Automated Flip-Chip Die Bonder

The National Institute of Standards and Technology within the Department of Commerce is soliciting proposals under solicitation number NIST-SS24-CHIPS-0021 for an automated flip-chip die bonder. The agency requires a fully automated flip-chip die bonder capable of precision placement and bonding of silicon dies to substrates with throughput of at least 100 placements per hour, placement accuracy of less than 5 microns, and ability to perform solder bump, solder paste, and adhesive die bonding. Proposals are sought under this pre-solicitation notice to gather market research, with the agency anticipating releasing a full solicitation in the coming months. Interested parties should review the attached file for additional specifications and details.

There is no set-aside designation for this procurement. The anticipated NAICS code is 334516, and PSC code is J063. Proposals are due by March 13, 2024. The agency did not provide budget ranges or current contractors. Key details in the attachment include the integrated vision system requirements and bonding capabilities of the desired machine.