Next Generation Microelectronics Manufacturing
Awarded Award Notice Posted
- Solicitation number
- HR001122S0050
- Agency
- Air Force Research Laboratory Air Force Materiel Command, Department of Defense
- Awarded
- to Northrop Grumman Systems Corporation
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- FA8650-23-C-7320 Federal contract award
- NAICS code
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Place of performance
- Redondo Beach, California 90278, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Air Force Materiel Command Research Laboratory awarded Northrop Grumman Systems Corporation a $2,836,760 cost-plus fixed fee contract to define exemplar 3D heterogeneous integration microsystems and identify equipment, process, and facility requirements for manufacturing these microsystems to inform planning for establishing a domestic center for research, development, and manufacturing of 3D heterogeneous integration microsystems under the Next Generation Microelectronics Manufacturing program.
Notice text
The objective of the NGMM program is to establish a domestic center for R&D and manufacturing 3DHI (3D heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems.
This effort was competitive. This was awarded as a cost-plus fixed fee contract due to the uncertainties in pricing this effort. In selecting the appropriate contract type, the contracting officer considered the factors in FAR 16.104.
Awarded contract FA8650-23-C-7320 to NORTHROP GRUMMAN SYSTEMS CORPORATION for 2836760.00 on 2023-06-01.
Notice history
| Notice | Type | Posted |
|---|---|---|
| Three-Dimensional Heterogeneous Integration for Threat Reduction, Innovation, Value and Efficiency (3DHI THRIVE) | Award Notice | |
| New Award-Teledyne Scientific and Imaging-R&D | Award Notice | |
| 3D Heterogeneous Integration of Phased Array and InfraRed Systems (3D HIPAIRS) | Award Notice | |
| Next Generation Microelectronics Manufacturing | Award Notice | |
| Next-Generation Microelectronics Manufacturing (NGMM) | Pre-Solicitation |
And 1 more award notice.
On GovTribe
Work this opportunity on GovTribe
- Track it in your pipeline
- Find teaming partners
- Similar opportunities
- Ask GovTribe AI about this opportunity