B Revision B released per SSCN 001252. 09–10–98 Incorporates the following PIRNs associated with the appropriate SSCNs.
PIRN 41148–0006A IRN N/A SSCN 001252
PIRN 41148–0007A IRN N/A SSCN 001252
PIRN 41148–0008A IRN N/A SSCN 001252
Note: IRN 0005 was never released, but was cancelled, as changes were rolled into Revision B. Due to past history of this document, IRN numbers 0001, 0002, and 0004, have been retired without use. The only traceability that can be found is that these IRN numbers were withdrawn.
C Revision C released per SSCN 001465. 09–21–98 Incorporates the following PIRNs associated with the current SSCN.
PIRN 41148–0009B IRN N/A SSCN 001465
IRN 0005 (PIRN 41148–0010) incorporates SSCN 001594 10–09–98
IRN 0008 (PIRN 41148–0011) incorporates SSCN 001481 10–09–98
IRN 0009 (PIRN 41148–0012) incorporates SSCN 001555 10–09–98
D Revision D released per SSCN 001665. 10–09–98 Incorporates the following PIRNs associated with the appropriate SSCNs.
PIRN 41148–0014 IRN N/A SSCN 001665
i
PREFACE
The contents of this document are intended to be consistent with the tasks and products to be prepared by Program participants. The Active Common Berthing Mechanism to Passive Common Berthing Mechanism Interface Control Document (ICD) shall be implemented on all new International Space Station contractual and internal activities and shall be included in any existing contracts through contract changes. This document is under the control of the Prime Contractor Interface Control Working Group (ICWG), and any changes or revisions will be approved by the Prime ICWG Chairman or have a statement to indicate the delegated authority.
/s/ Craig Aman 09/30/98
Boeing Prime ICWG Chairman, Date International Space Station ii
INTERNATIONAL SPACE STATION PROGRAM
ACTIVE COMMON BERTHING MECHANISM TO
PASSIVE COMMON BERTHING MECHANISM
INTERFACE CONTROL DOCUMENT, PART 1
30 SEPTEMBER 1998
CONCURRENCE
PREPARED BY:
CHECKED BY:
SIGNATURE
SUPERVISED BY
PRINT NAME ORGN
DATE
SIGNATURE
PRINT NAME ORGN
DATE
SUPERVISED BY
SIGNATURE
PRINT NAME ORGN
DATE
SIGNATURE
PRINT NAME ORGN
DATE
DQA:
SIGNATURE
PRINT NAME ORGN
DATE
(BOEING):
(NASA):
Kevin Orr 2–6610
Tony Davis
Brad Cohen
Adam Burkey
2–6610
2–6910
2–6610
OB111
/s/ Adam R. Burkey 9/29/98
TABLE OF CONTENTS
PARAGRAPH PAGE
iii
1.0 INTRODUCTION 1 - 1
1.1 PURPOSE 1 - 1
1.2 SCOPE 1 - 1
1.3 PRECEDENCE 1 - 1
2.0 APPLICABLE DOCUMENTS 2 - 1
3.0 ACTIVE COMMON BERTHING MECHANISM TO PASSIVE COMMON
BERTHING MECHANISM INTERFACES 3 - 1
3.1 GENERAL 3 - 1
3.1.1 INTERFACE DESCRIPTION 3 - 1
3.1.1.1 ACTIVE COMMON BERTHING MECHANISM DESCRIPTION 3 - 1
3.1.1.2 PASSIVE COMMON BERTHING MECHANISM DESCRIPTION 3 - 1
3.1.1.3 INTERFACE PLANE DESCRIPTION 3 - 1
