Attachment 1 - Request for Information Microelectronics Sourcing.docx

REQUEST FOR INFORMATION (RFI) / SOURCES SOUGHT

Agency: Department of the Army Office: Army Contracting Command (ACC) Notice Type: Request for Information (RFI) / Sources Sought Subject: High-Volume Microelectronics Sourcing: Direct Manufacturer & Tier-1 Production Supply Chains Classification Code: 5961 (Semiconductor Devices and Associated Hardware) / 5962 (Microcircuits, Electronic) NAICS Code(s): 334413 (Semiconductor and Other Electronic Component Manufacturing) / 334419 (Other Electronic Component Manufacturing)

1.0 PURPOSE AND SCOPE

The U.S. Army Contracting Command (ACC) is issuing this Request for Information (RFI) as market research to identify qualified Original Component Manufacturers (OCMs) and their Tier-1 direct distributors (directly working with manufacturer) capable of supplying commercial-off-the-shelf (COTS), industrial, and defense-grade microelectronics in sustained, large-scale production volumes for Circuit Card Assembly (CCA) integration.

The primary objective is to transition from spot-market, broker-dependent, and decentralized procurement models toward resilient, long-term, direct-tier relationships with primary component fabricators and direct suppliers. The Government seeks insights into volume production capacity, minimum lead times, wafer/die allocations, packaging assurances, and transparent chain-of-custody protocols.

Disclaimer: This RFI is published solely for information and planning purposes. It does not constitute a Request for Proposal (RFP), Invitation for Bid (IFB), or an obligation on the part of the Government to acquire any products or services. The Government will not reimburse respondents for any costs incurred in preparing responses.

2.0 BACKGROUND & STRATEGIC OBJECTIVES

Microelectronics represent mission-critical components in modern defense, communications, and munitions systems. In alignment with recent National Defense Authorization Acts (NDAA), DoD Instruction (DoDI) 5200.50 (Assured Access to Trusted Microelectronics), and DFARS 252.246-7007/7008, the Department of the Army requires verified supply chain integrity, assured traceability, and continuous volume availability. Tobyhanna Army Depot (TYAD) and Army Contracting Command (ACC) seeks to partner directly with manufacturers and primary Tier-1 distributors who possess dedicated fabrication capacity, proactive obsolescence mitigation programs, and robust anti-counterfeiting controls.

3.0 REPRESENTATIVE HIGH-VOLUME COMPONENT PROFILES

The Government requires sustained procurement of active, passive, and power-management components in production quantities ranging from hundreds of thousands to multi-million-unit annual runs.

The following table provides representative parts and form factors currently utilized across active CCA production lines. Respondents should indicate their capability to fabricate, package, or directly supply these components or drop-in Form-Fit-Function (FFF) equivalents. Listed Below are examples of materials that have been used or currently are used on the CCA line.

• CL10A226MO7JZNC

• GRM188D72A105KE01[J/D/W]

• GRM155R60J475ME47D

• GRM21BR61H106KE43L

• CL21A106KBYQNNE / GMC21X5R106K50NT

• ERJ-1GNJ303C / ERJ-1GNF3002C

• ERJ-2RKF1133X

• ERJ-2RKF1742X / RK73H1ETTP1742F

• AC0402JR-0722RL

• D1CSA2512M0M30F-T2

• MSREM2512S-0L30-F4P0

• CHSA2512R0003F

• LMR51606YDBVR

• DRV8300DRGER

• MAX4080SAUA+T

• BSZ065N06LS5ATMA1

• IAUZ40N06S5N050ATMA1

• NSR05F40NXT5G

• STM32G071GBU6

• STM32G071G8U6

• 74438356220

• SM08B-SHLS-TF

• SM08B-SRSS-TB

4.0 CORE CAPABILITY REQUIREMENTS

Respondents must address their ability to satisfy the following requirements as primary manufacturers or first-tier direct distribution partners:

Volume Manufacturing and Capacity Allocations: Demonstrated capacity to provide dedicated production line volume, maintain buffer stocks (Vendor-Managed Inventory/VMI), and accommodate rapid demand surges without multi-quarter lead-time degradation.

Chain of Custody and Traceability: Strict provenance tracing from raw silicon/wafer fab through assembly, packaging, and test, backed by Certificates of Conformance (CoC) and lot-level traceability under ISO 9001, AS9100, or IATF 16949 quality systems.

5.0 REQUESTED INFORMATION / CAPABILITY STATEMENT

Interested sources are requested to submit a capability package organized into the following sections:

Section A: Corporate Profile & Supply Tier Classification Company Name, Address, CAGE Code, and Unique Entity Identifier (UEI).

Business Size (Small/Large Business status under identified NAICS codes).

Operational classification:

Tier 1A: Original Component Manufacturer (OCM) / Integrated Device Manufacturer (IDM).

Tier 1B: Direct Authorized / Franchised Global Manufacturer Distributor.

Section B: Manufacturing Capacity & Component Availability Provide a summary of production capacity, typical standard lead times, and allocation policies for high-runner items similar to those listed in Section 3.0.

Detail domestic vs. offshore assembly, packaging, and test geographic locations.

6.0 POTENTIAL INDUSTRY / VENDOR DAY

Based on the level of interest and capabilities identified through this RFI, the Army Contracting Command anticipates hosting an Industry / Vendor Day (available in both in-person and virtual formats).

Event Purpose: Facilitate direct technical exchanges between Army engineering leads, procurement officials, and Tier-1 microelectronics manufacturers; discuss long-term demand forecasts; review standardized qualification criteria; and explore strategic supply agreements.

Participant Feedback: Within your response, please indicate:

Whether your organization is interested in attending a dedicated Vendor Day.

Preferred participation format (In-Person, Hybrid/Virtual).

7.0 SUBMISSION INSTRUCTIONS

Format: Responses must be submitted in searchable PDF format, not exceeding 5 pages (excluding cover page and product specification appendices). Standard 12-point font and 1-inch margins apply.

Proprietary Data: If proprietary information is provided, it must be clearly marked on each applicable page. The Government will handle proprietary material in accordance with applicable Federal Acquisition Regulations (FAR).

Due Date: Capability statements must be submitted no later than October 27th, 2026.

Primary Points of Contact (POC):

Technical POC: Ryan Kinger, ryan.c.kinger2.civ@army.mil