Custom printed circuit board for use throughout AFRC Simulation Branch

NASA's Shared Services Center is procuring custom printed circuit boards for the Armstrong Flight Research Center (AFRC) Simulation Branch to support hardware upgrades of next-generation simulation computers. The solicitation requires the manufacture of 8-layer PCBs measuring 9.1 x 5.5 inches with 1-ounce finished copper weight, fabricated to IPC-6012 Class 3 standards and assembled per IPC-A-610 Class 3 standards. The procurement includes both bare PCB fabrication and full assembly using components specified in the provided Bill of Materials, with prototype units featuring white soldermask and black silkscreen while production units will have blue soldermask and yellow silkscreen. The contract will be awarded using a lowest price technically acceptable (LPTA) evaluation method, with offerors required to demonstrate they can meet all technical specifications including mandatory 250VDC HIPOT testing and flying probe tests. The quote submission deadline is September 3, 2025, at 4:00 p.m. CT, and offerors must be registered in the System for Award Management (SAM).

This procurement is set aside exclusively for small businesses under NAICS code 334418 (Printed Circuit Assembly Manufacturing). The contract calls for delivery of 5 prototype PCBs within 3 weeks of contract award, followed by 50 production PCBs to be delivered 5 weeks after NASA's final design confirmation. Manufacturing must occur at a U.S. domestic facility determined by the contractor, with all PCBs requiring certificates of conformance and test reports upon delivery. The place of performance is Edwards Air Force Base, California, and payment terms are NET 30 with FOB Destination delivery. While specific contract values are not disclosed in the available documentation, the procurement represents a time-sensitive requirement for specialized electronics manufacturing supporting NASA's simulation capabilities.