Combined Synopsis/Solicitation: X-ray Photoelectron Spectroscopy (XPS) System with additional tools

The National Institute of Standards and Technology (NIST) is procuring an advanced X-ray Photoelectron Spectroscopy (XPS) System with additional tools to support the CHIPS Metrology Program through solicitation number 1333ND25QNB030154. The system must include an Ultra High Vacuum analysis chamber with specific technical capabilities, including imaging XPS with spatial resolution under 100 micrometers, Hard X-ray Photoelectron Spectroscopy capabilities with a photon source of at least 5.4 keV, and base pressure specifications below 2 x 10-7 Pa. The procurement encompasses delivery, installation, validation, staff training, commercial warranty, and maintenance services for this sophisticated analytical instrument designed to enhance semiconductor research capabilities. NIST will evaluate quotations on a best-value basis, with technical capability and demonstrated experience weighted significantly more than price. The solicitation was posted on June 5, 2025, with quotations due by June 23, 2025, and an amendment issued on June 13, 2025, addressing vendor questions about tariff considerations and specimen holder usage.

This procurement does not utilize any set-aside designations and is open to all qualified vendors in the Analytical Laboratory Instrument Manufacturing sector under NAICS code 334516, with a small business size standard of 1,000 employees. No incumbent contractors or potential award values are specified in the available documentation, though vendors must address potential tariff costs through separate line items with Not-To-Exceed amounts based on country of origin and applicable tariff percentages. The system includes three large specimen holders with 60mm diameter specifications, though only one will be used in the analysis chamber at a time, with additional holders intended for sample preparation and transfer between laboratory vessels. Performance will take place in Gaithersburg, Maryland, where the XPS system will support critical research into semiconductor materials, including surface composition analysis and buried interface evaluation up to 30 nanometers deep. Vendors must submit electronic quotations divided into four volumes covering technical capability, demonstrated experience, pricing, and terms and conditions, with mandatory SAM registration required for all offerors.