Purchase Order 1333ND18PNB680291
Award Date 8/21/18
Potential Completion Date 4/1/21
Potential Value $889K
Federal Agency
Awardee
Ultimate Awardee
Not listed NAICS Category
PSC Category
Federal Contract Vehicle
- Not listed
Set-Aside Type
No Set-Aside Used
Extent Competed
Not Competed under SAP
Major Defense Program
Not listed Pricing Type
Firm Fixed Price
Place of Performance
Tempe, AZ 85284, USA
Solicitation Procedures
Simplified Acquisition
Number Of Offers Received
1
Legislative Mandate
Not listed National Interest Action
Not listed Research Type
Not listed Primary Consortia Member
Not listed Similar Awards
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Generated 3/23/24, 4:11 AM
Name | Description | Solicitation Number | FederalAgency | Type | PostedDate |
|---|---|---|---|---|---|
Notice of Intent-Wafer Bonding System | NB686010-18-01719 | Department of Commerce National Institute of Standards and Technology | Award Notice 2/2 | 6/5/18, 2:02 PM | |
Wafer Bonding System | NB686010-18-01719 | Department of Commerce National Institute of Standards and Technology | Pre-Solicitation 1/2 | 5/14/18, 4:45 PM |
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| P19001 | Change Order | $0 | 5/1/19 | |
| Not listed | Not listed | $836.1k | 8/21/18 |