Gen-2 BPM Electronics for NSLS-II SR
Closed Pre-Solicitation Posted
- Solicitation number
- 480310
- Agency
-
Office of Science
Department of Energy
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Place of performance
- Upton, New York 11973, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of Energy Office of Science through Brookhaven National Laboratory is preparing to solicit turnkey PCB fabrication and assembly services, with responses to the Request for Information due September 22, 2026.
The scope requires fabrication and assembly of 225 pieces each of two circuit board assemblies: LT-EL-SR-EU-BPM-0614-01_REV-B (ZuDFE) and LT-EL-SR-EU-BPM-0614-11_REV-B (ZuAFE) for Gen-2 BPM Electronics supporting the NSLS-II SR facility. BNL will supply documentation and the Xilinx FPGA component; the vendor provides all personnel, labor, equipment, materials, and supplies.
Vendors must demonstrate inline Solder Paste Inspection with volume, position, and alignment verification; Pick-and-Place inspection capability for Ball Grid Array components; reflow oven capability with either vapor phase vacuum reflow or nitrogen convection reflow including temperature control and voiding minimization; and inline 3-D Automated Optical Inspection with component and solder joint verification. Vendors must identify which processes are performed in-house versus subcontracted.
A first article of 5 pieces for each assembly requires acceptance prior to full production delivery. Quality requirements per BNL-QA-101 mandate ISO 9001 certification or equivalent, Certificates of Conformance with each shipment, and NIST-traceable equipment calibration. Responses must include company capabilities, estimated lead times, budgetary pricing, and any exceptions to BSA General Terms and Conditions for Commercial Items, submitted to Marie J. Williams (mwilliams3@bnl.gov) by 0800 ET on September 22, 2026.
Notice text
Turnkey PCB Fabrication and Assembly.
*See attached RFI for statement of work and directions for obtaining project specifications/drawings.
Files
| File | Type | Posted |
|---|---|---|
| Request for Information_480310.pdf | ||
| BSA Commercial Product_TC_Rev24. April 2026.pdf | ||
| A4. QA 101.pdf |
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