3.1.1.4 COORDINATE SYSTEM 3 - 1
3.1.1.5 ENGINEERING UNITS AND TOLERANCES 3 - 2
3.1.1.5.1 TOLERANCE 3 - 4
3.1.1.6 ACBM INTERFACE FUNCTIONS 3 - 4
3.1.1.7 PCBM INTERFACE FUNCTIONS 3 - 4
3.1.2 INTERFACE RESPONSIBILITIES 3 - 4
3.1.2.1 RESPONSIBILITY FOR THE ACBM 3 - 4
3.1.2.2 RESPONSIBILITY FOR THE PCBM 3 - 4
3.2 INTERFACE REQUIREMENTS 3 - 5
3.2.1 ACBM INTERFACE REQUIREMENTS 3 - 5
3.2.1.1 ENVELOPE REQUIREMENTS 3 - 5
3.2.1.1.1 ENVELOPE 3 - 5
3.2.1.1.2 RESERVED VOLUMES 3 - 5
3.2.1.1.2.1 PCBM HARDWARE 3 - 5
3.2.1.2 STRUCTURAL/MECHANICAL ATTACHMENT 3 - 5
3.2.1.2.1 VESTIBULE CLEARANCES 3 - 5
3.2.1.2.2 ATMOSPHERIC CONTAINMENT 3 - 5
3.2.1.3 ALIGNMENT 3 - 5
3.2.1.4 CAPTURE 3 - 5
3.2.1.5 RIGIDIZATION 3 - 5
3.2.1.6 DELETED 3 - 7
3.2.1.7 PROXIMITY DETECTION 3 - 7
3.2.1.8 ENVIRONMENTS 3 - 7
3.2.1.8.1 ELECTROMAGNETIC EFFECTS 3 - 7
3.2.1.8.1.1 GROUNDING 3 - 7
3.2.1.8.1.2 BONDING 3 - 7
3.2.1.8.2 STRUCTURAL LOADS 3 - 7
3.2.1.8.2.1 BERTHING AND ON–ORBIT 3 - 7
3.2.1.8.2.2 LAUNCH AND LANDING 3 - 7
3.2.1.8.3 VIBROACOUSTICS 3 - 7
3.2.1.8.4 THERMAL 3 - 7
3.2.1.8.5 CONTACT CONDUCTANCE 3 - 7
3.2.1.9 DEPRESSURIZATION 3 - 8
TABLE OF CONTENTS – Continued
PARAGRAPH PAGE
iv
3.2.1.10 REPRESSURIZATION 3 - 8
3.2.2 PCBM INTERFACE REQUIREMENTS 3 - 8
3.2.2.1 ENVELOPE REQUIREMENTS 3 - 8
3.2.2.1.1 ENVELOPE 3 - 8
3.2.2.1.2 RESERVED VOLUMES 3 - 8
3.2.2.1.2.1 ACBM INTERFACE HARDWARE 3 - 8
3.2.2.2 STRUCTURAL/MECHANICAL ATTACHMENT 3 - 8
3.2.2.2.1 VESTIBULE CLEARANCES 3 - 8
3.2.2.2.2 ATMOSPHERIC CONTAINMENT 3 - 8
3.2.2.3 ALIGNMENT 3 - 8
3.2.2.4 CAPTURE 3 - 8
3.2.2.5 RIGIDIZATION 3 - 9
3.2.2.6 DELETED 3 - 9
3.2.2.7 PROXIMITY DETECTION 3 - 9
3.2.2.8 ENVIRONMENTS 3 - 9
3.2.2.8.1 ELECTROMAGNETIC EFFECTS 3 - 9
3.2.2.8.1.1 GROUNDING 3 - 9
3.2.2.8.1.2 BONDING 3 - 9
3.2.2.8.2 STRUCTURAL LOADS 3 - 9
3.2.2.8.2.1 BERTHING AND ON–ORBIT 3 - 9
3.2.2.8.2.2 LAUNCH AND LANDING 3 - 9
3.2.2.8.3 VIBROACOUSTICS 3 - 9
3.2.2.8.4 THERMAL 3 - 9
3.2.2.8.5 CONTACT CONDUCTANCE 3 - 10
3.2.2.9 DEPRESSURIZATION 3 - 10
3.2.2.10 REPRESSURIZATION 3 - 10
APPENDIX PAGE
A ABBREVIATIONS AND ACRONYMS A - 1
TABLE PAGE
TABLES
v
3.1.1.5.1–1 LINEAR TOLERANCES 3 - 4
FIGURE PAGE
FIGURES
vi
3.1.1–1 FUNCTIONAL INTERFACE DIAGRAM 3 - 1
3.1.1.4–1 ACTIVE COMMON BERTHING MECHANISM COORDINATE SYSTEM 3 - 2
3.1.1.4–2 PASSIVE COMMON BERTHING MECHANISM COORDINATE SYSTEM 3 - 3
3.2.1.1.1–1 BERTHED ENVELOPE 3 - 6
1 - 1
1.0 INTRODUCTION
The Space Station Common Berthing Mechanism (CBM) will be used on the European Space Agency (ESA) Element, the Italian Space Agency (ASI) element, the National Space Development Agency of Japan (NASDA) Elements, and the National Aeronautics and Space Administration (NASA) Elements.
