Custom Multi-layer Chips

The Department of Energy Office of Science, through Brookhaven National Laboratory, is procuring custom multi-layer chips for use at NSLS-II beamlines under RFQ 467991. The procurement involves highly specialized X-ray multilayer chips with precise technical specifications including lateral critical dimensions of 95 nm or smaller, line roughness less than 5 nm, and overlay accuracy of less than 15 nm. The chips must be fabricated on 200 um thick silicon substrates with die sizes of 15mm x 25mm, featuring multiple layers of SiO2, Ruthenium, and Tungsten materials. Vendors must be registered in the System for Award Management (SAM) and provide comprehensive documentation including scanning electron microscope images to verify specifications. Questions are due by August 14, 2025 at 5 pm EST, with quotations due by August 22, 2025 at 5 pm EST. The award will be made to the responsive and responsible offeror submitting the lowest total price that meets all technical requirements.

This procurement has no set-aside designation and is open to all qualifying vendors in the semiconductor manufacturing industry under NAICS code 334413. No specific contract value or budget range is disclosed in the solicitation documents, with pricing listed as "to be determined" in the draft contract. The contract requires delivery of 24 dies per wafer within 30 days of contract award, with a target delivery date of August 29, 2025. Performance will occur at Brookhaven National Laboratory in Upton, NY, with specific delivery hours between 8:00 am to 11:45 am and 12:30 pm to 4:00 pm EST, Monday through Friday. The contract includes a 12-month guarantee period during which the vendor must be prepared to replace or exchange defective items, and all deliverables must meet stringent quality assurance requirements under BNL-QA-101 standards.