Notice of Intent-Wafer Bonding System

Posting CD-492 per FAR requirement..

The purpose of this Modification/Amendment is to add an Extended Warranty to the Specifications. All other terms and conditions remain unchanged.

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Added: Jun 14, 2018 4:15 pm

The purpose of this Modification/Amendment is to add an Extended Warranty to the Specifications. All other terms and conditions remain unchanged.

The National Institute of Standards and Technology (NIST) Acquisition Management Division, intends to negotiate with EV Group, Inc., located in Tempe, AZ, on a sole source basis under the authority of FAR Subpart 13.106-1(b), soliciting from a single source, for one (1) Wafer Bonding System.

The unique technical specification of this wafer bonding system is that it provides up to 20kN force for bonding.

The NAICS Code is 333242- Semiconductor Machinery Manufacturing, with a Size Standard of 1,500 employees. NIST anticipates negotiating and awarding a firm-fixed-price purchase order to EV Group, Inc., for this requirement.

Interested parties that can demonstrate they could satisfy the requirement listed above for NIST must clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. This notice of intent is not a solicitation. Information submitted in response to this notice will be used solely to determine whether competitive procedures could be used for this acquisition. If competitive procedures are not used it is estimated that an award will be issued by September 20, 2018. Any questions regarding this notice must be submitted in writing via email to angela.hitt@nist.gov. All responses to this notice of intent must be submitted to angela.hitt@nist.gov no later than June 26, 2018 at 3:00 p.m. MST.

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Added: Jun 05, 2018 2:02 pm The National Institute of Standards and Technology (NIST) Acquisition Management Division, intends to negotiate with EV Group, Inc., located in Tempe, AZ, on a sole source basis under the authority of FAR Subpart 13.106-1(b), soliciting from a single source, for one (1) Wafer Bonding System.

The unique technical specification of this wafer bonding system is that it provides up to 20kN force for bonding.

The NAICS Code is 333242- Semiconductor Machinery Manufacturing, with a Size Standard of 1,500 employees. NIST anticipates negotiating and awarding a firm-fixed-price purchase order to EV Group, Inc., for this requirement.

Interested parties that can demonstrate they could satisfy the requirement listed above for NIST must clearly and unambiguously identify their capability to do so in writing on or before the response date for this notice. This notice of intent is not a solicitation. Information submitted in response to this notice will be used solely to determine whether competitive procedures could be used for this acquisition. If competitive procedures are not used it is estimated that an award will be issued by September 20, 2018. Any questions regarding this notice must be submitted in writing via email to angela.hitt@nist.gov. All responses to this notice of intent must be submitted to angela.hitt@nist.gov no later than June 26, 2018 at 3:00 p.m. MST.