SSN Automated Die Bonder.pdf

NIST-SS24-CHIPS-0021

6640 / 334413

Primary POC: Jenna Bortner (jenna.bortner@nist.gov) Secondary POC: Tracy Retterer (tracy.retterer@nist.gov)

Title: Automated Flip-Chip Die Bonder

BACKGROUND

NIST is seeking information from sources that may be capable of providing a commercial Flip-chip die bonder that meets or exceeds the following draft minimum specifications:

1. MECHANICAL

a. The automatic die bonder system shall be constructed of materials compatible with an ISO 14644 class 5 (FED 209 class 100) cleanroom.

b. The footprint of the main system shall be less than 5 feet by 6 feet. This footprint does not need to include auxiliary components such as chillers.

c. The height of the main system shall be less than 7 feet 6 inches tall.

d. Bonding shall take place in an enclosed, protected environment with an automated access door, to isolate the user and external environment from the process area. The enclosure shall support a clean inner environment with a laminar flow. A clean environment is necessary to minimize bond failure due to particle contamination of the substrates prior to contact.

2. STAGES and TRANSPORT

a. The automatic die bonder system shall have an upper vacuum chuck that can accommodate tooling to a size of 20 mm by 20 mm or more.

b. The automatic die bonder system shall have a lower vacuum chuck that can accommodate tooling to a size of at least 50 mm by 50 mm or more.

c. The lower stage shall be supported by air bearings on a granite reference surface for high positioning accuracy.

d. The substrate stage travel shall be at least 100 mm and above in both the x and y directions with steps down to at least 0.1 microns.

e. The substrate stage shall allow for an angular adjustment range greater than or equal to +/- 5 degrees.

3. DIE and SUBSTRATE DIMENSIONS

a. The automatic die bonder shall be capable of bonding dies with a minimum size of 2 mm x 2 mm or less, and maximum size of 10 mm x 10 mm or more.

b. The automatic die bonder shall be capable of bonding dies with a minimum thickness of 200 microns or less, and maximum thickness of 500 microns or more.

c. The automatic die bonder shall be capable of bonding onto substrates with a minimum size of 10 mm x 10 mm or less, and maximum size of 100 mm x 100 mm or more.

d. The automatic die bonder shall be capable of bonding onto substrates with a minimum thickness of 200 microns or less, and maximum thickness of 500 microns or more.

4. DIE TRAY CAPACITY

a. The loading area of the automatic die bonder system shall be able to accommodate H44 (4 inch by 4 inch) format die trays.

b. The loading area of the automatic die bonder system shall be able to accommodate H20 (2 inch by 2 inch) format die trays.

5. CHUCK TOOLING

a. For chuck tooling, materials with a low coefficient of thermal expansion shall be used to closely match silicon.

1. CHIP AND SUBSTRATE HEATING

a. The automatic die bonder system shall be capable of providing bonding head stage heating up to at least 350 degrees Celsius independently, with a resolution of 1 degree Celsius or better.

b. The bonding head heating shall be fast with an average heating rate of 20 degrees Celsius per second or higher and an average cooling rate of 1 degree Celsius per second or higher over the entire temperature range.

c. The automatic die bonder system shall be capable of providing substrate chuck heating of 200 degrees Celsius or higher independently for bonding substrates up to 100 mm by 100 mm, with a resolution of 1 degree Celsius or less, and uniformity of 5 degrees Celsius or less.

d. The substrate chuck shall allow an average heating rate of 2 degrees Celsius per second or better and an average cooling rate of 1 degree Celsius per second or better over the entire temperature range.

2. ALIGNMENT CAPABILITY

a. The automatic die bonder system shall be capable of performing alignment between the chip and the bottom substrate in manual and automatic modes with an integrated, automated alignment microscope with digital camera image capture.

b. The microscope system shall be capable of acquiring images with objective magnification of 10 x or higher, for an equivalent pixel resolution of less than or equal to 0.5 microns per pixel during alignment.

c. For sample illumination, the microscope shall offer individually operable light sources producing light centered at red, green and blue wavelengths in the visible spectrum, to allow for the best imaging contrast to be achieved during alignment for the widest range of device types.

d. The imaging field of view for alignment shall be of 500 microns x 500 microns or greater.

e. The alignment microscope travel shall be greater than or equal to 100 mm x 100 mm.

f. The alignment accuracy shall be of less than or equal to +/- 500 nanometers, based on repeated measurements of automatically placed dies on a substrate with alignment marks.

