PACE_STS_SpecComplianceMatrix-2018-06-15.pdf

Section Requirement Technical Merit Criteria Full Compliance

(FC)/Non-

Compliance (NC)

Comment

2.0 Applicable Documents

3.1 Star Sensor System Description TM

3.2a Ground Support Equipment Description, GSE software

3.2b Ground Support Equipment Description, optical stimulators TM

3.2c Ground Support Equipment Description, GSE mounting interface and alignment hardware

3.2d Ground Support Equipment Description, non-flight baffle covers

4.1.1.1 Attitude Quaternion Solutions

4.1.1.2 Full Performance Attitude Accuracy TM

4.1.1.3 Attitude Data Output Rate TM

4.1.1.4 Attitude Data Time-Tag Accuracy TM

4.1.1.5 Attitude Data Latency

4.1.1.6 Angular Rate Output

4.1.1.7 Angular Rate Accuracy TM

4.1.1.8 Angular Rate Data Output Rate TM

4.1.2 Autonomous Attitude Acquisition Rate Capability TM

4.1.3 Rate and Acceleration Capability for Attitude Solution TM

4.1.4 Rate and Acceleration Capability for Rate Solution TM

4.1.5a 1 Pulse Per Second Interface, acceptance TM

4.1.5b 1 Pulse Per Second Interface, synchronizing TM

4.1.6 Acquisition Time after Power on Time

4.1.7 Warm-Up/Cool-down Time TM

4.1.8 Bright Source Protection - Sun TM

4.1.9 Bright Source Protection - Earth or Moon

4.2.1 Mass Allocation TM

4.2.2 Nominal Power Allocation TM

4.2.3 Peak Power Allocation

4.3.1.1 Operating Voltage Range TM

4.3.1.2 Abnormal Voltages

4.3.1.3 Voltage Ripple

4.3.1.4 Voltage Transients

4.3.1.5 Sudden Removal of Power

4.3.1.7 Over-Current Protection

4.3.1.8 Primary Power Return Ground

4.3.2.1 Turn-on Current Transients

4.3.2.1.1 Turn-on Current Transients (less than 100 microseconds)

4.3.2.2a Operational Current Transients-above steady state

4.3.2.2b Operational Current Transients-rate of change of the current

4.3.2.3 Repetitive Transients

4.4.1 Primary Power DC Isolation

4.4.2 Internally Generated Secondary Returns

4.4.3 Internally Generated Secondary to Primary DC Isolation

4.4.4 Mechanical Contact Resistance

4.4.6 Ground Strap, Non-Conductive Surface

4.4.6.1 Ground Lug Contact Area

4.4.8 Connector DC Resistance

4.5.4.1 Command and Telemetry Interface TM

4.5.4.2 1PPS Clock Signal-acceptance

4.5.4.3 RS-422 Interface

4.5.4.4 1553 Bus Interface

4.5.4.5 SpaceWire Interface

4.6.1 Minimum Operating Modes

4.7.1 Commands TM

4.7.1a Commands-Reset

4.7.1b Commands-Software Table Dump

4.7.1c Commands-Memory Dump

4.7.1d Commands-Software Table Update

4.7.1e Commands-Software Update

4.7.1f Commands-Operating Mode

4.7.1g Commands-Memory Checksum

4.7.1h Commands-Image Acquisition

4.7.1h Commands-Time Message

4.7.2 Data TM

4.7.2a Data-Attitude Quaternions

4.7.2b Data-Attitude Validity

4.7.2c Data-Attitude Quality

4.7.2d Data-Angular Rate Vector

4.7.2e Data-Number of Objects Imaged

4.7.2f Data-Housekeeping

4.8.1 Flight Software and Star Catalog TM

4.8.2 Software Version Identification

4.8.3 Software Updates TM

4.8.4 Software Table Updates TM

4.8.5 Non-Volatile Memory Storage of Flight Code

4.8.6 Boot Code

4.8.7 Star Catalog Version

4.8.8 Software Table Dump

4.8.9 Packet Checksum

4.8.10 Memory Load

4.8.11 Memory Dump

4.8.12 Memory Checksum

4.8.13 Software Instructions

5.1 Interface Documentation

5.1.1 Mechanical Interface

5.1.2 Electrical Interface

5.1.3 Data Interface

5.2.1a Component Masses, instrument TM

