Automated High Placement Accuracy Flip-Chip Die Bonder
Award Notice Posted
- Solicitation number
- 1333ND25PNB030043
- Agency
-
National Institute of Standards and Technology
Department of Commerce
- Awarded
- to Finetech
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- 1333ND25PNB030043 Federal contract award
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- 6640 Laboratory Equipment And Supplies
- Place of performance
- Gaithersburg, Maryland 20899, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of Commerce National Institute of Standards and Technology (NIST) has awarded a contract (Number 1333ND25PNB030043) to FINETECH, a contractor based in Mesa, Arizona, for an Automated High Placement Accuracy Flip-Chip Die Bonder. The contract, which was awarded on January 29, 2025, has a total value of $643,110.00 and was not subject to any specific set-aside restrictions. This award represents a procurement for specialized technical equipment, likely supporting NIST's ongoing research and technology development initiatives in precision manufacturing or electronics engineering.
Notice text
Contract Award Number 1333ND25PNB030043 was made to the following:
- Contractor Awarded Name: FINETECH
- Contractor Awarded Unique Entity ID: DL8LPYERW429
- Contractor Awarded Address: Mesa, AZ 85210 USA
- Base and All Options Value (Total Contract Value): $643,110.00
Awarded contract 1333ND25PNB030043 to FINETECH for 643110.00 on 2025-01-29.
Notice history
| Notice | Type | Posted |
|---|---|---|
| This notice | Award Notice | |
| Automated High Placement Accuracy Flip-Chip Die Bonder | Solicitation | |
| Automated Flip-Chip Die Bonder | Pre-Solicitation |
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