Wire Bonder System

Added: Jul 09, 2012 2:47 pm  

Statement of Work

Wire Bonding System

• 
  
• Microprocessor controlled bonding cycle and bonding parameter(s).
  
• Must support ultrasonic wedge bonding.  (does not need to support ball bonding)
  
• Must not require an outside air or vacuum pressure source unless included.
  
• Must support and include parts for deep access (90 degree angle) bonding.
  
• Deep access height must be at least 3/8" (0.375 in.) (1/2" or more preferred)
  
• Must allow manual control of all axes.
  
• Must have an automatic or semi-automatic Z axis control for search height and bonding operation.
  
• Must include a compatible microscope with 15x or higher magnification.
  
• Must include a spot illuminator for the microscope.
  
• Must have a cross-hair or similar targeting illumination for centering bonding tool over bond pad.
  
• Must have at least a 3.5" throat depth (horizontal clearance between bonding head and any part of the base which crosses the plane of the work surface.) 4.5" preferred
  
• Must have at least 2.5" x 2.5" of bonding area. More area would be preferable.
  
• Adjustable Height Rotary Heated Workholder
  
• Must include shipping to 74104 area code