5.2.1b Component Masses, spacecraft body TM

5.2.1c Component Masses, measurement tolerance

5.2.2 Center of Mass Location

5.2.3 Center of Mass Accuracy

5.2.4 Determination of Moments and Products of Inertia

5.3 Physical Envelope TM

5.4a Mounting, defined in the MICD

5.4b Mounting, tolerances

5.5 Fields of View

5.5.1 Sun Exclusion Angle TM

5.5.2 Moon and Earth Exclusion Angle TM

5.6.1 Alignment Location/Orientation Accuracy TM

5.6.2 Alignment Knowledge Accuracy

5.6.3a Alignment Stability, optical axes wrt alignment reference

5.6.3b Alignment Stability, alignment reference

5.6.4 Alignment Method

5.6.5a Alignment Measurement Tooling/Features, two adjacent surfaces

5.6.5b Alignment Measurement Tooling/Features, optical reference surfaces

6 Environmental Requirements

6.1a Mechanical Factors of Safety, based on limit loads defined in Table 6-1 TM

6.1b Mechanical Factors of Safety, proof tested

6.2 Quasi-Static Acceleration TM

6.3.1 Fundamental Launch Frequencies

6.4.1 Sinusoidal Vibration

6.4.2a Random Vibration, vibration environment described in Table 6-4 TM

6.4.2b Random Vibration, NASA-HDBK-7005 and NASA-STD-7001

6.4.2c Random Vibration, notching

6.5a Shock, shock environment described in Table 6-6 TM

6.5b Shock, susceptibility and attenuation

6.5c Shock, analysis

6.5d Shock, components determine susceptible

6.6a Acoustics, levels described in Table 6-8

6.6b Acoustics, not susceptible

6.6c Acoustics, component test levels

6.7 Transportation

6.7.1 Transportation Cleanliness

6.8.1 Operating Pressure Range

6.8.2 Maximum Depressurization Rate

6.8.3 Launch Vehicle Environmental Control System Impingement Velocity

6.9 On-Orbit Dynamic Environment

6.9.1.1 Dynamic Linear Acceleration

6.9.1.2 Dynamic Angular Acceleration

6.10a Ground Environments, exposure to air temperature range

6.10b Ground Environments, after being powered off

6.11.1a Component Temperature Limits, when powered off TM

6.11.1b Component Temperature Limits, when powered on TM

6.11.1c Component Temperature Limits, turn on at limits shown in Table 6-10

6.12.2.1 Minimum TID Tolerance for EEE Parts and Materials TM

6.12.2.2 ELDR Evaluation

6.12.3 Displacement Damage Dose

6.12.4a Single Event Effects, non-destructive TM

6.12.4b Single Event Effects, prediction of heavy ion-included SEE's

6.12.4c Single Event Effects, PACE Observatory requirements

6.12.4d Single Event Effects, survive peak proton flux

6.12.4.1a Destructive Events (SELs), all devices TM

6.12.4.1b Destructive Events (SELs), SEL LET

6.12.4.1c Destructive Events (SELs), circumvention techniques

6.12.4.2a Destructive Events (SEBs and SEGRs), power MOSFETs TM

6.12.4.2b Destructive Events (SEBs and SEGRs), survival voltage

6.12.4.2c Destructive Events (SEBs and SEGRs), testing

6.12.4.2d Destructive Events (SEBs and SEGRs), part types not to be used

6.12.4.2e Destructive Events (SEBs and SEGRs), survival voltage from exposure with min LET

6.12.4.3 Non-Destructive Events (SEUs, SETs, SEFIs, SHEs, and MBUs)

6.12.5 Charging Environment

6.13 Atomic Oxygen Fluence

6.13.1 Atomic Oxygen Analysis

6.13.2 Atomic Oxygen Testing

7.1.1.1 Particulate Contamination

7.1.1.2 Molecular Contamination - Exposed Surfaces

7.1.1.3a Molecular Contamination - Covered Surfaces,IEST-STD-CC1246E

7.1.1.3b Molecular Contamination - Covered Surfaces, free of molecular contamination