High alignment accuracy is required because of hybrid bonding and advanced microelectronic and photonic device integration experiments and fabrication runs that are anticipated.

g. The automatic die bonder system shall be capable of face-up alignment in addition to standard, face-down alignment. The alignment accuracy for face-up alignment shall be of 5 microns or less.

3. LEVELING CAPABILITY

a. The automatic die bonder system shall offer the ability to level the bond head and the substrate chuck prior to bonding, either manually or automatically.

b. Physical contact between the die and the substrate is not allowable before bonding.

4. BONDING CAPABILITY

a. The automatic die bonder system shall be capable of providing a minimum bonding force of at most 0.1 Newtons.

b. The automatic die bonder system shall be capable of providing a maximum bonding force of 2 Newtons or more.

c. The automatic die bonder shall be capable of reading the applied force within the full offered operating range, with an uncertainty of 2 % or less of the full scale. For example, if the offered force range is between 0.2 N and 10 N, the force readout uncertainty shall be of +/- 0.1 N or less. Better consideration will be given to systems that offer lower measurement uncertainties. Low measurement uncertainty is important to ensure good comparability between samples and experimental runs.

5. PROCESS RECORDING

a. The tool control software shall allow recording of various measured parameters over time during bonding, with a sampling interval to be specified by the user.

b. At a minimum, the following parameters shall be recorded: temperatures of substrate chuck and bond head, bond head z-position and applied force.

c. The system shall allow all logged data to be exported to CSV-based ASCII format.

6. AUTOMATIC OPERATION AND CALIBRATION

a. The system software shall provide a Graphical User Interface (GUI) that:

i) Allows full control of all the automated flip chip die bonder’s functions.

ii) Displays the overall state of the tool and its subcomponents.

iii) Allows microscope imaging of the substrate and chip.

iv) Displays bond parameters such as applied force and temperature as a function of time in real-time during operation.

v) Offers multiple levels of access, for instance, general operator user and system administrator.

vi) Allows the operator to change the state of the tool, for instance: loading and unloading, calibration and operation modes; and selecting and running process recipes.

vii) Runs Windows 10 or newer OS with a USB-based keyboard and mouse.

viii) Allows for manual, automatic and semi-automatic die bonding to be performed.

ix) Allows full automatic calibration of the machine to be performed.

b. The control software shall be able to perform automatic die-to-substrate alignment based on a wide range of alignment mark types. Better consideration will be given to software with alignment based on machine vision techniques, which are known to work for wide-ranging user-provided alignment patterns. Such capability is important to allow high bonding accuracy to be achieved for the widest possible range of device types.

7. INTERLOCKING CAPABILITY

a. The system shall include all appropriate interlocks to ensure safe operation and to keep

NanoFab user community safe.

b. The automated die bonder system shall have inputs that NIST can connect to, which prevents software, recipe, and processing operations. NIST uses an equipment control system that only allows trained users access to equipment. The connection to the automated die bonder system will be a relay closure which takes a DC voltage from the system and switches it on and off at automated die bonder input. This input shall prevent recipe starts and cause an abort condition if disabled during a run.

HOW TO RESPOND TO THIS NOTICE

In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORRMATION.

Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response: Submit the response by email to the Primary Point of Contact and, if specified, to the Secondary Point of Contact specialist listed at the bottom of this notice as soon as possible, and preferably before the closing date and time of this notice.

• Provide the complete name of your company, address, name of contact for follow-up questions, their email, their phone number and, if your company has an active registration in https://sam.gov, your company’s Unique Entity ID (UEI).

