Wafer Bonding System
Closed Pre-Solicitation Posted
Not the latest version. See the latest solicitation from .
- Solicitation number
- N0017324RFIMB23
- Agency
-
Office of Naval Research
Secretary of the Navy, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334516 Analytical Laboratory Instrument Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Washington, District of Columbia 20375, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
Paragraph 1:
The Naval Research Laboratory (NRL), a component of the Department of the Navy, Secretary of the Navy, Office of Naval Research, is seeking industry feedback through a Request for Information (RFI) / Sources Sought Notice for a potential procurement of a Wafer Bonding System. The system must be capable of in-situ wafer alignment and bonding under ultra-high vacuum, with capabilities for 3", 4" and 6" semiconductor or glass wafers. The RFI aims to gauge industry interest and identify potential sources capable of meeting the detailed technical requirements outlined in the attached specifications document. The anticipated evaluation criteria is lowest priced technically acceptable, and responses are due by August 9, 2024.
Paragraph 2:
This procurement opportunity is not set-aside for any specific business category. No potential incumbents or current contractors are named. The RFI does not provide any information about potential award values or budget ranges. The technical specifications document indicates the system must provide capabilities such as ultra-high vacuum pumping, high compression force, precise wafer alignment, surface radical treatment, and anodic bonding, but does not specify the quantity of systems or timeline for the services.
Notice text
See attched RFI/Sources Sought and Technical Specifications
Files
| File | Type | Posted |
|---|---|---|
| RFI_Sources Sought_WaferBonding System.pdf | ||
| Wafer_Alignment_and_Bonding_System_Specifications_Document.pdf |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Wafer Bonding System | Solicitation | |
| This notice | Pre-Solicitation |
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