Wafer Bonding System
Closed Solicitation Posted
- Solicitation number
- N0017324QMB23
- Agency
- Office of Naval Research Secretary of the Navy, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334516 Analytical Laboratory Instrument Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Washington, District of Columbia 20375, United States
- Points of contact
-
- Michael Broomfield michael.h.broomfield.civ@us.navy.mil (202) 875-9785
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Navy's Office of Naval Research (ONR) is seeking to acquire a commercially available combined wafer alignment and bonding system that can physically bond two or three semiconductor or glass wafers in-situ under ultra-high vacuum. The system must handle 3", 4" and 6" wafers and provide capabilities for surface treatment, direct bonding, eutectic bonding, glass frit bonding, solder bonding, thermocompression bonding, and anodic bonding. The contractor must have experience designing, fabricating, and installing ultra-high vacuum wafer alignment and bonding systems. The equipment must be new, with a 1-year warranty on the entire system and 2-year warranty on parts. Proposals are due by September 27, 2024.
This solicitation is being conducted under full and open competition on a firm-fixed price basis. The place of performance is Washington, DC 20375, USA. The NAICS code is 334516 - Analytical Laboratory Instrument Manufacturing, and the PSC code is 6640-P - Laboratory Equipment And Supplies. There is no set-aside designation, and the current incumbent or contractor is not specified. The required delivery is within 12 months of award, but the specific quantity or budget range is not provided.
Notice text
See attached Combined Synopsis/Solicitation
Attachments
| File | Type | Posted |
|---|---|---|
| CSS N0017324QMB23_waferbondingsystem.pdf |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Wafer Bonding System | Solicitation | |
| Wafer Bonding System | Pre-Solicitation |
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