Request for Information_480310.pdf

Request for Information (RFI) No. 480310

Title: Gen-2 BPM Electronics for NSLS-II SR

Please note that this is an RFI/Sources Sought notice, not a Request for Proposal, and no solicitation exists at this time.

BNL-QA-101, para 3.1.4 - Other: Refer to procurement documentation, (e.g. PO, Statement of

Work [SOW], specifications, drawings) for quality requirements

BNL-QA-101, para 4.16- Certificate of Conformance (C of C): With each shipment, per the procurement documentation, the Supplier must submit a Certificate of Conformance (C of C).

In case of drop shipment, a copy of the certificate must be submitted to the Buyer at the time of shipment. The certificate must identify the purchased item/material/equipment by PO number and quantity, include the title of and be signed by an authorized representative of the company, and must constitute a representation by the Supplier that:

A. Materials used are those which have been specified by the Buyer, and that the items delivered were produced from materials for which the Supplier has on file, reports of chemical or physical analysis, or any other equivalent evidence of conformance of such items to applicable specifications;

B. Processes used in the fabrication of items delivered were in compliance with applicable specifications included as part of the PO/contract, or Buyer-approved procedures or specifications;

C. The items as delivered comply with all applicable drawings, specifications, deviations/waivers and other requirements of the procurement documentation; and-

D. When specified, cleaning and cleanliness requirements have been completely satisfied. The C of C must reference the Supplier’s applicable cleaning procedures.

To all Potential/Interested Suppliers, Brookhaven Science Associates, LLC (herein known as

“BSA”), operator of Brookhaven National Laboratory (BNL) under a Prime Contract with the

U.S. Department of Energy (DOE), is seeking expressions of interest from firms regarding Gen-

2 BPM Electronics for NSLS-II SR:

Overview:

Turnkey PCB Fabrication/Assembly

Scope of Work:

The Contractor shall provide all personnel, labor, equipment, materials and supplies to fabricate and assemble 225 pcs of both LT-EL-SR-EU-BPM-0614-01_REV-B (ZuDFE) and LT-EL-SR-EU-BPM-0614-11_REV-B (ZuAFE) except as noted below in accordance with the specifications included herein.

• BNL NSLS II – supplies the documentation for fabrication and assembly of 225 units

• BNL NSLS II will provide the Xilinx FPGA (U9)

• The vendor will provide all personnel, labor, equipment, materials and supplies to fabricate and assemble these units (Turnkey Fabrication/Assembly)

• The vendor will be required to complete and submit a 1st article (5 pcs) for each assembly for acceptance – once accepted

• The vendor will then complete and deliver balance of order per agreed upon schedule

Questions:

Please provide information regarding your company’s capabilities and available equipment for the following PCB assembly, inspection, and reflow processes.

1. Inline Solder Paste Inspection (SPI)

Does your facility have inline Solder Paste Inspection (SPI) capability to verify solder paste deposits prior to component placement?

If yes, please describe the equipment and process used, including its capability to:

• Verify solder paste volume and/or height.

• Verify proper solder paste position and alignment.

• Identify insufficient, excessive, or misaligned solder paste deposits.

• Provide inspection data, reports, or traceability records, if available.

2. Pick-and-Place Inspection Capability

Describe your pick-and-place process for inspecting Ball Grid Array (BGA) components prior to placement on the PCB?

3. Reflow Oven Capability

Please identify the type(s) of reflow equipment currently available at your facility and describe the associated capabilities.

Specifically, indicate whether your facility has either or both of the following:

a. Vapor Phase Vacuum Reflow

• Do you have vapor phase vacuum reflow capability?

• If yes, please describe the equipment and process, including capabilities for controlling component temperature and minimizing solder voiding on leadless devices.

• Please identify any limitations related to PCB size, batch size, component type, or other processing parameters.

b. Nitrogen (N₂) Convection Reflow

• Do you have conveyorized convection reflow equipment with nitrogen (N₂) capability?

• If yes, please describe the equipment and process, including its capability to improve solder wetting and reduce oxidation.

• Please identify any limitations related to PCB size, throughput, temperature profile, nitrogen concentration, or other processing parameters.

If your facility utilizes alternative reflow technology that provides comparable or superior performance, please describe the technology and its capabilities.

4. Inline 3-D Automated Optical Inspection (AOI)

Does your facility have inline 3-D Automated Optical Inspection (AOI) capability following component placement and/or reflow?

If yes, please describe the equipment and inspection process, including its capability to:

• Verify component markings and identification.

• Verify component orientation and placement.

• Identify missing, incorrect, or misaligned components.

• Inspect solder joints and identify potential soldering defects.

• Evaluate workmanship against applicable IPC requirements or acceptance criteria.

Please identify the applicable IPC standards used for inspection and acceptance, as well as any inspection reports, images, or traceability data that can be provided.

5. Overall Capability

Please identify which of the above capabilities are performed in-house and which, if any, are subcontracted. For subcontracted processes, please briefly describe how quality control and inspection requirements are maintained.

We are open to all information you can and care to provide at this point. Please provide responses to BSA no later than September 22, 2026, at 0800 ET.

BSA prefers electronic submissions of submittals. Electronic submissions will be accepted by the following method:

• Email submissions should express your interest and describe your capabilities related to delivering this product. Emails shall be sent to Marie J. Williams, mwilliams3@bnl.gov with the

BSA RFI 480310 in the Subject Line.

We trust that the information contained herein is sufficient to permit your company to prepare a submittal outlining:

1) your capabilities

2) estimated lead times

3) budgetary pricing

4) Any exceptions you take to BSA General Terms and Conditions for Commercial

Items (see Attachment C below).

Attachments:

Attachment A: BNL-QA-101

Attachment B - BSA General Terms and Conditions for Commercial Products and Services, Rev.

24.0; (April 2026).

Attachment C- Specifications and Drawings (As files are large, please email Contract

Specialist, Marie J. Williams to obtain copies)

Should you have any questions, please contact the undersigned.

Sincerely, Marie J. Williams

Contract Specialist

Procurement & Property Management Division

Brookhaven National Laboratory

Upton, New York 11973

Email: mwilliams3@bnl.gov mailto:mwilliams3@bnl.gov