Next-Generation Microelectronics Manufacturing (NGMM)

The Defense Advanced Research Projects Agency is soliciting proposals through Broad Agency Announcement HR001122S0050 to inform planning for Phase 0 of the Next Generation Microelectronics Manufacturing program. Phase 0 seeks to define exemplar three-dimensional heterogeneous integrated microsystems and identify the equipment, process, and facility requirements to manufacture these microsystems at a future domestic manufacturing center. Proposals will be evaluated based on technical approach, relevance to DARPA's mission, management approach, and cost realism, and are due by October 12, 2022.

There is no set-aside designation for this opportunity. NAICS code 541712 and PSC code R425 both apply. Multiple awards totaling approximately $20 million are anticipated to define up to three exemplar microsystems and manufacturing requirements over a six-month period through February 2023. Proposals are accepted from for-profit organizations, universities, and government entities through contracts, grants, cooperative agreements or other transactions. Potential incumbents were not named.