There are two types of CBMs used on the Space Station. These are referred to as the Active CBM (ACBM) and the Passive CBM (PCBM).
1.1 PURPOSE
The purpose of this document is to provide definition of the structural/mechanical, interface functional requirements between the ACBM and the PCBM.
1.2 SCOPE
The scope of this document is limited to interfaces between the ACBM and the PCBM.
1.3 PRECEDENCE
In the event of conflict between SSP 41162, Segment Specification for the United States On–orbit Segment and the contents of this Interface Control Document (ICD), the requirements of SSP 41162 shall take precedence.
1 - 2
(This page intentionally left blank)
2 - 1
2.0 APPLICABLE DOCUMENTS
The following applicable documents of the exact issue shown form a part of this specification to the extent specified herein. Inclusion of applicable documents herein does not in any way supersede the order of precedence identified in 1.3. The references show where each applicable document is cited in this document.
DOCUMENT NO. TITLE
SSP 30240 Space Station Grounding Requirements Revision C Paragraph: 3.2.1.8.1.1, 3.2.2.8.1.1 September 30, 1998
SSP 30245 Space Station Electrical Bonding Requirements Revision D, DCN 004, 005 Paragraph: 3.2.1.8.1.2, 3.2.2.8.1.2 June 4, 1998
SSP 41004 Common Berthing Mechanism to Pressurized Elements Revision F Interface Control Document, Part 1 IRN 41004-1465, 1594, 1481, Paragraph: 3.2.1.1.1, 3.2.1.2.1, 3.2.2.1.1, 3.2.2.2.1 April 30, 1998
SSP 50023 Thermal Control Plan Revision Basic Paragraph: 3.2.1.8.4, 3.2.2.8.4 April 15, 1994
3 - 1
3.0 ACTIVE COMMON BERTHING MECHANISM TO PASSIVE COMMON BERTHING
MECHANISM INTERFACES
3.1 GENERAL
This section defines the functional interface requirements between the ACBM and the PCBM.
3.1.1 INTERFACE DESCRIPTION
The ACBM to PCBM interface consists of the structural/mechanical attachment, capture, rigidization, alignment, and proximity detection. A functional interface diagram is shown in Figure 3.1.1–1.
ACBM PCBM
Capture
Rigidization
Structural / Mechanical
Alignment
Proximity Detection
FIGURE 3.1.1–1 FUNCTIONAL INTERFACE DIAGRAM
3.1.1.1 ACTIVE COMMON BERTHING MECHANISM DESCRIPTION
The ACBM is a mechanism which berths with a PCBM on orbit to provide a common interface between pressurized elements. The ACBM contains active components to accomplish the berthing operation.