7.1.2.1 Particulate Generation

7.1.2.2.1 Material Selection TM

7.1.2.2.2 Material Selection-Silicones

7.1.2.2.3a Assembly Outgassing, hot temperature outlined in Table 6-10

7.1.2.2.3b Assembly Outgassing, 2E-8 g/sec per kg of unit

7.1.2.2.3c Assembly Outgassing, external components

7.1.2.2.3d Assembly Outgassing, cold finder/scavenger plate

7.1.2.3 Intentional and Unintentional Vents

7.1.2.4 Intentional and Unintentional Vents - Filters

7.1.2.5a Intentional Vents - Pressure Buildup Prevention during ascent

7.1.2.5b Intentional Vents - Pressure Buildup Prevention during high vacuum

7.1.3.1 Cleanability - Sensitive Surfaces

7.1.3.2 Cleanability - Sensitive Surface Cleaning Methods

7.2.1 Conductive Surface Ground Path

7.2.2 Conductive Surface Resistivity

7.2.3 Closeout of Gaps and Apertures

7.2.3.1 Conductive Tape Surface Resistivity

7.2.3.2 Conductive Tape, Grounding

7.2.4 Exposed Harness Specific Requirements

8.1.2.1 Material Conductivity

8.1.2.2a Material Limitations for Debris Casualty Area, limit use of materials in Table 8-1

8.1.2.2b Material Limitations for Debris Casualty Area, report materials used in Table 8-1

8.1.2.2c Material Limitations for Debris Casualty Area, report assemblies comprised of multiple piece parts of Table 8 1

8.2.1a Test Sensors, designed for flight

8.2.1b Test Sensors, not be removed before flight

8.2.2.1.1a Connector Specifications, selected connector types TM

8.2.2.1.1b Connector Specifications, environmental seals

8.2.2.1.3 Contact Derating

8.2.2.1.4 Redundant Contact Derating

8.2.2.2a Signal Segregation, using separate connectors

8.2.2.2b Signal Segregation, if separate connectors are not feasible

8.2.2.3 Test and Flight Signal Isolation

8.2.2.4.2 Test Interfaces, protected or isolated from facility induced ESD GSE malfunction

8.2.2.4.3 Test Interfaces, protected or isolated from facility induced GSE malfunction

8.2.3.1a Mitigation Strategies for Internal Charging, Impl.

8.2.3.1b Mitigation Strategies for Internal Charging, Analyze

8.2.3.2 Floating Conductors

8.2.3.3.1 Dielectric Structures, bulk resistivity

8.2.3.3.2 Dielectric Structures, charge bleed path to the spacecraft

8.3a Safety, meet the applicable sections of NASA-STD-8719.24 ELV

8.3b Safety, GSE meet requirements in Section 8.8

8.3c Safety, GSE used at Launch site meet the applicable sections of NASA-STD-8719.24

