Semiconductor wafer bonding system

12/16/22 Update—Changed the Response Due Date to 12/24/2022

NASA/GSFC has a requirement to acquire a semiconductor wafer bonding system.  The system is used to bond micro-electronic chips and wafers with precision temperature, pressure, and atmosphere control and registration over the entire bond process.

The wafer bonder is an essential tool for advanced device fabrication projects under development and in production in the Detector Systems Branch at GSFC.  In particular, this equipment is critically needed for the technology development and production of sub-kelvin cryogenic detectors, MEMS optical and microfluidic sensors and actuators and optical components.   The wafer bonder is used to precisely and accurately bond silicon and/or other wafer materials (glass, GaAs, Quartz, pyrex, etc) necessary for the fabrication of devices built in the Detector Development Laboratory (DDL).  The wafer bonder will enable bonding in wafers from 100 mm to 200 mm in diameter in a single system allowing for faster throughput and larger detector focal planes than is currently achievable

NASA/GSFC intends to issue a sole source contract to acquire the items from EVG Group Inc. In accordance with 10 U.S.C. 2304(c)(1), as implemented by Federal Acquisition Regulation (FAR) 6.302-1, “Only one responsible source and no other supplies or services will satisfy agency requirements,” EVG Group Inc. is the only company capable to provide the unique qualifications and specialized skills to provide semiconductor wafer bonding system that meets all of the technical requirements in the Statement of Work (SOW).

In particular, the required pre-bond Wedge Error Correction used to remove bond force non-uniformity due to plate-to-plate parallelism errors is critical to enabling high performance next generation detectors.   Additionally, the EV Group bonder is capable of bonding wafers sizes from 100mm up to 200mm diameter in a single process tool with simple process plate configuration changes meeting requirements for tool compatibility.  Finally, the EV Group wafer bonder is the only bonder that physically fits within the length by width (1.11m x 0.9m) space requirement of the Detector Development laboratory.

The Government intends to acquire a commercial item using FAR Part 12.

Interested organizations may submit their capabilities and qualifications to perform the effort electronically via email to Alpana Jenne at Alpana.K.Jenne@nasa.gov not later than 2pm EST on December 31, 2022.  Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this acquisition on a competitive basis.  A determination by the Government not to compete this acquisition on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the Government.

NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html