3.1.1.2 PASSIVE COMMON BERTHING MECHANISM DESCRIPTION
The PCBM is a mechanism which berths with an ACBM on orbit to provide a common interface between pressurized elements. The PCBM contains passive components to accomplish the berthing operation.
3.1.1.3 INTERFACE PLANE DESCRIPTION
The ACBM to PCBM interface plane is between the ACBM and PCBM sealing surfaces.
3.1.1.4 COORDINATE SYSTEM
The ACBM coordinate system is shown in Figure 3.1.1.4–1. The PCBM coordinate system is shown in Figure 3.1.1.4–2.
3 - 2
ACBM PE
+XACBM
A
A
+ZACBM
RACBM
VIEW A–A
CL
+YACBM
NOTE 1) RACBM and qACBM define a radial coordinate system.
+ZACBM
qACBM
ACBM
FIGURE 3.1.1.4–1 ACTIVE COMMON BERTHING MECHANISM
COORDINATE SYSTEM
3.1.1.5 ENGINEERING UNITS AND TOLERANCES
Dimensions in this document are shown primarily in the English (inch, pound, second) system of units.
3 - 3
PCBM PE
+XPCBM
A
A
+ZPCBM
RPCBM
VIEW A–A
CL
+YPCBM
NOTE 1) RPCBM and qPCBM define a radial coordinate system.
+ZPCBM
qPCBM
PCBM
FIGURE 3.1.1.4–2 PASSIVE COMMON BERTHING MECHANISM
COORDINATE SYSTEM
3 - 4
3.1.1.5.1 TOLERANCE
Linear tolerances on dimensions are as indicated in Table 3.1.1.5.1–1. Angular tolerances are +/– 0.1 degrees on all angles unless otherwise stated.
TABLE 3.1.1.5.1–1 LINEAR TOLERANCES
English dimension Implied tolerance (inches)
X.XX +/– 0.03
X.XXX +/– 0.010
3.1.1.6 ACBM INTERFACE FUNCTIONS
The ACBM shall support the following functions at the interface to the PCBM:
A. Structural/mechanical attachment
B. Alignment
C. Capture
D. Rigidization
E. Proximity detection
3.1.1.7 PCBM INTERFACE FUNCTIONS
The PCBM shall support the following functions at the interface to the ACBM:
A. Structural/mechanical attachment
B. Alignment
C. Capture
D. Rigidization
E. Support proximity detection
3.1.2 INTERFACE RESPONSIBILITIES
3.1.2.1 RESPONSIBILITY FOR THE ACBM
Boeing Defense & Space Group (BD&SG) carries the responsibility for designing the ACBM to the requirements herein.
3.1.2.2 RESPONSIBILITY FOR THE PCBM
BD&SG carries the responsibility for designing the PCBM to the requirements herein.
3 - 5
3.2 INTERFACE REQUIREMENTS
3.2.1 ACBM INTERFACE REQUIREMENTS
3.2.1.1 ENVELOPE REQUIREMENTS
3.2.1.1.1 ENVELOPE
The unberthed ACBM envelope is defined in SSP 41004. The ACBM/PCBM berthed envelope shall be in accordance with Figure 3.2.1.1.1–1.
3.2.1.1.2 RESERVED VOLUMES
3.2.1.1.2.1 PCBM HARDWARE
The ACBM hardware mounting or operation shall not interfere with PCBM hardware.
3.2.1.2 STRUCTURAL/MECHANICAL ATTACHMENT
The ACBM shall supply structural and mechanical provisions for mechanical attachment to the
PCBM.
3.2.1.2.1 VESTIBULE CLEARANCES
The ACBM to PCBM interface shall provide vestibule clearances at the interface plane in accordance with SSP 41004.
3.2.1.2.2 ATMOSPHERIC CONTAINMENT
Total atmospheric leakage for the PCBM/ACBM hardware following berthing shall not exceed
0.084 sccs air at 14.7 psia.
