SOW.pdf
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- Attached to
- Custom printed circuit board for use throughout AFRC Simulation Branch Federal contract opportunity
- Solicitation number
- 80NSSC25909152Q
About this file
This Statement of Work (SOW) details the requirements for manufacturing printed circuit boards (PCBs) for the NASA Simulation Engineering Branch's next-generation simulation computers. The technical specifications include 8-layer PCBs with precise dimensional and fabrication requirements, such as 9.1 x 5.5 inches dimensions, 1 ounce finished copper weight, and strict compliance with IPC-6012 Class 3 standards. The contract involves producing 5 prototype PCBs within 3 weeks of contract award, with potential for a second prototype version, followed by 50 production PCBs to be delivered 5 weeks after final design confirmation.
Key technical requirements include specific soldermask and silkscreen specifications (blue for production units, white for prototypes), UL logo marking, 500VDC HIPOT testing, and adherence to multiple fabrication file standards. The PCBs must be manufactured domestically, with a PCB thickness of 0.062 inches or less, and assembled according to IPC-A-610 Class 3 assembly standards. Delivery includes prototype and production units, along with certificates of conformance and test reports, with performance to occur at a U.S. domestic facility determined by the contractor.
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Text version
STATEMENT OF WORK
1. Objective/Requirements Manufacture printed circuit boards (PCBs) for use in the Simulation Engineering
Branch for hardware upgrades of next generation of simulation computers.
Assemble PCBs per IPC-A-610 Class 3 assembly standards.
2. Characteristics, Scope, and Specs
The contractor shall perform the following duties:
Dimensions: 9.1 x 5.5 inches.
Layers: 8 Finished copper weight: 1 ounce.
Fabricate or acquire PCBs from a domestic manufacturer built in accordance with
IPC-6012, Class 3 standards. Per 6011, use supplied data files listed. PCBs shall meet the requirements of IPC-6012 Table 4-3 “Acceptance Testing and Frequency” for Class 3.
Materials used shall be laminate per IPC-2221 par 4.3; L40XXXXHX/HXAA IAW IPC-4101/24, laminated sheet, flame resistant, UL 94V-0.
All holes without dimensions are located on a modular grid of 0.0005-inch increments. All holes shall be located within 0.005-inch radius of true position in respect to datum A, datum B, datum C. Hole locations are defined by the NC DRIL data file supplied.
Layer-to-layer registration shall be within 0.007 inches diameter of true position in respect to datum A, datum B, datum C.
Finished hole size is as indicated in hole drill table.
Soldermask for the prototypes (first 5 units and any possible follow-on prototypes) that are delivered shall be white and their silkscreen shall be black.
Finish:
o Production units, quantity 50: Apply liquid photo imageable solder mask per IPC-SM-480, Class H, color blue, RGB: 11, 61, 145 or equivalent, to both sides of the PCB over bare copper. Via holes covered with solder mask must be plugged. Mask must be below flush to primary side surface. Maximum misregistration is +/-0.003 inches.
o Silkscreen shall be yellow, permanent, organic, non-conductive ink. There shall be no silkscreen on any solderable component pads.
o Prototypes units only, quantity 5: Solder mask for the prototypes (first 5 units and any possible follow-on lots) that are delivered shall be white and their silkscreen shall be black.
Process Allowances:
o Warp or twist of PCBs shall not exceed 1%.
o Conductor widths and spacing shall be within +/-0.0015 inches of supplied
Gerber data.
o Remove all burrs and break sharp edges, 0.015 inches maximum.
o 0.059 inch maximum radius on any inside corners.
Marking: UL Logo: Manufacturer’s identification/traceability and date code letter shall be rendered in etch on the bottom side of the board in accordance with IPC- 6011.
Test requirements:
o 500VDC HIPOT (high potential) test required prior to packaging.
o Quality conformal test coupons shall be maintained for all inspection lots.
Test coupons shall be in accordance with IPC-2221.
o A certificate of compliance shall be submitted with each lot.
Supplied fabrication files:
o PCB-68-Modified.apr o PCB-68-Modified.EXTREP o PCB-68-Modified.G1 o PCB-68-Modified.G2 o PCB-68-Modified.G3 o PCB-68-Modified.G4 o PCB-68-Modified.GBL o PCB-68-Modified.GBO o PCB-68-Modified.GBS o PCB-68-Modified.GKO o PCB-68-Modified.GM o PCB-68-Modified.GP1 o PCB-68-Modified.GP2 o PCB-68-Modified.GTL o PCB-68-Modified.GTO o PCB-68-Modified.GTP o PCB-68-Modified.GTS o PCB-68-Modified.REP o PCB-68-Modified-macro.APR_LIB
Production files o Cobra2-68-BOM_20250702.xlsx
PCB thickness shall be less than or equal to 0.062 inches.
Acquire parts in provided bill of materials. Layer stack legend provided for reference.
Assemble PCB in accordance with IPC-A-610 Class 3 assembly standards.
3. Deliverables and Schedule
Description Quantity Unit Delivery Date Prototype PCB 5 Each 3 weeks from contract award Cert. of Conform. 1 Each Delivered with prototypes Test reports 1 Each Delivered with prototypes Prototype PCB vs2 (if needed)
5 Each 3 weeks from receipt of revised design from NASA
Cert. of Conform.
for PCB vs2
1 Each Delivered with prototypes
Test reports for PCB vs2
1 Each Delivered with prototypes
Production PCB 50 Each 5 weeks from confirmation of final design from NASA
Cert. of Conform. 1 Each Delivered with production units Test reports 1 Each Delivered with production units
4. Place of Performance U.S. domestic facility as determined by the contractor.
5. Period of Performance Items must be delivered by dates specified in the table in section 3.
File details come from the government source that posted it. Updated .