3D Heterogeneous Integration of Phased Array and InfraRed Systems (3D HIPAIRS)
Award Notice Posted
- Solicitation number
- HR001122S0050
- Agency
-
Air Force Research Laboratory
Air Force Materiel Command, Department of Defense
- Awarded
- to HRL Laboratories, LLC
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- FA8650-23-C-7321 Federal contract award
- NAICS code
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Place of performance
- Malibu, California, United States
Notice details come from SAM.gov. Updated .
About this opportunity
This Award Notice from the Department of the Air Force Materiel Command Research Laboratory announces a cost-plus fixed fee contract valued at $2,509,538 awarded to HRL Laboratories, LLC on May 25, 2023. The contract will fund Phase 0 research for the Next Generation Microelectronics Manufacturing program to define exemplar 3D heterogeneous integration microsystems and identify equipment, process, and facility requirements for manufacturing these microsystems, informing planning for the subsequent establishment of a domestic 3D heterogeneous integration manufacturing center.
Notice text
The Next Generation Microelectronics Manufacturing (NGMM) program will establish a domes-tic center for R&D and manufacturing 3DHI (3D heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program will inform planning for the 3DHI manufacturing center by de-fining exemplar 3DHI microsystems and identifying the equipment, process, and facility require-ments for manufacturing these microsystems.
This effort was competitive. This was awarded as a cost-plus fixed fee contract due to the uncertainties in pricing this effort. In selecting the appropriate contract type, the contracting officer considered the factors in FAR 16.104.
Awarded contract FA8650-23-C-7321 to HRL Laboratories, LLC for 2509538.00 on 2023-05-25.
Notice history
| Notice | Type | Posted |
|---|---|---|
| Three-Dimensional Heterogeneous Integration for Threat Reduction, Innovation, Value and Efficiency (3DHI THRIVE) | Award Notice | |
| New Award-Teledyne Scientific and Imaging-R&D | Award Notice | |
| This notice | Award Notice | |
| Next Generation Microelectronics Manufacturing | Award Notice | |
| Next-Generation Microelectronics Manufacturing (NGMM) | Pre-Solicitation |
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