Wire Bonding System

Award Notice Posted

Solicitation number
HSSS01-12-Q-0107
Agency
Awarded
to Cook And Weil, Inc.
Set-aside
No set-aside

Opportunity facts

Contract number
HSSS0112P0244 Federal contract award
PSC
Not on record
Place of performance
Tulsa, Oklahoma 74104, United States

Notice details come from SAM.gov. Updated .

Notice text

Added: May 08, 2012 1:16 pm  

Wire Bonding System



  • Microprocessor controlled bonding cycle and bonding parameter(s).
  • Must support ultrasonic wedge bonding.  (does not need to support ball bonding)
  • Must not require an outside air or vacuum pressure source unless included.
  • Must support and include parts for deep access (90 degree angle) bonding.
  • Deep access height must be at least 3/8" (0.375 in.) (1/2" or more preferred)
  • Must allow manual control of all axes.
  • Must have an automatic or semi-automatic Z axis control for search height and bonding operation.
  • Must include a compatible microscope with 15x or higher magnification.
  • Must include a spot illuminator for the microscope.
  • Must have a cross-hair or similar targeting illumination for centering bonding tool over bond pad.
  • Must have at least a 3.5" throat depth (horizontal clearance between bonding head and any part of the base which crosses the plane of the work surface.) 4.5" preferred
  • Must have at least 2.5" x 2.5" of bonding area. More area would be preferable.
  • Adjustable Height Rotary Heated Workholder
  • Must include shipping to 74104 area code

    Award will be made to lowest price offeror fully meeting requirement specifications.

Files

File Type Posted
HSSS01-12-Q-0107.rtf RTF text file
12-Q-0107.pdf PDF

Notice history

Notice Type Posted
Wire Bonder System Latest Award Notice
This notice Original Award Notice

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