ELV

8.4.1.2 CE101 - Differential Mode Current Emission Limits

8.4.1.3 CE102 - Differential Mode Current Emission Limits

8.4.1.4 Common Mode Current Emissions Limits

8.4.2.2 CS101 - Power Leads, 30 Hz to 150 kHz Limit

8.4.2.3 CS114 - Power Leads, 150 kHz to 50 MHz Limit

8.4.2.4 CS106 - Transients

8.4.2.5 CS114 - Power and Signal Cables, Common Mode

8.4.3.1 RE102 - Electric Field Emissions

8.4.4.1 RS103 - Electric Field

8.5 Identification and Marking, each unit permanently marked

8.5 Identification and Marking, type of ink, engraving, or etching

8.6.2.1 GSE Cable Connectors

8.6.2.2.1 Connector Uniqueness

8.6.2.2.3 Connector Keying

8.6.2.2.4 Accessibility

8.6.2.2.5 Connector Gender

8.6.2.3 Test Connectors

8.6.2.4 Connector Identification

8.6.2.5 Protection of Unused Test Connectors

8.6.2.6 Connector Savers

8.7.1 Mission Life TM

8.7.2 Operating Time

8.7.2.1 Total Time

8.7.2.2a Failure Free Time, 32 hours of failure free operating time

8.7.2.2b Failure Free Time, demonstrate failure-free performance

8.8.1 Ground Support Equipment (GSE) Design

8.8.7 GSE Cleanliness

8.8.8 GSE Bakeout

8.8.9 Test Harness

9.1a Structural Requirements, withstanding worst-case load conditions

9.1b Structural Requirements, formula for margin expression

9.1c Structural Requirements, requirements for metallic/composite allowables

9.1d Structural Requirements, requirements for glass/ceramic allowables

9.1.1 Component Fatigue

9.1.2a Fracture Control Requirements, materials used not listed in Table 1

9.1.2b Fracture Control Requirements, fracture control requirements

9.1.2c Fracture Control Requirements, fracture analysis

9.2.1.1 Factors of Safety

9.2.1.2 Supplemental Factor

9.2.1.3 Ultimate Design Loads

9.2.1.4 Yield Design Loads

9.2.1.5 Design Separation Load

9.2.2.1.1 Locking Feature Minimum

9.2.2.1.2 Locking Feature Verification

9.2.2.1.3 Locking Feature Installation

9.2.2.1.4 Snap Ring & Cotter Pin Use Limitation

9.2.2.1.5 Snap Ring & Cotter Pin Use

9.2.2.2.1 Torque Measurement

9.2.2.2.2 Witness Coupons

9.2.2.2.3 Cure Samples

9.2.2.3.1 Specification

9.2.2.3.2 Validation

9.2.2.4.1 Installation Torque Range

9.2.2.4.2 Running Torque Identification

9.2.3.1 Minimum and Maximum Preload

9.2.3.2 Analysis Addressing Potential Rupture

9.2.3.3 Ultimate Strength Analysis

9.2.3.4 Applied Shear Loading

9.2.3.5 Shear Loading

9.2.3.6 Simultaneous Applied Tensile and Shear Loads

9.2.3.7 Allowable Yield Tensile Load

9.2.3.8 Separation Analysis

9.2.3.9 Seal Analysis

10.2a Ground Support Equipment, optical stimulator

10.2b Ground Support Equipment, ESD covers

10.2c Ground Support Equipment, GSE used in Thermal Vacuum

10.2d Ground Support Equipment, GSE used in cleanrooms

10.2e Ground Support Equipment, material requirements outlined in section 7.1

10.2f Ground Support Equipment, cleanliness requirements

11 Verification Requirements

11.2 Inspection Requirements

11.2.1 Visual Inspection

11.2.2 Physical Measurement

11.2.3 Documentation Search

11.4a Test Requirements, performance parameter measurements

11.4b Test Requirements, requirements that exceed qualification test data

11.4.2 Test Factors

11.4.4.1a Failure During Tests, determination on feasibility

11.4.4.1b Failure During Tests, obtain as much information as possible

11.4.4.1c Failure During Tests, record of exceptions taken

11.4.4.2 Modification of Hardware

11.4.4.3 External Adjustment

11.4.4.4 Re-Test Requirements

11.5.3a Static Loads/Strength Test, structural design loads

11.5.3b Static Loads/Strength Test, powered during static loads tests

11.5.3c Static Loads/Strength Test, performance tests

11.5.3d Static Loads/Strength Test, functional tests

11.5.4a Sine Sweep Survey, before and after vibration testing in each axis

11.5.4b Sine Sweep Survey, immediately preceding the sine/random vibration tests

11.5.4c Sine Sweep Survey, reported frequencies

11.5.4d Sine Sweep Survey, cross-orthogonality checks

11.5.4e Sine Sweep Survey, frequencies between test and analytical modes

11.5.5a Sine Vibration, to appropriate levels and durations shown in the mechanical requirements section

11.5.5b Sine Vibration, testing configurations

11.5.6a Random Vibration in each orthogonal axis TM

11.5.6b Random Vibration, functional test before and after vibration test

11.5.7 Acoustic Test

11.5.9 Shock

11.5.10a Thermal Vacuum Bake-out, prior to delivery to NASA GSFC

11.5.10b Thermal Vacuum Bake-out, adjusted rate measured at the QCM

11.5.11.1 Thermal Vacuum Test Parameters

11.5.11.2a Thermal Vacuum Test Profile, flight configuration requirement

11.5.11.2b Thermal Vacuum Test Profile, Thermal Vacuum Test profile shown in Figure 11-1

TM

11.5.12 Thermal Balance Requirement

11.5.14.1 Continuity/Hi-Pot Tests

11.5.14.2 Harness Bake-Out

11.5.15a EMI/EMC Tests, compliance with requirements in section 8.4 TM

11.5.15b EMI/EMC Tests, RF component unique test performed per section 8.4.5

11.5.15.1 Conducted Emissions Tests

11.5.15.2 Conducted Susceptibility Tests