Wafer Bonding System
Closed Pre-Solicitation Posted
This opportunity was awarded. See the award notice from .
- Solicitation number
- NB686010-18-01719
- Agency
- National Institute of Standards and Technology Department of Commerce
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- 1333ND18PNB680291 Federal contract award
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- PSC
- Not on record
- Place of performance
- U.S. Department of Commerce National Institute of Standards and Technology (Nist) 325 Broadway Boulder, Colorado 80305, United States
Notice details come from SAM.gov. Updated .
Notice text
Added: May 14, 2018 4:45 pm
Sources Sought: NB686010-18-01719
Status: Open
Item: Wafer Bonding System
Classification Code: 66-Instruments and Laboratory Equipment
Post Date: 05/14/2018
Close Date: 06/01/2018
File Name: NB686010-18-01719/ Wafer Bonding System
Contact Points: Angela Hitt, Contract Specialist (303) 497-7305, angela.hitt@nist.gov
The National Institute of Standards & Technology (NIST) seeks information on vendors that are capable of providing a Wafer Bonding System as described in the draft specifications. The purpose of this notice is to identify organizations capable of providing the necessary item and meeting the minimum contractor qualifications.
This announcement is not a Request for Proposals or Quotes (RFP/RFQ) and does not commit the Government to award a contract now or in the future. The information contained in this notice is DRAFT only and as such, is subject to change prior to issuance of a solicitation. No solicitation is available at this time.
After results of this market research are obtained and analyzed, NIST may conduct a competitive or non-competitive procurement and subsequently award a contract. NIST will use the results of this sources sought notice to determine whether to proceed on a sole source basis or competitively if it is determined that other vendors could potentially meet NIST's needs. This requirement is assigned a NAICS code of 333242 with a small business size standard of 1,500 employees.
Interested business organizations that believe they are capable of meeting the requirement should submit electronic copies of their capability statement. Please limit responses to four (4) pages or less. Responses should include the following information:
1. Name of company that will provide product.
2. Name of company that will manufacture the product.
3. Spec sheets and examples of products that meet the specifications.
4. Typical lead time to deliver the product after receipt of order.
5. Any other relevant information that is not listed above which the Government should consider in developing its minimum specifications and finalizing its market research.
Any proprietary information should be so marked. The written capability statement should be received by the Contract Specialist no later than 5 p.m. MST Friday, June 1, 2018. The capability statement shall identify the business status of the organization. No quotes will be accepted at this time and will not be considered.
Attachments
| File | Type | Posted |
|---|---|---|
| DRAFT_SPECIFICATIONS.pdf |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Notice of Intent-Wafer Bonding System | Award Notice | |
| Wafer Bonding System | Pre-Solicitation |
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