• Identify laboratory equipment that your company sells that is of the nature addressed in the BACKGROUND section of this notice. Include brand name, make, model, and/or other distinguishing information.

• State if your company is the manufacturer of the identified equipment or is a retailer or wholesaler that normally sells the identified equipment. If the latter, indicate whether the manufacturer authorized in writing for your company to sell the identified equipment on behalf of the manufacturer.

• Describe performance capabilities and relevant or beneficial physical and functional features for any equipment you identified to satisfy the NIST-identified minimum specifications described in this notice.

• Identify any aspects of the NIST market research notice, including instructions, and draft minimum specifications in the BACKGROUND section above that could be viewed as unduly restrictive or contain unnecessary barriers that adversely affect your ability to fully https://sam.gov/ participate and indicate why. In such a scenario, please offer suggestions for how the market research notice and draft minimum specifications could be made more inclusive and competitive.

• Discuss whether the equipment that your company sells and which you describe in your response to this notice may be customized to specifications and indicate any limits to customization.

• For the NAICS code listed in this notice:

o Indicate whether your company is (a) a small business or (b) other than small business. See the Table of Small Business Size Standards and the associated .pdf download file for small business size standards and additional information.

o If you believe the NAICS code listed in this notice is not the best NAICS code for the type of product addressed in this notice, identify an alternative NAICS code that you believe would be more appropriate for the planned procurement.

• Describe services that are available with the purchase of the aforementioned equipment from your company such as installation, training, and equipment maintenance.

• Describe standard terms and conditions of sale offered by your company for the aforementioned equipment such as: delivery time after your company accepts the order;

FOB shipping terms: manufacturer warranty (including details regarding nature and duration); if available, description(s) of available extended warranty; equipment setup and test; operator and service instruction manual(s); cleanup after installation; and if applicable, other offered services. Provide a copy of manufacturer standard terms and conditions that typically relate to the sale of the specified equipment, if available.

• State whether your company offers facility renovation services related to installation of the aforementioned equipment at its delivery destination, if required per the NIST-identified minimum specifications, and provide description of services. Indicate if your company performs the facility renovation services or typically subcontracts the work to another company. Indicate if your company would be interested inspecting the intended installation site during the market research phase.

• State published price, discount or rebate arrangements for aforementioned equipment and/or provide link to access company’s published prices for equipment and services.

• State whether the aforementioned equipment is manufactured in the United States and, if not, state the name of the country where the equipment is manufactured.

• Identify any plans/possibilities for changes in manufacturing location of the aforementioned equipment and provide relevant details.

• If the aforementioned equipment and related services are available for purchase on any existing Federal Supply Schedule contract(s) or other contracts against which NIST may be able place orders, identify the contract number(s) and other relevant information.

https://www.sba.gov/document/support-table-size-standards

• Identify any customers in the public or private sectors in which you provided the aforementioned or similar equipment. Include customer(s) information: company name, phone number, point of contact, email address.

• Provide any other information that you believe would be valuable for NIST to know as part of its market research for this requirement.

• State if you require NIST to provide additional information to improve your understanding of the government’s requirement and/or would like to meet with NIST representatives to discuss the requirement and the capabilities of the identified equipment.

QUESTIONS REGARDING THIS NOTICE

Questions regarding this notice may be submitted via email to the Primary Point of Contact and the Secondary Point of Contact listed in this notice. Questions should be submitted so that they are received by 11:00 a.m. Eastern Time on March 6, 2024. Questions will be anonymized and answered via sources sought notice amendment following the question submission deadline.

IMPORTANT NOTES

The information received in response to this notice will be reviewed and considered so that NIST may appropriately solicit for its requirements in the near future.

This notice should not be construed as a commitment by NIST to issue a solicitation or ultimately award a contract.

Responses will not be considered as proposals or quotations.

No award will be made as a result of this notice.

NIST is not responsible for any costs incurred by the respondents to this notice.

NIST reserves the right to use information provided by respondents for any purpose deemed necessary and appropriate.

Thank you for taking the time to submit a response to this request!