Q and A - CSS N0017326QKN05.pdf

CSS N0017326QKN05

Q&A

Question 1:

In review of the specification, I found no mention of the number of pick tools required and how you need the system to present material. With a multi-chip die bonder, the high point of the system is the flexibility. You can change from epoxy die attach to flip chip and back easily with a system if configured properly.

Answer 1:

As stated in the specification, the die bonder must be capable of both epoxy die attach and flip-chip bonding. NRL also requires the ability to mount samples at 90 degrees to be quoted. NRL may or may not choose to invest in this option.

Item 2.2 notes requirement for sample presentation.

Item 2.3 notes requirement for a minimum of the two listed chip carriers and need to support a variety of substrates.

Question 2:

Should the OPTIONAL items be listed within the quotation and final pricing?

Answer 2:

Yes

Question 3:

How is the input materials delivered to the system? Waffle/Gel Packs? If so, what sizes and how many of each size?

Answer 3:

Die Bonder: either waffle or GelPack are acceptable.

Question 4:

Will you require picking fromWafer Tape Frame/Ring? If so, what sizes?

Answer 4:

No

Question 5:

Does the epoxy bonding require bondline thickness control? And if so, within what accuracy?

Answer 5:

No

Question 6:

Does the Eutectic Bonding requirement also need Tool Heating or just a Pulsed Heat Stage?

If so, should the Tool Heating have Integrated Cooling?

Answer 6:

Die Bonder: Item 2.21 lists a pulsed heat stage as the only requirement for the Die Bonding system. Integrated cooling is not a requirement

Vacuum Reflow Furnace: Item 3.10, 3.11 lists the requirement for a water-cooled jacket for integrated cooling. Heating must be applied over the full 4” x 5” thermal work zone area.

Question 7:

Does the Pulsed Heat Stage require an Inert Gas environment?

Answer 7:

Die Bonder: An inert gas environment is not required.

Vacuum reflow furnace: Item 3.8 requires argon, nitrogen or helium backfill capability

Question 8:

How many tool - tool changer do you require on the system?

Answer 8:

Die Bonder: refer to Requirements 2.2 and 2.3 . Tool-tool changers must meet these requirements.

Question 9:

Does the 200 mm DIA standard thickness silicon wafer need to be heated during the process?

Answer 9:

Die Bonder: the 200 mm DIA wafer does not need to be heated.

Question 10:

Regarding the Planar repeatability spec, do you require active planarity adjustment or just calibrated planarity?

Answer 10:

Die Bonder: Calibrated planarity is acceptable.

Question 11:

We need a package/lid drawing & a bonding diagram at a minimum before we can move forward

Answer 11:

Please refer to Item 2.3 of the specification .

2.3 System tooling must support placement of a variety of substrates including leadless chip carrier packages (Spectrum Semiconductor Materials leadless chip carrier LCC04442 and LCC08428, minimum) and a 200 mm DIA standard thickness silicon wafer.

The vendor should be able to find package and lid drawings from Spectrum Semiconductor Materials.

Question 12:

We do not make a vacuum furnace. I am getting many solicitations from third parties that want to submit the XXXX machine. I don’t trust the third parties. Is there a third party that you can recommend that will combine the XXXX die bonder with someone else’s vacuum furnace?

Answer 12:

NRL will not provide advice to the vendor for any equipment we require. It would be the vendor’s responsibility.