3.2.1.3 ALIGNMENT
The ACBM shall provide and receive alignment to and from the PCBM during on–orbit assembly. When fully berthed the alignment of the ACBM to PCBM interface shall allow clear passage and ACBM and PCBM hardware envelopes in accordance with Figure 3.2.1.1.1–1.
3.2.1.4 CAPTURE
The ACBM shall provide the active components necessary to capture the PCBM during on–orbit assembly.
3.2.1.5 RIGIDIZATION
The ACBM shall provide the active mechanism to rigidize the ACBM to PCBM interface during on–orbit assembly.
3 - 6
54.83 (1393)
MAX
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
∅ 82.00 (2083)
MAX
R 12.00 (305)
MAX
ÉÉ
ÉÉ
CLEAR PASSAGE ENVELOPE
ACPM/PCBM HARDWARE ENVELOPE
ACBM OR PCBM HARDWARE MAY ENCROACH ON THIS AREA PROVIDED
THE INTRUSION DOES NOT INTERFERE WITH PE STRUCTURE
16.33 (414.8)
MAX
1.0 (25)
MAX
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
3.35 (85.1)
MAX
XPCBM=0
PE
STRUCTURE
REF
50.00 MIN
50.00 REF
XACBM=0
1.0 (25)
MAX
3.35 (85.1)
MAX
A A
Section A–A
FIGURE 3.2.1.1.1–1 BERTHED ENVELOPE
Note 1: Envelope does not include M/D covers/skirts
Note 1
Note 2: Dimensions shown are in inches (millimeters)
3 - 7
3.2.1.6 DELETED
3.2.1.7 PROXIMITY DETECTION
The ACBM shall detect the proximity of the PCBM to indicate when ready to begin the capture process.
3.2.1.8 ENVIRONMENTS
3.2.1.8.1 ELECTROMAGNETIC EFFECTS
3.2.1.8.1.1 GROUNDING
The ACBM to PCBM interface shall meet the requirements of SSP 30240.
3.2.1.8.1.2 BONDING
The ACBM to PCBM structural/mechanical interface shall meet the requirements of SSP 30245.
3.2.1.8.2 STRUCTURAL LOADS
3.2.1.8.2.1 BERTHING AND ON–ORBIT
The ACBM to PCBM interface shall survive loads induced on the ACBM as specified in the applicable element–to–element interface control documents.
3.2.1.8.2.2 LAUNCH AND LANDING
ACBM to PCBM interfaces that are launched when mated shall survive launch and landing loads as specified in the applicable element–to–element interface control documents.
3.2.1.8.3 VIBROACOUSTICS
ACBM to PCBM interfaces that are launched when mated shall survive the launch vibroacoustics as specified in the applicable element–to–element interface control documents.
3.2.1.8.4 THERMAL
The ACBM to PCBM interface shall function as described herein when exposed to the thermal radiation environment as specified in SSP 50023. SSP 50023 specifies math models and thermal design analysis criteria for interface design.
3.2.1.8.5 CONTACT CONDUCTANCE
The ACBM to PCBM interface contact conductance will range between 10.8 and 62 BTU/hour degrees F.
3 - 8
3.2.1.9 DEPRESSURIZATION
The ACBM to PCBM interface shall survive a 0.76 psia/sec depressurization rate without loss of functionality as specified herein.
3.2.1.10 REPRESSURIZATION
The ACBM to PCBM interface shall survive a 0.76 psia/sec repressurization rate to 15.2 psia without loss of functionality as specified herein.
3.2.2 PCBM INTERFACE REQUIREMENTS
3.2.2.1 ENVELOPE REQUIREMENTS
3.2.2.1.1 ENVELOPE
The unberthed PCBM envelope is defined in SSP 41004. The PCBM/ACBM berthed envelope shall be in accordance with Figure 3.2.1.1.1–1.
3.2.2.1.2 RESERVED VOLUMES
3.2.2.1.2.1 ACBM INTERFACE HARDWARE
The PCBM shall not interfere with ACBM hardware mounting or operation.
