Request for Information for Silicon/Germanium Epitaxial Wafers
Closed Special Notice Posted
- Solicitation number
- NB305000-26-00183
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The National Institute of Standards and Technology (NIST), under the Department of Commerce, has issued a Special Notice requesting information from industry regarding the availability and capability to provide Silicon/Germanium Epitaxial Wafers on a firm fixed-price basis. This is a market research initiative, not a formal solicitation or binding commitment from NIST. The notice seeks to gather information to help NIST determine the appropriate acquisition strategy for specialized epitaxial wafer products. The NIST CHIPS Metrology program, which develops advanced metrology capabilities for the U.S. semiconductor manufacturing ecosystem, requires high-quality epitaxial film stacks on silicon wafers to support its research objectives. The deadline for submitting responses is April 3, 2026, approximately nine days from the posting date.
The primary objective of this Special Notice is to identify qualified suppliers capable of manufacturing and delivering customized silicon and silicon-germanium epitaxial wafers with specific compositions, thicknesses, and dopant levels. Interested contractors must submit information demonstrating their capability to produce 100 mm diameter, double-side polished wafers according to NIST specifications, with baseline orders requiring delivery within 20 weeks of award. The anticipated contract includes two baseline line items for 15 wafers each with defined specifications and five optional line items allowing for flexible specifications to be determined at the time of ordering, with a minimum lot size of 10 wafers for optional items. There are no stated set-asides for small businesses or other designated groups, meaning all qualified companies regardless of size or designation may participate. This procurement falls under the Semiconductor and Related Device Manufacturing NAICS category (334413), and eligibility is open to any capable industry supplier without specific restrictions mentioned in the notice.
Notice text
This is a notice to request information from industry to help the U.S. Department of Commerce, National Institute of Standards and Technology (NIST) determine the availability and capability of businesses to provide Silicon/Germanium Epitaxial Wafers and the ability to quote at a firm fixed price.
This notice is strictly to request information for market research purposes to help NIST determine the appropriate acquisition strategy for this requirement. This notice shall not be construed as a solicitation, an obligation, or commitment by NIST.
The NIST CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas.
Silicon wafers with epitaxial layer of silicon and silicon/germanium are an essential item for modern semiconductor manufacturing. Some manufacturers perform epitaxial growths in house while other film stacks can be purchased. Wafer with specific compositions, thicknesses, and dopant levels, and supporting measurements are available at various wafer sizes and lot sizes.
CHIPS Metrology researchers at NIST require high-quality epitaxial film stacks on silicon wafers. Although we anticipate changes in the exact specifications of each wafer lot purchased, the general classes of wafer products can be well described.
The anticipated contract includes base line items with full wafer specifications. Additionally, there are optional line items where the exact specifications for lot size, layer count, thicknesses, and layer composition/doping will be specified upon ordering. These slight variations in the wafers would include changes to and including:
Wafer composition- “Thin” doped Si on Si, “Thick” doped Si on Si, Isotopically enriched 28Si on Si, “Thin” Si and SiGe layers on Si, and “Thick” SiGe on buffered Si. In addition to the wafer composition, the following configurable parameters could be adjusted: Substrate resistivity, Film stack, and lot size (minimum of 10 units each)- if exercised.
The Specifications are attached to the Request for Information. The government is seeking input from potential vendors on the requirement and the practicability of Firm-Fix pricing all of the listed line items.
The due date for response is Friday April 3rd, 1:00PM EST, 2026. Responses should be emailed directly to erik.frycklund@nist.gov
Files
| File | Type | Posted |
|---|---|---|
| Specs.pdf |
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