Microelectronics Sourcing Capability for Tobyhanna Army Depot (RFI 2)

The U.S. Army Contracting Command is issuing a Request for Information due October 27, 2026, to identify qualified Original Component Manufacturers and Tier-1 direct distributors capable of supplying commercial-off-the-shelf, industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly integration at Tobyhanna Army Depot.

The RFI serves as market research to transition procurement from spot-market and broker-dependent models toward resilient, long-term direct relationships with primary component fabricators. The Government seeks suppliers of multilayer ceramic capacitors, precision and current sense resistors, power management integrated circuits, power MOSFETs, discrete diodes, microcontrollers, inductors, and interconnect components in volumes ranging from hundreds of thousands to multi-million units annually.

Respondents must demonstrate dedicated production line capacity, Vendor-Managed Inventory capabilities, and strict chain-of-custody traceability under ISO 9001, AS9100, or IATF 16949 quality systems. The Government requires insights into volume production capacity, minimum lead times, wafer and die allocations, packaging assurances, and transparent supply chain protocols. Procurement aligns with National Defense Authorization Act requirements, DoD Instruction 5200.50 on assured access to trusted microelectronics, and DFARS supply chain integrity and anti-counterfeiting controls.

Capability statements must be submitted in searchable PDF format not exceeding five pages to ryan.c.kinger2.civ@army.mil. The Army anticipates hosting an Industry/Vendor Day following responses to facilitate direct technical exchanges. NAICS codes 334413 and 334419; PSC codes 5961/5962. This RFI does not constitute a binding commitment to acquire products or services, and the Government will not reimburse response costs.