3.2.2.2 STRUCTURAL/MECHANICAL ATTACHMENT
The PCBM shall supply structural and mechanical provisions for the mechanical attachment to the ACBM.
3.2.2.2.1 VESTIBULE CLEARANCES
The PCBM to ACBM interface shall provide vestibule clearances at the interface plane in accordance with SSP 41004.
3.2.2.2.2 ATMOSPHERIC CONTAINMENT
The ACBM to PCBM seal interface leakage shall not exceed 0.042 sccs air at 14.7 psi.
3.2.2.3 ALIGNMENT
The PCBM shall provide and receive alignment to and from the ACBM during on–orbit assembly. When fully berthed the alignment of the PCBM to ACBM interface shall allow clear passage and PCBM and ACBM hardware envelopes in accordance with Figure 3.2.1.1.1–1.
3.2.2.4 CAPTURE
The PCBM shall provide the passive components necessary to be captured by the ACBM during on–orbit assembly.
3 - 9
3.2.2.5 RIGIDIZATION
The PCBM shall provide the passive components necessary to rigidize the PCBM to ACBM interface during on–orbit assembly.
3.2.2.6 DELETED
3.2.2.7 PROXIMITY DETECTION
The PCBM shall support proximity detection by the ACBM.
3.2.2.8 ENVIRONMENTS
3.2.2.8.1 ELECTROMAGNETIC EFFECTS
3.2.2.8.1.1 GROUNDING
The PCBM to ACBM interface shall meet the requirements of SSP 30240.
3.2.2.8.1.2 BONDING
The PCBM to ACBM structural/mechanical interface shall meet the requirements of SSP 30245.
3.2.2.8.2 STRUCTURAL LOADS
3.2.2.8.2.1 BERTHING AND ON–ORBIT
The PCBM to ACBM interface shall survive the loads as specified in the applicable element–to–element interface control documents.
3.2.2.8.2.2 LAUNCH AND LANDING
PCBM to ACBM interfaces that are launched when mated shall survive launch and landing loads as specified in the applicable element–to–element interface control documents.
3.2.2.8.3 VIBROACOUSTICS
PCBM to ACBM interfaces that are launched when mated shall survive the launch vibroacoustics as specified in the applicable element–to–element interface control documents.
3.2.2.8.4 THERMAL
The PCBM to ACBM interface shall function as described herein when exposed to the thermal radiation environment per SSP 50023. SSP 50023 specifies math models and/or thermal design analysis criteria for interface design.
3 - 10
3.2.2.8.5 CONTACT CONDUCTANCE
The ACBM to PCBM interface contact conductance will range between 10.8 and 62 BTU/hour degrees F.
3.2.2.9 DEPRESSURIZATION
The PCBM to ACBM interface shall survive a 0.76 psia/sec depressurization rate without loss of functionality as specified herein.
3.2.2.10 REPRESSURIZATION
The PCBM to ACBM interface shall survive a 0.76 psia/sec repressurization rate to 15.2 psia without loss of functionality as specified herein.
3 - 11
A - 1
APPENDIX A ABBREVIATIONS AND ACRONYMS
A.1 ABBREVIATIONS AND ACRONYMS
ACBM Active Common Berthing Mechanism
APM Attached Pressurized Module
ASI Italian Space Agency
BD&SG Boeing Defense & Space Group
CBM Common Berthing Mechanism
ESA European Space Agency
ICD Interface Requirements Document
IRD Interface Control Document lbm Pound Mass
NASA National Aeronautics and Space Administration
NASDA The National Space Development Agency of Japan
PCBM Passive Common Berthing Mechanism
PE Pressurized Element psi pounds per square inch psia pounds per square inch absolute sccs Standard Cubic Centimeters per Second sec Second
A - 2
File details come from the government source that posted it. Updated .