Die Bonding and Vacuum Packaging System
Closed Solicitation Posted
- Solicitation number
- N0017326QKN05
- Agency
-
Office of Naval Research
Secretary of the Navy, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 333993 Packaging Machinery Manufacturing
- PSC
- 3540 Wrapping And Packaging Machinery
- Place of performance
- District of Columbia 20375, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Office of Naval Research seeks a die bonding and vacuum reflow packaging system capable of mounting and sealing experimental semiconductor chips to chip carriers and multi-chip module assemblies, with responses due August 7, 2026. The procurement is full and open competition with no set-asides, using a Request for Quote mechanism, Firm Fixed-Price contract type, and targeting companies with 1,500 or fewer employees.
Place of performance is the Naval Research Laboratory at 4555 Overlook Avenue SW, Washington, D.C. 20375. The system must be supplied as a single integrated solution from one vendor and must include both a die bonding unit and a separate vacuum reflow furnace. The die bonding system requires a minimum 36 x 20 inch working area, placement accuracy of 5 micrometers (3s) in x and y directions, placement rate of 200 placements per hour, dual optical cameras with vision recognition software, automated epoxy dispensing, and flip-chip (180-degree) bonding capability. The vacuum reflow furnace must accommodate sample mounting plates up to 4 x 5 inches, achieve 100 milliTorr vacuum using dry pump technologies only, operate from 25°C to 450°C with 5°C accuracy, and include water-cooled jacket with nitrogen or argon gas purge for cooling. The system must support Spectrum Semiconductor Materials leadless chip carriers (LCC04442 and LCC08428 minimum) and 200 mm diameter silicon wafers. Optional capabilities include dry pump provision, 90-degree rotation, dual dispense system, pulsed heat stage for eutectic bonding, water-water chiller, formic acid delivery, residual gas analyzer, machined tooling, and up to 40 hours of process development support. Delivery is required six months after award, F.O.B. Destination Within Consignee's Premises. Technical proposals are limited to ten pages. Award goes to the lowest-price, technically acceptable offeror. NAICS 333993, PSC 3540. Questions were due seven days from the posted date of July 23.
Notice text
Please see attached combined synopsis/solicitation
Files
| File | Type | Posted |
|---|---|---|
| Q and A - CSS N0017326QKN05.pdf | ||
| CSS N0017326QKN05 Die Bonding and Packaging.pdf | ||
| Specifications - Die Bonding.pdf |
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